Seco Qseven QUADMO747-E6 Series Manuel utilisateur

QUADMO747-E6xx

Qseven®Rel. 1.20 Compliant Module with Intel®Atom™E6xx series CPU

QUADMO747-E6xx

User Manual

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 2

REVISION HISTORY

Revision

Date

Note

Rif.

1.0

27th December 2011

First official release

1.1

14th September 2012

BIOS section updated

1.2

19th November 2012

BIOS section updated; board’s pictures updated

material of SECO S.r.l.

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any

means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual, however, SECO s.r.l. accepts

no responsibility for any inaccuracies, errors or omissions herein. SECO s.r.l. reserves the right to

change precise specifications without prior notice to supply the best product possible.

For further information as regards this module or other SECO products please visit our websites at

http://www.seco.com and http://www.secoqseven.com.

Moreover in order to have the proper assistance for any possible issue please complete your

registration online on our specific website for Qseven®modules (http://www.secoqseven.com).

Our team will be pleased and ready to assist you.

SECO Srl - Via Calamandrei 91

52100 Arezzo –ITALY

Ph: +39 0575 26979 - Fax: +39 0575 350210

http://www.seco.com

http://www.secoqseven.com

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 3

INDEX

CHAPTER 1. INTRODUCTION ...................................................................................................5

1.1 WARRANTY............................................................................................................................................ 6

1.2 INFORMATION AND ASSISTANCE .............................................................................................................. 7

1.3 RMA NUMBER REQUEST......................................................................................................................... 7

1.4 SAFETY ................................................................................................................................................. 8

1.5 ELECTROSTATIC DISCHARGES ................................................................................................................ 8

1.6 ROHS COMPLIANCE ............................................................................................................................... 8

CHAPTER 2. OVERVIEW ...........................................................................................................9

2.1 INTRODUCTION..................................................................................................................................... 10

2.2 TECHNICAL SPECIFICATIONS................................................................................................................. 11

2.3 ELECTRICAL SPECIFICATIONS................................................................................................................ 12

2.4 MECHANICAL SPECIFICATIONS .............................................................................................................. 12

2.5 BLOCK DIAGRAM .................................................................................................................................. 13

CHAPTER 3. CONNECTORS...................................................................................................14

3.1 CONNECTORS OVERVIEW ..................................................................................................................... 15

3.2 CONNECTORS DESCRIPTION ................................................................................................................. 16

3.2.1 Qseven®Connector..................................................................................................................... 16

3.2.2 Optional signals ........................................................................................................................... 18

3.2.3 Specific signals............................................................................................................................ 19

3.2.4 Considerations about USB signals.............................................................................................. 19

CHAPTER 4. BIOS SETUP.......................................................................................................20

4.1 INTRODUCTION..................................................................................................................................... 21

4.2 BASIC CMOS CONFIGURATION............................................................................................................. 22

4.3 ADVANCED CMOS CONFIGURATION..................................................................................................... 23

4.3.1 Display tests behaviour................................................................................................................ 23

4.3.2 Show Graphic Logo ..................................................................................................................... 23

4.3.3 Ignore IDE 80 cable check........................................................................................................... 23

4.3.4 NumLock State at Boot................................................................................................................ 23

4.3.5 Wait for F1 on error...................................................................................................................... 23

4.3.6 Ignore keyboard error .................................................................................................................. 23

4.3.7 USB Keyboard after boot............................................................................................................. 24

4.3.8 SATA AHCI Option ROM............................................................................................................. 24

4.3.9 Peripheral reset wait.................................................................................................................... 24

4.3.10 First / Second / Third / Fourth boot device .................................................................................. 24

4.3.11 User Option ROM ........................................................................................................................ 24

4.3.12 RAM test execution...................................................................................................................... 24

4.3.13 COM1 console redirection ........................................................................................................... 24

4.4 CHIPSET CONFIGURATION .................................................................................................................... 25

4.4.1 Video boot Device........................................................................................................................ 25

4.4.2 Internal Video Memory Mb........................................................................................................... 25

4.4.3 Internal Video Boot on ................................................................................................................. 25

4.4.4 LVDS Panel Type ........................................................................................................................ 26

4.4.5 High Definition Audio ................................................................................................................... 26

4.4.6 Default CPU frequency MHz........................................................................................................ 26

4.4.7 Thermal Management.................................................................................................................. 26

4.4.8 SATA Ports Enabled.................................................................................................................... 27

4.4.9 PCI Express Slot 1 / 2 / 3 (Int. Lan)............................................................................................. 27

