Samsung Inkjet SCX-1150F Mode d'emploi

Repair Manual

1. Block Diagram

2. Connection Diagram

3. Circuit Description

4. Schematic Diagrams

CONTENTS

INKJET PRINTER(MFP)

SCX-1150F

1-1

Samsung Electronics

BLOCK DIAGRAM

Repair Manual

1. Block Diagram

( 110~240

(64Mbit)

SMPS

( 30V, 3. 3V)

Jupi t er 3

UART 3

I/OPORT

INT. CNTR

USB

FLASH

Thunder bolt

MOTOR CCD Module

SCANSTEPPER

SCAN MOTOR

(UNI -POLAR STEP)

COLOR

MONO

CA RT RI DG E

RESET

USB

10MHz

48MH z

P1284 CONN

SCANNER

BU F FE

600/ / 600

Tx/ Rx

SPEA KER

SDRAM

AFE

BACK UP

(Super cap 1F)

ADF MODULE

ADF

RTC

Cl o ck

SDRA M

MODEM

Spi t f i r e

/REQ /ACK ADC

DOC. POS SENSOR

DOC. DET SENSOR

OPE

POWER +5V

+11.75V

+30V

+3.3V

LIUMAIN

PRINT HEAD(2PEN)

600DPI DOUBLE

HEIGHT

ENCORDER

SENSOR

LINE FEED

CARRIAGE

RETURN MOTOR

COVER OPEN SENSOR

PAPER

EXIT

SENSOR

IMAGE

PROCESSOR

OA-980

IEEE 1284

TIMERS

REAL TIME CLOCK

ARM7TDMI

MEM. SNTR

Head Control I/F

SCAN SNTR

DERASTERIZER

MODEM CLOCK

28.224MHz

MAIN CLOCK

ADF STEPPER

MOTOR DRIVER

KEY PANNEL

TELEPHONE

LINE

MODEM & EXT_PHONE

SEPERATING PART

EXTERNAL

LINE

RING 

DETECTION

PART

EXTERNAL

PHONE

DETECTION

PART

TRANSFORMER

(64Mbit)

(8Mbit)

(33.6Kbps)

2-1

Samsung Electronics

CONNECTION DIAGRAM

Repair Manual

2. Connection Diagram

Refer to the Schematic diagram(See page 4-2)

3-1

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3. Circuit Description

3-1. GENERAL DESCRIPTION

Main circuit consists of mainly consists of CPU and the controller part with various types of built-in I/O device driver(built-in

RISC Processor Core:ARM7TDMI), system memory part, OA980 controlling input of image received from media and con-

version, CF(COMPACT storage card) interface part. The following nomenclatures by section is the same as those listed in

the circuit diagram.

3-2. MEMORY MAP

The entire Addressing area provided by MAIN CONTROLLER(S3C46MOX(Jupiter3)) is 256MBytes from 0x00000000 to

0x10000000, and the Max. Address Range for each External Chip Select is 32M Byte or Half word from 0x000000 to

0x01FFFFFF and embodied with Big-Endian Bus interface. MEMORY area is divided into EXTERNAL ROM and RAM

areas(See (Figure 1)), and the areas actually used are 8M/8M BYTES SDRAM and 1M BYTES ROM(FLASH MEMORY).

0x0FFF_FFFF

GCS 7 Area

0x0E00_0000

0x0DFF_FFFF

GCS6 Area - DRAM(8MB)

0x0C00_0000

0x0BFF_FFFF

Reserved

0x0A00_0000

0x09FF_FFFF

GCS 4 Area - OA980 PO CS

0x0800_0000

0x07FF_FFFF

GCS 3 Area - EXTENDED GPIO

0x0600_0000

0x05FF_FFFF

GCS 2 Area - MODEM

0x0400_0000

0x03FF_FFFF

GCS 1 Area - OA980

0x0200_0000

0x01FF_FFFF

Special Registers

0x01C0_0000

0x000F_FFFF

Program Area(1MB

used)

0x0000_0000

USER MEMORY(3MB Start ~ )

0xC300000

PIXEL TO LINE BUFFER(30KB)

0xC2CBC20

Chunk Buffer(8KByte)

0xC2C9C20

Re ad P rin t B uff e r ( 32 B yt e)

0xC2C9C00

Swath Buffer(300KByte)

0xC27EC00

Scan Buffer(810KB)

0xC1B4400

RGB Buffer(30KB)

0xC1ACC00

ECM Buffer(64KB)

0xC19CC00

RCP PC FAX Buffer(15KB)

0xC199000

JPEG DECODE BUFFER(64KB)

0xC099000

MDM Out Buffer(20KB)

0xC094000

MDM In Buffer(28KB)

0 xC0 8D 000

JPEG INPUT Buffer(220KB)

0xC056000

System AREA(344K)

0xC000000

OASIS Rom Code : 256KB

(Sector 15 ~ Sector 18)

J3 ROM Code :704KB

(Sector 4 ~ Sector 14)

Backup Data(Sector 3:32KB)

Not Used(Sector 1,2: 16 KB)

Boot Rom Code(Sector 0 : 16KB)

Flash memory(1MB)

SDRAM(8MB)

◊MAIN PBA

3-2

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-3.DETAILED DESCRIPTION

3-3-1 BLOCK DIAGRAM and MAIN CONTROLLER description

3-3-1-1 General description

MAIN CONTROLLER(S3C46MOX(Jupiter3),U15) consists of this system consists of CPU(ARM7TDMI RISC PROCES-

SOR), 8K BYTES CACHE, DATA and ADDRESS BUS, PLL deriding input frequency and CLOCK CONTROL part,

