Samsung Mercury-27T Manuel utilisateur

Mercury-27T

DP700A7D

SERVICEMANUAL

DP700A7DContents

1.Precaution

2.Introduction

3.DesassemblyandReassembly

4.Troubleshooting

5.SystemWireDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1

1.2.SafetyPrecautions...................................................................................................................1−2

1.3.Ground..................................................................................................................................1−3

1.4.StaticElectricityPrecautions......................................................................................................1−4

2.Introduction.....................................................................................................................................2−1

2.1.ProductFeatures......................................................................................................................2−1

2.2.Specication...........................................................................................................................2−2

2.3.Comparingproductspecications...............................................................................................2−10

2.4.OverviewandFeature..............................................................................................................2−11

2.5.NewTechnology/ability..........................................................................................................2−20

2.6.NewH/W(Platform)................................................................................................................2−34

2.7.SWList.................................................................................................................................2−38

2.8.SystemSetup(BiosSetup).........................................................................................................2−41

2.9.HWOptionalItems................................................................................................................2−52

3.DesassemblyandReassembly..............................................................................................................3−1

3.1.MainSystem............................................................................................................................3−1

4.Troubleshooting...............................................................................................................................4−1

4.1.Generalspec...........................................................................................................................4−1

4.2.DebuggingFlowChart..............................................................................................................4−2

4.3.HardwareTroubleshooting........................................................................................................4−6

4.3.1.LCD.........................................................................................................................4−6

4.3.2.MainSystem..............................................................................................................4−7

4.3.3.Others.......................................................................................................................4−11

4.4.Diagnosisapplication...............................................................................................................4−13

4.5.Bios&MicomUpdate..............................................................................................................4−15

4.6.CPUFANControl....................................................................................................................4−16

4.7.SystemDiagnosis....................................................................................................................4−17

4.8.HardwareUpgrade...................................................................................................................4−18

5.SystemWireDiagram........................................................................................................................5−1

5.1.SystemLayout........................................................................................................................5−1

5.2.BoardComponent...................................................................................................................5−2

1.Precaution

1.1.GeneralAfter-SalesServicePrecautions

1)Donotletcustomersrepairtheproductthemselves..

›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.

2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales

serviceofelectricparts).

›Thereisadangerofelectricshock.

3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.

›Thereisadangerofreduetooverheating.

4)Checkifthepowerplugorwalloutletaredamagedinanyway.

›Ifadefectisfound,repairorreplaceitimmediately.

(Thereisadangerofelectricshockorre)

5)Makesurethatitisproperlygrounded.

(Checkthegroundofthewalloutlet)

›Electricityleakagemaycauseelectricshock.

DEVICE

UNDER

TES T

(RE ADING S HOULD)

NOT BE ABO VE 0.5mA

LEAKAGE

CUR RENT

TES TE R

TES T ALL

EXP OS E D METAL

S URFACE S

2-WIRE C ORD

*ALS O TES T WITH

P LUG R EVER S ED

(US ING AC ADAP TER

P LUG AS RE QUIRE D) EARTH

GR OUND

Figure1.1LeakageCurrentTestCircuit

6)Donotspraywaterontotheproducttocleanit.

›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..

7)Checktheassemblystatusoftheproductaftertheafter-salesservice..

›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.

8)Unplugthepowercordholdingthepowerplug(andnotthecord).

›Ifthecordisdisconnected,itmaycauseelectricshockorre.

9)Repairtheproductusingonlyauthorizedparts

10)Keeptheproductawayfromheatingdevicessuchasheaters.

›Exposuretoheatersmaycausedeformationoftheproductorre.

1.Precaution

1.2.SafetyPrecautions

1)EMI

ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.

2)CircuitTest(LogicTest)Precautions

TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since

thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.

Thereforereadandfollowtheinstructionsbelow.

a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In

addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.

b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.

c)Youmustuseasolderingironwithoutaleakagecurrent.

d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.

e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong

direction,itmightbecomedamaged.

f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto

keepthevoltagelevelofeachoftheterminalsthesame.

g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.

j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.

k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.

l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.

1.Precaution

1.3.Ground

Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea

multitapwithagroundterminalonly.

Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif

theyarenotgroundedeveniftheyhaveagroundterminal.

Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto

thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa

metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.

NevergroundtheproducttoaPVCwaterpipe,phoneline,TV,radioantenna,aluminumwindoworgaspipe,becausethis

doesnotactuallygroundtheproductandmaybedangerous.

1.Precaution

1.4.StaticElectricityPrecautions

Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant

forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair

andlowerstheexpensesfordamagedparts.

Topreventstaticelectricity,followtheinstructionsbelow.

1)Performtherepairinalocationwithoutstaticelectricity.

2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic

Electricityfromyourbodybeforehandlingtheparts.

3)Touchonlytheedgesoftheboard,ifpossible.

4)Donottouchanypartsunlessabsolutelynecessary

5)Disassemblethepartsontheanti-static-electricitypad.

6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.

