Mindspeed Technologies M21115 Manuel utilisateur
21125-EVMD-001-B
July 2013
M21125/M21115 Evaluation Module
User Guide
21125-EVMD-001-B Mindspeed Technologies®2
Mindspeed Proprietary and Confidential
Revision History
Revision Date Description
B July 2013 Updated High Speed output settings, Table 2-3
Added Software Operation, Chapter 3
A February 2009 Initial release
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Contents
1.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.0 Quick Start Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.0 Software Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Software Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.2 Software Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.2.1 Connection Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.2.2 Resetting the Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.2.3 Direct/Indirect Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
3.2.4 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
3.2.5 Direct Register Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
3.2.6 Saving/Loading State and Macro Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
21125-EVMD-001-B Mindspeed Technologies®4
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1.0 Introduction
This user guide describes how to use the M21125/M21115 evaluation module (EVM). The M21125 is a 40 input by
40 output crosspoint switch and the M21115 is a 20 input by 20 output crosspoint switch rated to operate up to 3.8
Gbps. The EVM is a demonstration and test platform that enables system developers and product designers to
quickly evaluate the functionality and performance of the M21125 and M21115.
The EVM is a single PC board that provides access to 16 lanes of the crosspoint switch (XPTS). One group of four
lanes is accessed via HDMI connectors, another group of four lanes is accessed via DVI connectors, and the
remaining two groups of four lanes are accessed via SMA connectors. The HDMI and DVI connectors are DC-
coupled to allow for direct connection to cables interfaced to TMDS sources and sinks. The SMA connectors are
AC-coupled to enable connections to laboratory test equipment such as generators and analyzers. The EVM is
powered utilizing the supplied AC adapter, and controlled with on-board DIP switches. Note that when the EVM is
populated with a M21115 component, the HDMI connectors cannot be used.
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2.0 Quick Start Guide
The EVM is ready to use out of the box. Please refer to Figure 2-1 for the location of the various connectors.
Figure 2-1. M21125/M21115 Evaluation Module
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1. Connect the supplied AC adapter to connector J85 (+5.0 VDC).
2. For HDMI evaluations, attach an HDMI cable from the source to the connector labeled HDMI IN (J86) and an
HDMI cable from the sink to the connector labeled HDMI OUT (J87). Note that when the EVM is populated with
a M21115 component, the HDMI connectors cannot be used.
3. For DVI evaluations, attach a DVI cable from the source to the connector labeled DVI IN (J17) and a DVI cable
from the sink to the connector labeled DVI OUT (J18).
4. In addition, the SMA connectors can be used for an AC-coupled interface to test equipment. Signal generators
should be connected to the EVM by securing 50cables to the SMA connectors labeled IN[7:0], and signal
analyzers should be connected to the EVM by securing 50cables to the SMA connectors labeled OUT[7:0].
Note that the EVM is pre-configured for pass-through mode, routing GRP0 IN0 to GRP0 OUT0, GRP0 IN1 to
GRP0 OUT1, … , GRP1 IN7 to GRP1 OUT7.
5. The crosspoint switch state can be altered utilizing DIP switches XPS CONFIG[1:0] located at SW3, as shown
in Ta bl e 2 - 1 . The EVM has been pre-configured for the group switch mode, where groups of four lanes are
switched at a time. Group 0 consists of inputs/outputs [3:0] and group 1 consists of inputs/outputs [7:4]. See
Tabl e 2-2 for the input/output mapping for two of the switch states. After the DIP switches have been
reconfigured it is necessary to push the button labeled uC RESET located at S3; see Figure 2-2.
Table 2-1. Crosspoint Switch State Configuration
XPS CONFIG[1:0] Input Output
LL GRP0 GRP0
GRP1 GRP1
HDMI HDMI
DVI DVI
LH GRP0 GRP1
GRP1 GRP0
HDMI DVI
DVI HDMI
HL GRP0 HDMI
GRP1 DVI
HDMI GRP0
DVI GRP1
HH GRP0 DVI
GRP1 HDMI
HDMI GRP1
DVI GRP0
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Table 2-2. Input/Output Mapping Examples
XPS CONFIG[1:0] Input Output
LL IN0 OUT0
IN1 OUT1
IN2 OUT2
IN3 OUT3
IN4 OUT4
IN5 OUT5
IN6 OUT6
IN7 OUT7
LH IN0 OUT4
IN1 OUT5
IN2 OUT6
IN3 OUT7
IN4 OUT0
IN5 OUT1
IN6 OUT2
IN7 OUT3
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6. Signal conditioning settings such as input equalization (IE) and output de-emphasis (DE) can be configured
utilizing DIP switches XPS CONFIG[4:2] located at SW3, as shown in Ta b l e 2 - 3 . The EVM has been pre-
configured for the DIP switch setting XPS CONFIG[4:2] = HLH. After the DIP switches have been reconfigured
it is necessary to push the button labeled uC RESET located at S3; see Figure 2-2.
Table 2-3. Input Equalization and Output De-Emphasis Configuration
XPS CONFIG[4:2] IE Level DE Level Output Swing
LLL Disabled Low 1000 mVppd
LLH Disabled Medium 1000 mVppd
LHL Disabled High 1000 mVppd
LHH Low Low 1000 mVppd
HLL Medium Low 1000 mVppd
HLH High Low 1000 mVppd
HHL High High 1000 mVppd
HHH High High 1400 mVppd
Figure 2-2. Location of DIP Switch Bank SW3 and Button S3
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7. Verify the settings of the following DIP switches located at SW4 and SW2. Figure 2-3 shows the location of
these DIP switches.
a. GRP/LANE MODE = H
b. INPUT ENABLE = L
c. OUTPUT ENABLE = L
d. TEST = L
e. I/O CONFIG0 = L
f. I/O CONFIG1 = L
Figure 2-3. Location of DIP Switch Banks SW4 and SW2
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8. Perform the desired electrical evaluations. Figure 2-4 shows a typical eye diagram.
Figure 2-4. Typical Data Output Eye Diagram at 3.8 Gbps
Ce manuel convient aux modèles suivants
1
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