SMSC LPC47M997 Manuel utilisateur

SMSC LPC47M997 Page 1 Rev. 01-12-07

PRODUCT PREVIEW

LPC47M997

LPC Super I/O with

Hardware Monitoring

Block

Data Brief

Product Features

3.3 Volt Operation (SIO Block is 5 Volt Tolerant)

LPC Interface

ACPI 1.0/2.0 Compliant

Fan Control

−Fan Speed Control Outputs (2)

−Fan Tachometer Inputs (2)

Programmable Wake-up Event Interface

PC98, PC99, PC01 Compliant

Dual Game Port Interface

MPU-401 MIDI Support

General Purpose Input/Output Pins (37)

ISA Plug-and-Play Compatible Register Set

Intelligent Auto Power Management

System Management Interrupt

2.88MB Super I/O Floppy Disk Controller

−Licensed CMOS 765B Floppy Disk Controller

−Software and Register Compatible with SMSC's

Proprietary 82077AA Compatible Core

−Supports Two Floppy Drives

−Configurable Open Drain/Push-Pull Output Drivers

−Supports Vertical Recording Format

−16-Byte Data FIFO

−100% IBM Compatibility

−Detects All Overrun and Underrun Conditions

Sophisticated Power Control Circuitry (PCC)

Including Multiple Powerdown Modes for

Reduced Power Consumption

−DMA Enable Logic

−Data Rate and Drive Control Registers

−480 Address, Up to 15 IRQ and Three DMA Options

Enhanced Digital Data Separator

−2 Mbps, 1 Mbps, 500 Kbps, 300 Kbps, 250 Kbps

Data Rates

−Programmable Precompensation Modes

Keyboard Controller

−8042 Software Compatible

−8 Bit Microcomputer

−2k Bytes of Program ROM

−256 Bytes of Data RAM

−Four Open Drain Outputs Dedicated for

Keyboard/Mouse Interface

−Asynchronous Access to Two Data Registers and

One Status Register

−Supports Interrupt and Polling Access

−8 Bit Counter Timer

−Port 92 Support

−Fast Gate A20 and KRESET Outputs

Serial Ports

−Two Full Function Serial Ports

−High Speed 16C550A Compatible UARTs with

Send/Receive 16-Byte FIFOs

−Supports 230k and 460k Baud

−Programmable Baud Rate Generator

−Modem Control Circuitry

−480 Address and 15 IRQ Options

Infrared Port

−Multiprotocol Infrared Interface

−IrDA 1.0 Compliant

−SHARP ASK IR

−480 Addresses, Up to 15 IRQ

Multi-Mode Parallel Port with ChiProtect

Standard Mode IBM PC/XT, PC/AT, and PS/2

Compatible Bi-directional Parallel Port

−Enhanced Parallel Port (EPP) Compatible - EPP 1.7

and EPP 1.9 (IEEE 1284 Compliant)

−IEEE 1284 Compliant Enhanced Capabilities Port

(ECP)

−ChiProtect Circuitry for Protection

−960 Address, Up to 15 IRQ and Three DMA Options

Rev. 01-12-07 Page 2 SMSC LPC47M997

PRODUCT PREVIEW

LPC Interface

−Multiplexed Command, Address and Data Bus

−Serial IRQ Interface Compatible with Serialized IRQ

Support for PCI Systems

−PME Interface

Hardware Monitor

−Monitor Power supplies (+2.5V, +3.3V, +5V, +12V,

+1.8V, +1.5V, Vccp (processor voltage), and VCC or

HVSB)

−Remote Thermal Diode Sensing for Two External

Temperature Measurements

−Internal Ambient Temperature Measurement

−Limit Comparison of all Monitored Values

−System Management Bus (SMBus) Interface

−THERM# Pin for out-of-limit Temperature or Voltage

Indication

−RESET# Pin for generating 20msec Low Reset

Pulse

−Configurable offset for internal or external

temperature channels

Phoenix Keyboard BIOS ROM

128 Pin QFP, lead-free RoHS compliant

package, 3.2mm footprint

ORDERING INFORMATION

Order Number:

LPC47M997-NW for 128 pin, QFP lead-free RoHS compliant package

SMSC LPC47M997 Page 3 Rev. 01-12-07

PRODUCT PREVIEW

80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123

Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete

information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no

responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without

notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information

does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of

SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's

standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or

errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon

request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure

could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC

and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms

of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered trademark of Standard Microsystems

Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.

SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES

OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND

ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY

DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR

REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC

OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO

HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH

DAMAGES.

Rev. 01-12-07 Page 4 SMSC LPC47M997

PRODUCT PREVIEW

Block Diagram

FAN2*

J1X, J1Y*

IRTX2*

IRRX2*

LPC47M997

(128 QFP)

DIGITAL DATA

SEPARATOR

WITH WRITE

PRECOM-

PENSATION

SMC PROPRIETARY

82077 COMPATIBLE

VERTICAL

FLOPPYDISK

CONTROLLER CORE

WDATA

WCLOCK

RCLOCK

RDATA

Game Port Fan Control2nd Infrared Port

Multi-Mode

Parallel Port

with

ChiProtectTM/

FDC MUX

(see LPC47B27x)

PD[7,0]

Busy, Slct, PE,

ERROR, ACK

STROBE, INIT, SLCTIN,

ALF

FAN_TACH2*

FAN_TACH1*

FAN1*

J2B1, J2B2*

J1B1, J1B2*

J2X, J2Y*

LEDs

LED2*

LED1*

Internal Bus

(Data, Address, and Control lines)

High-Speed

16550A

UART

PORT 1

TXD1, RXD1

DSR1, DTR1

DCD1, RI1

CTS1, RTS1

MPU-401

Serial Port MIDI_OUT*

MIDI_IN*

Keyboard/Mouse

8042

controller

KCLK, MCLK

KDATA, MDATA

GateA20*

KRESET*

P12*, P16*, P17*

High-Speed

16550A

UART

PORT 2

TXD2 (IRTX)*,

RXD2 (IRRX)*

DSR2*, DTR2*

DCD2*, RI2*

CTS2*, RTS2 *

Power Mgmt

IO_PME*

IO_SMI*

General

Purpose

I/O

GP1[0:7]*

GP2[0:2,4:7]*

GP3[0:7]*, GP4[0:3]*

GP5[0:7]*, GP6[0:1]*

RDATA, WDATA

DIR, STEP,

DSKCHG, DS0, DS1*

MTR0, MTR1*,TRK0,

INDEX, WRTPRT

DRVDEN0*, DRVDEN1*

WGATE, HDSEL

Note 1: This diagram does not show power and ground

connections.

Note 2: Functions with "*" are located on multifunctional pins.

This diagram is designed to show the various functions

available on the chip (not pin layout).

Hardware

Monitoring

SMBus

CLOCK

GEN

CLK32

CLOCKI

LAD[3:0]

LFrame

LDRQ

PCI_RESET

LPCPD

SER_IRQ

PCI_CLK

LPC

Bus Interface

SERIAL

IRQ

A0/RESET#/THERM#/

XNOR_OUT

Vccp_IN

+3.3V_IN

+2.5V_IN

SDA

SCL

VID0

VID1

VID2

VID3

12V_IN/VID4

+5V_IN

HVSS

HVCC

+1.8V_IN

+1.5V_IN

D1+

D1-

D0+

D0-

Figure 1 - LPC47M997 Block Diagram

SMSC LPC47M997 Page 5 Rev. 01-12-07

PRODUCT PREVIEW

Package Outline

Figure 2 - 128 PIN QFP Package Outline, 14x20x2.7 Body, 3.2 mm Footprint

Table 1 - 128 PIN QFP Package Parameters

MIN NOMINAL MAX REMARKS

~ ~ 3.4 Overall Package Height

A1 0.05 ~ 0.5 Standoff

A2 2.55 ~ 3.05 Bod

Thickness

D 23.00 23.20 23.40 X Span

D1 19.90 20.00 20.10 X bod

Size

E 17.00 17.20 17.40 Y Span

E1 13.90 14.00 14.10 Y bod

Size

H 0.09 ~ 0.20 Lead Frame Thickness

L 0.73 0.88 1.03 Lead Foot Len

L1 ~ 1.60 ~ Lead Len

e 0.50 Basic Lead Pitch

θ 0o~ 7oLead Foot Angle

W 0.10 ~ 0.30 Lead Width

R1 0.08 ~ ~ Lead Shoulder Radius

R2 0.08 ~ 0.30 Lead Foot Radius

ccc ~ ~ 0.08 Coplanarit

Notes:

1. Controlling Unit: millimeter.

2. Tolerance on the position of the leads is ± 0.04 mm maximum.

3. Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm.

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

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