Samsung M471A5244CB0 Manuel utilisateur

Module

Handling

Guide

How to handle the module

Recently module failure related with Active/Passive/Component crack has increased.

Main root causes are wrong handling method and mechanical damage.

Current products have more cap. & resistors and the sizes of those passives are reduced and most of them are located around edge

area.

These characteristics require more cautious module handling method.

This guide book tries to nd out tendency and range of module crack pattern based on experiments from several aspects. The main

purpose is to reinforce Samsung’s process control and help customer effectively control module handling process.

Test methods are PCB Bow, Twist, Drop Test, UTM(Universal Testing Machine) Test for DRAM, Resister & Capacitor. We observed

crack phenomena and tendency through the datum and pictures. Tested products are limited to Registered DIMM [RDIMM],

Unbuffered DIMM [UDIMM] and BOC PKG based Module, therefore test results might be different when applied to otherproducts.

Overview

Memory Module Introduction

Unbuffered DIMM

Registered DIMM

Load Reduced DIMM

SODIMM

Proper Handling

• Modules should be picked up from packing

trays only one-by-one.

• Product should be handled at the

conductive mat.

• Do not grab packages. Hold only the edge

of the PCB with both hands.

• Wear gloves when handling.

• Tray must be covered when handling

module tray.

• Anti-ESD*straps should be used.

• The strap should be linked to your body.

*ESD : Electro Static Discharge

Wrong Handling

• Do not twist orbow a module.

• Do not drop modules on the oor.

• Do not grip several modules using one

hand.

• Do not touch module without gloves.

It can cause tab contamination.

Wrong Handling

• Do not detach H/S*or clip. (FDHS product)

• Handling modules near tools is prohibited

because hard metal objects can damage

Module.

• Do not insert the module by seating one

end rst then seating the other.

(This is called zippering or rock)

• Do not insert module upperside.

*H/S : Heat Spreader

Wrong Handling

• Do not insert module between sockets.

• Do not insert key notch reverse.

• Do not insert several modules at the same

time. (or simultaneously)

• Do not use metal tools when the socketing.

Proper Socketing Process

1. Socketing must be conducted before

turn-on.

2. Ensure that both latch ejectors of

connector are fully opened.

3. Grip the module edge side with both

hands. (avoid touching component area)

4. Align module to socket notch &

side guide.

Proper Socketing Process

5. Press down both edge side of module at

the same time.

6. Conrm latch ejectors closed properly.

Conclusion

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs,

smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and LED solutions. Forthe latest news, please visit

the Samsung Newsroom at news.samsung.com.

change without notice. Nonmetric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All

brand, product, service names and logos are trademarks and/or registered trademarks of theirrespective owners and are hereby recognized and acknowledged.

Fio is a registered trademark of Fio Corporation. Intel is a trademark of Intel Corporation in the U.S. and/or other countries. Linux is a registered trademark of Linus Torvalds. PCI

Express and PCIe are registered trademarks of PCI-SIG. Toggle is a registered trademark of Toggle, Inc.

Samsung Electronics Co., Ltd.

129 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16677, Korea www.samsung.com 2019-11

We validated the possibility of cracking tendencies through various tests. Various products, Environments, and characteristics of

tools can cause errors and affect test results.

However, the most important conclusion that can be deduced from the tests is that special caution against mechanical damage

and handling errors should be taken from the point of unpacking modules to inserting into the sockets on system boards.

Recent memory module products are structurally weak to external damage due to the increasing numbers of ICs and passive

components and the unit's diminishing size.

It’s difcult to predict and nd out clear root causes of failures related with BOC PKG passive components due to many variances

and circumstances. However, the above guidelines for memory module handling based on test results should help with crack-

related problems and make more effective process control possible.

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