2.Introduction

2.1.ProductFeatures

2.Introduction

2.2.Specication

ProcessorandMotherboard

CPU***Intel®Pentium®G645TProcessor(2.50GHz,3MB)BGA

Intel®IvyBridgeCore™I3ProcessorDualCoreI3-3220T(2.80Hz)3MBBGA

Intel®IvyBridgeCore™I5ProcessorDualCoreI5-3470T(2.90Hz)3MBBGA

Intel®IvyBridgeCore™I5ProcessorQuadCoreI5-3570T(2.30Hz)6MB

-MaxspecBGA

Intel®IvyBridgeCore™I7Processor

QuadCoreI7-3770T(2.50Hz)8MB-MaxspecBGA

CacheL3:3~8MB

IntelTurboBoost

ChipsetIntelH61/IntelH77

BIOS32Mbit,Flashupgradable,SPIROM

(ROMsizeforWin8support)

ThermalDesignPerformance35W

Memory

Memory***/Max.MemoryMAX.8GB(1Slots:Max.4GB)

MemorytypePC3-10600/12800(1333/1600MHz)DDR3SODIMM

MemoryModules4/6/8GBDDR31333/1600MHz

Sockets(PGA)2SODIMMs(Total2Slots)forDDR3

※PC3-10600/12800(1333/1600MHz)conrmedthecompatibilitytest

DisplayandGraphics

LCD27"FHD(M270HW02V1)[NonGlare]

(TSPSupport:capacitancepanel)

TypeLEDLCD(NonGlare)

VendorAUO

LCDViewableArea597.6(W)*336.15(H)mm

LCDResolutionFHD(1920x1080)

DotPitch311.25(H)x311.25(V)um

ViewingangleHor.+89/-89,Ver.+89/-89(Typ)

ContrastRatioTyp.5000

BrightnessTyp.300(cd/m2)

ResponsetimeRising+Fallingtyp.12ms

tiltangle0~20˚(userangle)

PanelVA

TSPSupport:capacitancepanel

LCD27"QHD(LTM270DL02)[NonGlare]

(TSPSupport:capacitancepanel)

2.Introduction

TypeLEDLCD(NonGlare)

VendorSEC

LCDViewableArea(596.74*335.66)mm

LCDResolutionQHD(2560x1440)

DotPitch0.233(H)x0.233(V)

ViewingangleHor.+89/-89,Ver.+89/-89(Typ)

ContrastRatioTyp.1000

BrightnessTyp.300(cd/m2)

ResponsetimeRising+Fallingtyp.12ms

tiltangle0~20˚(userangle)

PanelPLS

TSPSupport:capacitancepanel

GraphicsControllerAMDHeathrow-ProHD7850M:G645/i3/i5/i7Support

VideoMemory1GBGDDR5/2GBGDDR5

Max.resolutionforBulit-inLCDWin8support:(2560X1440,1920X1200,1920x1080,1680x1050,

1600X1200,1600x900,1440x900,1400x1050,1280x1024

,1280x800,1280x768,1152x864,1024x768)

HDMI-InSupportv1.4acompliant/EnableHDCP

DP-INsupport:(2560X1440,1920X1200,1920x1080,1680x1050,

1600X1200,1600x900,1440x900,1400x1050,1280x1024

,1280x800,1280x768,1152x864,1024x768)

ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)

CameraSupport(1.0MHDmegapixel)

PowerexpressNotsupport

GraphicsControllerINTELHDGraphics2500(Option):i3/5Support

VideoMemorySharedvideomemoryupto1.8GBatover4GBSystemmemory(DVMT5.0)

Max.resolutionforBulit-inLCD1920x1080with32-bitcolorat60Hz

1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,

1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768

HDMI-InSupportv1.4acompliant/EnableHDCP

DP-IN1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,

1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768

ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)

CameraSupport

GraphicsControllerINTELHDGraphics4000(Option):i7Support

VideoMemorySharedvideomemoryupto1.8GBatover4GBSystemmemory(DVMT5.0)

Max.resolutionforBulit-inLCD1920x1080with32-bitcolorat60Hz

1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,

1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768

HDMI-InSupportv1.4acompliant/EnableHDCP

2.Introduction

DP-IN1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,

1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768

ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)

CameraSupport

GraphicsControllerINTELHDGraphics(Option)

VideoMemorySharedvideomemoryupto1.8GBatover4GBSystemmemory(DVMT5.0)

Max.resolutionforBulit-inLCD1920x1080with32-bitcolorat60Hz

1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,1280x1024,

1280x960,1280x800,1280x768,1152x864,1024x768

HDMI-InSupportv1.4acompliant/EnableHDCP

DP-IN1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,

1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768

ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)

CameraSupport

AudioandVideo

SoundHighDenitionAudio

ControllerRealtekALC269Q-VC

ConversionBuilt-inhighperformance24-bitADC&24-bitDAC

SoundeffectSoundAive

InternalInterfacesEmbeddedstereospeakerswith2

Tweeters&integrated2xDigitalmicrophones

SpeakerPowerRating2Speakersx7W/6ohm

ExternalInterfacesHeadphone-out,microphone-in

ControlsMonitormode:TouchButtonVolumeControl

Microphone

TypeIntegrated2xDigitalmicrophones

Sensitivity-22±3dB

Outputimpedance

NolseReductionNoisesupression,AcousticEchoCancellation,BeamForming

Camera

ModelnameSC-10IRQ12340N

Imagesensor1/6.5"ColorCMOSHD(1,280x720)

StillImageCaptureResolution1,280x720(Max.)

VideoCaptureResolution1,280x720(Max.)

FrameRate30fps@HD,24MHzMCLK

OutputVideoFormatHD,SVGA,VGA,CIF,QVGA,QCIF,QQVGA

InterfaceUSB2.0(Highspeed)

UVCSupportsupport

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