4.4.10 INTA IRQ ..................................................................................................................................... 27

4.4.11 INTB IRQ ..................................................................................................................................... 27

4.4.12 INTC IRQ..................................................................................................................................... 27

4.4.13 INTD IRQ..................................................................................................................................... 27

4.5 POWER MANAGEMENT ......................................................................................................................... 28

4.5.1 ACPI tables.................................................................................................................................. 28

4.5.2 Hyper Threading.......................................................................................................................... 28

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 4

4.5.3 SpeedStep................................................................................................................................... 28

4.5.4 C-States Handling........................................................................................................................ 28

4.5.5 LID wake configuration ................................................................................................................ 28

4.5.6 Power Failure Resume Type....................................................................................................... 28

4.5.7 External RTC Synchro................................................................................................................. 29

4.5.8 SmbAlert S3 Wake ...................................................................................................................... 29

4.6 I/O MAPPING –IRQ ............................................................................................................................. 30

4.6.1 ISA Addressing............................................................................................................................ 30

4.6.2 IRQ Mapping................................................................................................................................ 31

4.6.3 INTx# Devices assignment.......................................................................................................... 31

APPENDIX A THERMAL DESIGN.............................................................................................32

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 5

Chapter 1.INTRODUCTION

Warranty

Information and assistance

RMA number request

Safety

Electrostatic Discharges

RoHS compliance

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 6

1.1 Warranty

This product is subject to Italian law D. Lgs 24/2002, acting European Directive 1999/44/CE on

arguments of sale and warranties to consumer.

The warranty for this product lasts 1 year.

Under the warranty period the Supplier guarantees the buyer an assistance service for repairing,

replacing or credit of the item, at its own discretion.

Shipping costs regarding non-conforming items or items that need replacement are to be paid by

the customer.

Items cannot be returned unless formerly authorised by the supplier.

The authorisation is released after compiling the specific form available from the web-site

http://www.seco.com (RMA Online). Authorisation number for returning the item must be put both

on the packaging and on the documents brought with the items, which have to be not damaged,

not tampered, with all accessories in their original packaging.

Error analysis form identifying the fault type has to be compiled by the customer and has to be sent

in the packaging of the returned item.

If some of the above mentioned requirements for returning the item are not satisfied, item will be

shipped back and customer will have to pay for shipping costs.

The supplier, after a technical analysis, will verify if all the requirements for warranty service are

met. If warranty cannot be applied, he calculates the minimum cost of this initial analysis on the

item and the repairing costs. Costs for replaced components will be calculated aside.

Warning! All changes or modifications to the equipment not clearly approved by

SECO S.r.l. could impair equipment’s functionality and lead to the

expire of the warranty

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 7

1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

SECO website: visit http://www.secoqseven.com to receive the last information on the product.

In most of the cases you can find useful information to resolve your problem.

Visit also www.seco.com for FAQ Section and Support requests for registered users.

SECO reseller: the reseller or agent can help you in determining the exact cause of the

problem and search the best solution for it.

SECO Help-Desk: contact SECO Technical Assistance.

A technician is at your disposal to understand the exact origin of the problem and suggest

the right solution.

E-mail: technical.se[email protected]

Fax (+39) 0575 340434

Repairing centre: it is possible to send the faulty product to SECO Repairing Centre. In this

case, follow this procedure:

Returned items have to be provided with RMA Number. Items sent without RMA number

will be not accepted.

Returned items have to be packed in the appropriate manner. SECO is not responsible for

damages caused by accidental drop, improper usage, or customer neglects.

Note: We ask to prepare the following information before asking for technical assistance:

- Name and serial number of the product;

- Description of Customer’s peripheral connections;

- Description of Customer’s software (operative system, version, application software, etc.);

- A complete description of the problem;

- The exact words of every kind of error message received

1.3 RMA number request

To request a RMA number, please, visit SECO’s web-site. In the home-page select “RMA Online”

and follow the described procedure

You will receive an RMA Number within 1 working day (only for on-line RMA request).

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 8

1.4 Safety

Quadmo747-E6xx modules only use extremely-low voltages.

While handling the board, it is necessary to be careful in order to avoid any kind of risk or damages

to electronic components. Always switch the power off, and unplug the power supply unit, before

handling the board and/or connecting cables or other boards.

Don’t use metallic components, like paper clips, screws and similar, near the board, when this is

supplied, to avoid short circuits due to unwanted contacts with other components of the board.

Never connect the board to an external power supply unit or battery, if the board has become wet.

