RF-Star RF-BMPA-2541B1 Manuel utilisateur

RF-BMPA-2541B1

Bluetooth Low Energy Module

Version 1.1

Shenzhen RF-star Technology Co., Ltd.

May 15th, 2020

RF-BMPA-2541B1

www.szrfstar.com V1.0 - May, 2020

Shenzhen RF-star Technology Co., Ltd. Page 1 of 20

TI CC254X BLE Module List

Chipset

Core

Flash

(Byte)

RAM

(KB)

Power

(dBm)

Model

Antenna

Dimension

(mm)

Range

(M)

Photo

CC2540

8051

256

RF-BM-S01

PCB

13.7  17.4

100

RF-BM-S02

PCB

11.2  15.2

100

RF-BM-S02I

IPEX

11.2  15.2

150

RF-CC2540A1

PCB

15.2  24.1

100

CC2541

8051

256

RF-BM-S01A

PCB

13.7  17.4

RF-BM-S02A

PCB

11.2  15.2

RF-BMPA-

2541B1

PCB /

IPEX

13.7  31.4

300

Note:

1. The communication distance is the longest distance obtained by testing the module's maximum transmission power

in an open and interference-free environment in sunny weather.

2. Click the picture to buy modules.

RF-BMPA-2541B1

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Shenzhen RF-star Technology Co., Ltd. Page 2 of 20

1 Device Overview

1.1 Description

RF-BMPA-2541B1 is a Bluetooth Low Energy (BLE) module based on TI CC2541F256, an 8051 core BLE System-on-

Chip (SoC) and a PA of CC2592. This PCB module integrates one 32 MHz crystal, one 32.768 kHz crystal, an LC balun,

a chip matching, a high-performance PCB antenna, an IPEX connector, and half-hole antenna interface for different

customer needs to develop. It is pre-programmed with the BLE 4.0 stack and an application communication protocol

over its serial interface. It enables users to quickly connect their application MCUs to build reliable BLE connection from

their products to smart phones.

1.2 Key Features

•RF

- 2.4 GHz Bluetooth low energy 4.0 compatible and

proprietary RF system-on-chip

- Supports 250 kbps, 500 kbps, 1 Mbps, 2 Mbps

data rates

- Excellent link budget, enabling long-range

applications without external front end

- Excellent receiver sensitivity (-94 dBm at 1 Mbps),

selectivity, and Blocking performance

- Suitable for systems targeting compliance with

worldwide radio frequency regulations: ETSI EN

300 328 and EN 300 440 Class 2 (Europe), FCC

CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

•Microcontroller

- High-performance and low-power 8051

microcontroller core with code prefetch

- In-system-programmable flash of 256 KB

- 8-KB RAM with retention in all power modes

- Hardware debug support

- Extensive baseband automation, including auto-

acknowledgment and address decoding

- Retention of all relevant registers in all power modes

•Layout

- Few external components

- 31.4 mm x 13.7 mm in SMT Package

•Peripherals

- Powerful five-channel DMA

- 12 Bit ADC with eight channels and configurable

resolution

- Integrated high-power comparator

- General-purpose timers (one 16-bits, two 8-bits)

- 19 General-purpose I/O pins (21 × 4 mA, 2 × 20 mA)

- 32 kHz sleep timer with capture

- Two powerful USARTs with support for several

serial protocols

- IR generation circuity

- AES security coprocessor

- Battery monitor and temperature sensor

- I2C interface

- 2 I/O pins have LED driving capabilities

- Watchdog timer

1.3 Applications

•2.4-GHz Bluetooth low energy system

•Mobile phone accessories

•Sports and leisure equipment

•Consumer electronics

•Human interface devices

•Keyboard, mouse

RF-BMPA-2541B1

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•Remote control

•Health care and medical

•Smart lighting

1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of RF-BMPA-2541B1

1.5 Part Number Conventions

The part numbers are of the form of RF-BMPA-2541B1 where the fields are defined as follows:

Figure 2. Part Number Conventions of RF-BMPA-2541B1

CC2541

F256

GPIO

I2C

UART

32.768 kHz

Reset

Chip

Matching

PCB

Antenna

CC25

IPEX

Connector

Antenna

Matching

Half Hole

Interface

Power Filter

Switch

Power

32.0 MHz

LC Balun

Power

Supply

2.0 V ~ 3.6

2541

Company Name

RF-STAR

Wireless Type

Bluetooth Module

Chipset

TI CC2541

Module Version

The First Version

Power Amplifier

TI CC2592

                RF-BMPA-2541B1 
www.szrfstar.com                                                                          V1.0 - May, 2020 
Shenzhen RF-star Technology Co., Ltd.                                                                                                                    Page  4  of  20                        
 
Table of Contents 
TI CC254X BLE Module List .......................................................................................................................................... 1 
Device Overview............................................................................................................................................................. 2 
1 Description............................................................................................................................................................ 2 
2 Key Features.................................................................................................................................................... 2 
3 Applications.......................................................................................................................................................... 2 
4 Functional Block Diagram .............................................................................................................................. 3 
5 Part Number Conventions.............................................................................................................................. 3 
Table of Contents................................................................................................................................................................ 4 
Table of Figures................................................................................................................................................................... 5 
Table of Tables..................................................................................................................................................................... 5 
Module Configuration and Functions ...................................................................................................................... 6 
1 Module Parameters........................................................................................................................................... 6 
2 Module Pin Diagram ......................................................................................................................................... 7 
3 Pin Functions....................................................................................................................................................... 7 
Specifications ................................................................................................................................................................... 9 
1 Recommended Operating Conditions ....................................................................................................... 9 
2 Handling Ratings................................................................................................................................................ 9 
3 Current Consumption ....................................................................................................................................... 9 
4 RF Test.................................................................................................................................................................10 
Application, Implementation, and Layout.............................................................................................................11 
1 Module Photos..................................................................................................................................................11 
2 Recommended PCB Footprint....................................................................................................................11 
3 Antenna................................................................................................................................................................12 
4 Schematic Diagram.........................................................................................................................................13 
5 Basic Operation of Hardware Design ......................................................................................................13 
6 Trouble Shooting..............................................................................................................................................15 
6.1 Unsatisfactory Transmission Distance........................................................................................15 
6.2 Vulnerable Module..............................................................................................................................15 
6.3 High Bit Error Rate .............................................................................................................................16 
7 Electrostatics Discharge Warnings ...........................................................................................................16 

                RF-BMPA-2541B1 
www.szrfstar.com                                                                          V1.0 - May, 2020 
Shenzhen RF-star Technology Co., Ltd.                                                                                                                    Page  5  of  20                        
4.8 Soldering and Reflow Condition.................................................................................................................16 
4.9 Optional Packaging.........................................................................................................................................17 
5 Certification .....................................................................................................................................................................18 
5.1 RoHS ....................................................................................................................................................................18 
6 Revision History ............................................................................................................................................................19 
7 Contact Us.......................................................................................................................................................................20 
 
Table of Figures 
Figure 1. Functional Block Diagram of RF-BMPA-2541B1 ....................................................................... 3 
Figure 2. Part Number Conventions of RF-BMPA-2541B1....................................................................... 3 
Figure 3. Pin Diagram of RF-BMPA-2541B1.................................................................................................. 7 
Figure 4. Photos of RF-BMPA-2541B1...........................................................................................................11 
Figure 5. Recommended PCB Footprint of RF-BMPA-2541B1 (mm).................................................11 
Figure 6. Location of C17, C18 and C23 .......................................................................................................12 
Figure 7. Specification of Antenna Seat .........................................................................................................12 
Figure 8. Specification of IPEX Wire................................................................................................................13 
Figure 9. Schematic Diagram of RF-BMPA-2541B1 .................................................................................13 
Figure 10. Recommendation of Antenna Layout.........................................................................................15 
Figure 11. Recommended Reflow for Lead Free Solder .........................................................................17 
Figure 12. Optional Packaging Mode ..............................................................................................................17 
Figure 13. RoHS Certificate ................................................................................................................................18 
 