SERIAL COMMUNICATION part supporting UART, PRINT HEAD control part, PARALLEL PORT INTERFACE part,

USB INTERFACE part, External DMA part for receiving data from external COLOR IMAGE PROCESSOR(OA-

980,U21), MEMORY and EXTERNAL BANK control part, SYNCHRONOUS SERIAL INTERFACE control part for inter-

facing Thunderbolt, and LF/CR Motor drive control and general purpose I/O control parts.(See Figure 2 )

3-3-2 S3C46MOX(Jupiter3) FUNCTION DESCRIPTION

3-3-2-1 SYSTEM CLOCK

There are two ways of Clock input method. One is the method to make Master Clock(MCLK) at the internal PLLby con-

necting X-tal and Capacitor to the outside, and another method is to use MCLK(When inputting 40MHz) directly, which

supplies maximum 40MHz Clock to the EXTCLK terminal(PIN65). The range of frequency being input in case of using

X-tal is limited to 4MHz~10MHz. This system uses SSCG(FS781) with a 10MHZ X-tal outside to make MCLK, and sup-

plies Clock to the XIN terminal(PIN67) ofASIC by expanding Spectrum with bandwidth about 1.5% in comparison with

the basic frequency by using this IC. Inside theASIC, the PLL makes 66MHz MCLK signal, which is the basic operation

frequency of the System. Also, this PLL makes 48MHz, the operation frequency of USB Controller.

3-3-2-2 DATA and ADDRESS BUS CONTROL

1. /RD & /WR

/RD & /WR SIGNAL are synchronized with the inside MCLK(66MHZ) and becomes active to Low.

These signal are Strobe Signal used to Read or Write data when each Chip Select becomes active connected to

/RD,/WR PIN of RAM, ROM, OA-980.

2. CHIP SELECT (/ROMCS, /IP_CS,/MED_CS,/SCS0,/SCS1)

- /ROMCS : FLASH MEMORY(U7) CHIP SELECT (LOW ACTIVE)

- /IP_CS : OA-980(U21) CHIP SELECT

(LOW ACTIVE)

- /SCS1 : SDRAM(OPTION)(U12) CHIP SELECT (LOW ACTIVE)

In case each Chip Select is low, it may Read or Write data.

3. D0 ~ D15

- 16BIT DATA BUS

4. A0 ~ A24

- ADDRESS BUS (A23 ~ A24 RESERVED)

3-3

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

( 110~240

(64Mbit)

SMPS

( 30V, 3. 3V)

Jupi t er 3

UART 3

I/OPORT

INT. CNTR

USB

FLASH

Thunder bol t

MOTOR

CCD Module

SCA N STEPPER

SCAN MOTOR

(UNI -POLAR STEP)

COLOR

MON O

CARTRI DGE

RESET

USB

10M Hz

48MH z

P1284 CONN

SCANN ER

BU F FE

600/ / 600

Tx/ Rx

SPE A K ER

SDRAM

AFE

BACK UP

(Super cap 1F)

ADF MODU LE

ADF

RTC

Cl o ck

SDRA M

MODEM

Spi t f i r e

/REQ /ACK ADC

DOC. POS SENSOR

DOC. DET SENSOR

OPE

POWER

+5V

+11.75V

+30V

+3.3V

LIUMAIN

PRINT HEAD(2PEN)

600DPI DOUBLE

HEIGHT

ENCORDER

SENSOR

LINE FEED

CARRIAGE

RETURN MOTOR

COVER OPEN SENSOR

PAPER

EXIT

SENSOR

IMAGE

PROCESSOR

OA-980

IEEE 1284

TIMERS

REAL TIME CLOCK

ARM7TDMI

MEM. SNTR

Head Control I/F

SCAN SNTR

DERASTERIZER

MODEM CLOCK

28.224MHz

MAIN CLOCK

ADF STEPPER

MOTOR DRIVER

KEY PANNEL

TELEPHONE

LINE

MODEM & EXT_PHONE

SEPERATING PART

EXTERNAL

LINE

RING 

DETECTION

PART

EXTERNAL

PHONE

DETECTION

PART

TRANSFORMER

(64Mbit)

(8Mbit)

(33.6Kbps)

3-4

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

EXTCLK

nGCSx

ADDR

tRWD

tRAD

Tacs

tRCD

nWE

DATA

nBEx

Tacc Toch

Tcah

Tocs

tRCD

tRWD

tRDD

tRAD

tRDH

’1’

EXTCLK

nGCSx

ADDR

tRWD

tRAD

Tacs

tRCD

nWE

DATA

nBEx

Tacc Toch

Toch

Tcah

Tocs

tRWBED

Tcos

tRDD

tRWBED

tRCD

tRWD

tRDD

tRAD

3-5

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

SCLK

SCKE

ADDR/BA

AP/A10

nGCSx

nSRAS

nSCAS

nBEx

nWE

DATA

’1’tSAD

tSAD

tSCSD

tSRD

Trp Trcd tSCD

tSBED

Tcl

tSWD

tSDS

tSDH

3-6

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

SCLK

’1’

SCKE

ADDR/BA

AP/A10

nGCSx

nSRAS

nSCAS

nBEx

nWE

DATA

tSAD

tSCSD

tSRD

Trp Trcd

tSWD

tSDD

tSBED

tSCD

3-7

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

SCLK

SCKE

ADDR/BA

AP/A10

nGCSx

nSRAS

nSCAS

nBEx

nWE

DATA

tSAD

’1’

’HZ’

tSAD

tSCSD

tSRD tSRD

tSCD

tSWD

tSCSD

tSAD

Trp Trc

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