Panasonic DMP-BD81PU Manuel utilisateur

Unauthorized copying and distribution is a violation

of law.

ORDER NO.CHM1404003CE

Blu-ray Disc Player

Model No. DMP-BD91GN

DMP-BD81PU

DMP-BD81GA

DMP-BD81GC

DMP-BD81GN

DMP-BD81GT

DMP-BDT160GA

DMP-BDT160GN

DMP-BDT160GW

DMP-BDT161GC

Colour

(K).......................Black Type

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions -----------------------------------------------5

1.1. General guidelines-----------------------------------------5

1.2. Caution for fuse replacement ---------------------------5

2Warning--------------------------------------------------------------7

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatic Sensitive (ES) Devices ---------------7

2.2. Precaution of Laser Diode -------------------------------8

2.3. Service caution based on legal restrictions----------9

3 Service Navigation---------------------------------------------- 10

3.1. Combination of Multiple Pressing on the

Remote Control------------------------------------------- 10

3.2. The display position of TV ----------------------------- 10

3.3. Entering Special Modes with Combination of

Multiple Pressing on the Remote Control ---------- 10

3.4. How to Update Firmware------------------------------- 12

4 Specifications ---------------------------------------------------- 16

5 Location of Controls and Components------------------ 18

6 Operating Instructions ---------------------------------------- 19

6.1. Taking out the Disc from BD-Drive Unit when

the Disc cannot be ejected by OPEN/CLOSE

button-------------------------------------------------------- 19

7 Service Mode ----------------------------------------------------- 20

7.1. Special Mode Setting and Service mode----------- 20

8 Service Fixture & Tools --------------------------------------- 32

9 Disassembly and Assembly Instructions --------------- 33

9.1. Unit----------------------------------------------------------- 33

9.2. BD Drive ---------------------------------------------------- 36

9.3. Disassembly from the traverse unit, assembly

of the optical pick-up unit, and precautions on

ESD-preventive------------------------------------------- 41

9.4. Adjustment of BD Drive--------------------------------- 45

10 Measurements and Adjustments -------------------------- 48

10.1. Service Positions ----------------------------------------- 48

10.2. Caution for Replacing Parts --------------------------- 50

11 Block Diagram --------------------------------------------------- 51

11.1. Overall Block Diagram ---------------------------------- 51

11.2. Power Supply Block Diagram ------------------------- 52

11.3. Digital P.C.B. Regulator Block Diagram ------------ 53

11.4. Digital (Back End Section) Block Diagram--------- 54

11.5. Digital (Front End Section) Block Diagram -------- 55

12 Wiring Connection Diagram --------------------------------- 56

12.1. Interconnection Schematic Diagram ---------------- 56

13 Appendix Information of Schematic Diagram --------- 57

13.1. Waveform Chart ------------------------------------------ 57

1 Safety Precautions

1.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-

lic cabinet part on the equipment such as screwheads,

connectors, control shafts, etc. When the exposed metal-

lic part has a return path to the chassis, the reading

should be between 1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be .

1.1.2. Leakage current hot check

(See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a mea-

surement is outside of the limits specified, there is a pos-

sibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the cus-

tomer.

1.2. Caution for fuse replacement

1.2.1. Micro Fuse conducting check

This unit uses the Micro Fuse.

Check the Micro Fuse conducting using the Tester at the check points below.

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive

(ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semi-

conductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient

to damage an ES device).

2.2. Precaution of Laser Diode

2.3. Service caution based on legal restrictions

2.3.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

Service caution for repair work using Lead Free Solder (PbF)

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.

• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01KS-----------(0.3mm 100g Reel)

RFKZ06D01KS-----------(0.6mm 100g Reel)

RFKZ10D01KS-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

3 Service Navigation

3.1. Combination of Multiple Pressing on the Remote Control

Press multi-buttons (in combination) on the remote control simultaneously for operations, such as initialization or service mode, etc.

3.2. The display position of TV

Special modes display of this unit changes to TV display from the original FL display.

3.3. Entering Special Modes with Combination of Multiple Pressing on the

Remote Control

Enter the following special modes by multiple pressing functions on the supplied remote control.

After entering each mode, switch to the desired menus for operation.

Ce manuel convient aux modèles suivants

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