Telink Module TLSR825XML32D User Manual
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1Product Introduction
This is a user manual for Telink Module TLSR825XML32D.
1.1 General description
The TLSR825XML32D, which is based on Telink TLSR825XF512ET32
chip, provides a BLE wireless system.
The TLSR825XML32D integrates a power-balanced 32-bit MCU, BLE, 64kB
SRAM, 512kB internal Flash, 14bit ADC with PGA, analog and digital microphone
input, stereo audio output, 6-channel PWM, one quadrature decoder (QDEC),
abundant and flexible GPIO interfaces, and nearly all the peripherals needed for IoT
(Internet of Things) and HID (Human Interface Devices) application development
(e.g. Bluetooth Low Energy).
The TLSR825XML32D supports standards and industrial alliance specifications
including Bluetooth Low Energy (up to Bluetooth 5).
Telink TLSR825XML32D board can be used for SDK development. Firmware can
be directly downloaded to the TLSR825XML32D board to be up and running.
1.2 Key features
Bluetooth 5 Compliant, 1Mbps, 2Mbps, Long Range 125kbps and 500kbps
64kB on-chip SRAM with up to up to 32kB retention
512kB internal Flash
A rich set of I/Os: SPI, I2C, Single wire, up to 17 GPIOs, UART with hardware flow
control and 7816 protocol support, DMIC (Digital Mic), AMIC (Analog Mic), I2S,
