D
De
el
la
ay
yl
li
in
ne
e
D
De
et
te
ec
ct
to
or
r
D
DL
LD
D
8
80
08
80
0
6
6.1 Delayline Detector - Vacuum Wiring ............................................................................................................................... 21
6.2 Delayline Detector – Connection Ports ......................................................................................................................... 22
7Pulse Processing Electronics ....................................................................................................................................................... 24
7.1 Pulse Processing Electronics ACU 3.4.2...................................................................................................................... 24
7.1.1 Positions of the Discriminator Threshold Regulators ................................................................................... 25
8Time-to-Digital-Converter (TDC) ................................................................................................................................................... 26
8.1 Schematic Description of the USB2.0-TDC ................................................................................................................. 26
8.2 Basic Operation Modes of the GPX TDC Chip............................................................................................................. 27
8.2.1 I-Mode (USB2.0-TDC/ Double USB2.0-TDC ) ................................................................................................... 27
8.2.2 R-Mode (High Resolution/ Dual Channel/ Quad Channel USB2.0-TDC) ............................................. 27
8.2.3 G-Mode (High Resolution/ Dual Channel/ Quad Channel USB2.0-TDC) ............................................. 27
8.3 Layout of the Quad Channel USB2.0-TDC..................................................................................................................... 28
8.3.1 TDC Inputs (Stop + Start)........................................................................................................................................... 28
8.3.2 Trigger Synchronization IN/OUT ............................................................................................................................ 28
8.3.3 Line Input ........................................................................................................................................................................... 29
8.4 Interface (PC) and Software................................................................................................................................................ 29
9Dual HV Supply............................................................................................................................................................................. 30
9.1 Layout of Dual HV Supply & the HV filterbox................................................................................................................ 31
9.1.1 Line Input of Dual HV Supply ..................................................................................................................................... 32
9.2 Connection schemes for different operation modes............................................................................................... 32
10 Operation of the DLD................................................................................................................................................................... 36
10.1 Getting Started .................................................................................................................................................................... 36
10.2 Turning on the High Voltage........................................................................................................................................... 36
10.2.1 “Start-Up” Procedure (for new systems and for systems, after being vented)............................. 37
10.2.2 Standard Start Procedure.................................................................................................................................... 38
10.3 Bake Out Procedure .......................................................................................................................................................... 39
11 Microchannel Plate (MCP)........................................................................................................................................................ 40
11.1 Storage.................................................................................................................................................................................... 40
11.2 Handling .................................................................................................................................................................................. 40