Make sure that all cables are correctly connected and are not damaged.

1.5 Electrostatic Discharges

Quadmo747-E6xx, like any other electronic product, is an electrostatic sensitive device and some

device on-board could be damaged by high voltages caused by static electricity.

So whenever handling a Quadmo747-E6xx board, take care to ground yourself through an anti-

static wrist strap. Placement of the board on an anti-static surface is also highly recommended.

1.6 RoHS compliance

Quadmo747-E6xx boards are designed using RoHS compliant components and are manufactured

on a lead-free production line. They are therefore fully RoHS compliant.

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 9

Chapter 2.OVERVIEW

Introduction

Technical Specifications

Electrical specifications

Mechanical specifications

Block diagram

QUADMO747-E6xx

User Manual - Rev. First Edition: 1.0 - Last Edition: 1.2- Author: S.B. - Reviewed by G.M.

QUADMO747-E6xx

Page 10

2.1 Introduction

Quadmo747-E6xx is a CPU module, in new Qseven®format, based on Intel®Atom™E6xx series

CPU, interfaced to Intel®EG20T Platform Control Hub.

This high level of integration allows an extremely reduced consumption of spaces, that is essential

for boards with sizes so reduced as for Qseven®boards, which offers all functionalities of standard

PC boards in just 70x70mm.

Many CPUs are available for Quadmo747-E6xx module, ranging from 600MHz to 1.6GHz. All

CPU’s available have a 512KB L2 cache, and a TDP (Thermal Dissipation Power) between 3.3W

and 4.5W, so that global power consumption of the board can be limited. Moreover, all CPU offer

dual Thread capabilities.

Intel®Atom™E6xx CPU series include many features that were usually included in external

Chipsets (Northbridge and Southbridge): an advanced 2D and 3D graphic accelerator, HD Audio

interface, the memory controller, the PCI Express interface (4 lanes x1), one SPI interface, LPC

Bus interface and SM Bus. From CPU’s integrated 2D/3D Graphic Media Accelerator, the LVDS

and SDVO interfaces are directly carried out to the golden finger card edge connector.

Communications between CPU and PCH comes through the Hi-Speed PCI Express lane #0

managed directly by the CPU.

The Platform Controller Hub completes the already rich list of features offered by the CPU, making

available two SATA channels, a CAN interface, 6 USB 2.0 Host ports and one USB Client port, one

SDI/O interface, I2C Bus and another SPI interface (different than the one offered by the CPU),

which is carried out directly on the Qseven®golden finger connector.

The board is completed with up to 2GB DDR2 directly soldered on board, and one SATA Flash

Disk, directly accessible like any standard Hard Disk, with up to 32GB of capacity. The internal

SATA Flash Disk is alternative to second SATA Channel carried out on Qseven®golden finger.

Interfaced to CPU’s PCI Express lane #3, there is a Gigabit Ethernet Controller. It is used this

external GbE controller instead of PCH internal controller in order to offer more bandwidth.

Depending on the version of the board (Commercial or Extreme), the Gigabit Ethernet controller

used can be Realtek RTL811E (commercial version) or Intel®WG82574IT (Extreme version).

Interfacing to the board comes through a single card edge connector, as defined by Qseven®

specifications, where are carried out all interfaces previously described. For external interfacing to

standard devices, a carrier board with a 230-pin MXM connector is needed. This board will

implement all the routing of the interface signals to external standard connectors, as well as

integration of other peripherals/devices not already included in Quadmo747-E6xx CPU module.

All CPU of E6xx family are available both in commercial temperature range (0 ÷ 70°C) and

industrial temperature range (-40°C ÷ +85°C). It is possible to have an EXTREME version of the

board, where all the components mounted onboard are certified to work in industrial range,

therefore the board is specifically developed to work in range –40°C ÷ +85°C.

For thermal dissipation of the board, according to Qseven®specifications, it is contemplated the

use of an application specific heatspreader, that is fixed to the board and get in touch with surfaces

at higher temperature, like CPU core. For better thermal distribution, on top and bottom side of

Quadmo747-E6xx modules there is a metalled strip free of components, opposite to card edge,

which goes in direct contact with the heatspreader, to increment the surface used for thermal

exchange.

Standard heatspreaders/heatsinks for Quadmo747-E6xx module are available from SECO,

however, thermal dissipation need to be specifically studied within the whole system.

To learn more about Qseven®standard: http://www.qseven-standard.org.

More information about SECO Qseven products is available at http://www.secoqseven.com.

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