COMe-bV26 - Rev. 1.0, User Guide
www.kontron.com // 10
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly.......................................................................................30
2.5.5. Temperature Sensors..........................................................................................................................................................................31
2.5.6. On-Module Fan Connector................................................................................................................................................................ 32
2.6. Environmental Specification................................................................................................................................................................33
2.7. Compliance ................................................................................................................................................................................................34
2.7.1. MTBF .........................................................................................................................................................................................................34
2.8. Mechanical Specification......................................................................................................................................................................36
2.8.1. Module Dimensions .............................................................................................................................................................................36
2.8.2. Module Height.......................................................................................................................................................................................36
2.8.3. Cooling Concept Dimensions ........................................................................................................................................................... 37
3/ Features and Interfaces .................................................................................................................................................................38
3.1. ACPI Power States....................................................................................................................................................................................38
3.2. Fast I2C........................................................................................................................................................................................................38
3.3. GPIO..............................................................................................................................................................................................................38
3.4. Hardware Monitor (HWM)....................................................................................................................................................................39
3.5. LPC................................................................................................................................................................................................................39
3.6. NVMe SSD Flash memory (Option)....................................................................................................................................................39
3.7. Real Time Clock ........................................................................................................................................................................................39
3.8. Serial Peripheral Interface ...................................................................................................................................................................39
3.8.1. SPI Boot....................................................................................................................................................................................................39
3.8.2. Booting the SPI Flash Chip ................................................................................................................................................................40
3.9. TPM 2.0 .......................................................................................................................................................................................................40
3.10. UART............................................................................................................................................................................................................41
3.11. Watchdog Timer (WTD) Dual Stage ..................................................................................................................................................41
3.11.1. Watchdog Timer Signal......................................................................................................................................................................42
4/ System Resources ............................................................................................................................................................................43
4.1. I2C Bus .........................................................................................................................................................................................................43
4.2. System Management (SM) Bus..........................................................................................................................................................43
5/ COMe Interface Connector.............................................................................................................................................................44
5.1. Connecting COMe Interface Connector to Carrier Board ............................................................................................................44
5.2. X1A and X1B Signals ................................................................................................................................................................................45
5.3. COMe Interface Connector (X1A) Pin Assignment.......................................................................................................................46
5.4. Connector X1A Row A1 - A110...............................................................................................................................................................46
5.5. Connector X1A Row B1 - B110................................................................................................................................................................51
5.6. Connector X1B Row C1 - C110 ............................................................................................................................................................... 55
5.7. Connector X1B Row D1 - D110............................................................................................................................................................... 59
6/ UEFI BIOS..............................................................................................................................................................................................63
6.1. Starting the uEFI BIOS.............................................................................................................................................................................63
6.2. Navigating the uEFI BIOS....................................................................................................................................................................... 63
6.3. Getting Help...............................................................................................................................................................................................64
6.4. Setup Menus.............................................................................................................................................................................................64
6.4.1. Main Setup Menu..................................................................................................................................................................................65
6.4.2. Advanced Setup Menu .......................................................................................................................................................................66
6.4.3. Chipset Setup Menu............................................................................................................................................................................82
6.4.4. Security Setup Menu ..........................................................................................................................................................................85
6.4.5. Boot Setup Menu..................................................................................................................................................................................87
6.4.6. Save and Exit Setup Menu ................................................................................................................................................................88
6.5. The UEFI Shell ...........................................................................................................................................................................................89
6.5.1. Entering the uEFI Shell ........................................................................................................................................................................89