Table of Tables 
 
Table 1. Parameters of RF-BMPA-2541B1...................................................................................................... 6 
Table 2. Pin Functions of RF-BMPA-2541B1 ................................................................................................. 7 
Table 3. Recommended Operating Conditions of RF-BMPA-2541B1 .................................................. 9 
Table 4. Handling Ratings of RF-BM-ND04 .................................................................................................... 9 
Table 5. Table of Current Consumption ............................................................................................................ 9 
Table 6. Table of RF Test......................................................................................................................................10 
Table 7. Temperature Table of Soldering and Reflow................................................................................16 

RF-BMPA-2541B1

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2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of RF-BMPA-2541B1

Chipset

CC2541F256+CC2592

Supply Power Voltage

2.0 V ~ 3.6 V, recommended to 3.3 V

Frequency

2402 MHz ~ 2480 MHz

Transmit Power

Programmable: -3.0 dBm ~ +19.0 dBm

Receiving Sensitivity (high gain mode)

-93 dBm

GPIO

Crystal

32 MHz, 32.768 kHz

RAM

8 KB

Flash

256 KB

Package

SMT Packaging

Frequency Error

±20 kHz

Dimension

31.40 mm x 13.7 mm x (2.1 ±0.1) mm

Type of Antenna

PCB Antenna / IPEX connector / Half-hole antenna interface

Operating Temperature (high-temperature mode)

-40 ℃～+85 ℃

Storage Temperature (high-temperature mode)

-40 ℃～+125 ℃

RF-BMPA-2541B1

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2.2 Module Pin Diagram

Figure 3. Pin Diagram of RF-BMPA-2541B1

2.3 Pin Functions

Table 2. Pin Functions of RF-BMPA-2541B1

Name

Chip Pin

Pin Type

Description

GND

－

GND

Suitable for long distance requirements

VCC

－

Power supply

P22

P2.2

Debug DC

P21

P2.1

Debug DD

P20

P2.0

I/O

P17

P1.7

I/O

P16

P1.6

I/O

I2C+

I2C-

GND

Ground

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P15

P1.5

I/O

P14

P1.4

I/O

P13

P1.3

I/O @ LNA EN

Control CC2592 LNA enable

P12

P1.2

I/O @ PA EN

Control CC2592 PA enable

P11

P1.1

I/O @ gain

Control CC2592 LNA high & low gain

P10

P1.0

I/O

P07

P0.7

I/O

P06

P0.6

I/O

P05

P0.5

I/O

P04

P0.4

I/O

P03

P0.3

I/O

P02

P0.2

I/O

P01

P0.1

I/O

P00

P0.0

I/O

RESET

RST

RESET

Active low

GND

Ground

ANT

External antenna

GND

Ground

RF-BMPA-2541B1

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3 Specifications

3.1 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 3. Recommended Operating Conditions of RF-BMPA-2541B1

Items

Condition

Min.

Typ.

Max.

Unit

Operating Supply Voltage

Battery Mode

2.0

3.3

3.6

Operating Temperature

-40

+25

+85

℃

Environmental Hot Pendulum

-20

+20

℃/min

3.2 Handling Ratings

Table 4. Handling Ratings of RF-BM-ND04

Items

Condition

Min.

Typ.

Max.

Unit

Storage Temperature

Tstg

-40

+25

+125

℃

Human Body Model

HBM

±1000

Moisture Sensitivity Level

Charged Device Model

±500

3.3 Current Consumption

Table 5. Table of Current Consumption

When measured on the RF-BMPA-2541B1 reference design with T A = 25 ℃, V BAT = 3.3 V, Fc = 2440 MHz with

DC/DC enabled unless otherwise noted.

Event

Average Current

(Integral

Computed1)

Average Current

(Ammeter

Measured2)

Duration

Testing Conditions

Sleeping

0 mA

EN is in high low

Broadcasting

0.79 mA

0.6 mA ~ 1.3 mA

4.42 ms

Broadcasting cycle: 200 ms

Connection

1.8 mA

1.9 mA ~2.1 mA

2.73 ms

Connection interval: 100 ms

Module receiving

UART data and

send to APP

0.95 mA

9.1 mA

0.512 ms

20 bytes,10 times/s

Module receiving

APP data and send

to MCU

0.94 mA

8.8 mA ~ 8.9 mA

0.512 ms

20 bytes,10 times/s

Table des matières

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