Mechatronika MR10 Manuel utilisateur

Infrared reflow oven MR10 2

Contents

1. GENERAL DESCRIPTION ..................................................................................................................................3

1.1. TECHNICAL DATA ..............................................................................................................................................3

2. INSTALLATION ....................................................................................................................................................4

3. CONTROL SYSTEM .............................................................................................................................................5

3.1. CONTROL PANEL................................................................................................................................................5

4. SOLDERING PARAMETERS SETUP ................................................................................................................8

4.1. MANUAL PROFILE SETUP ...................................................................................................................................8

4.1.1. Heater Profile Setup ..................................................................................................................................8

4.1.2. Time Setup .................................................................................................................................................9

4.2. AUTO PROFILING (MR10A ONLY)......................................................................................................................9

5. EXAMPLE FOR SOLDERING PROFILES SETUP........................................................................................11

6. MALFUNCTIONS / ERROR MESSAGES........................................................................................................12

7. LIST OF SPARE PARTS.....................................................................................................................................13

8. ELECTRICAL DIAGRAM .................................................................................................................................14

Infrared reflow oven MR10

1. General Description

Mechatronika’s infrared reflow oven MR10 ca be used for hardening glue spots as well as for the

soldering process on surface mounted printed circuits boards. MR10 controls the process accord-

ing to previously defined time/temperature profiles, after the PCB has been feeded into transport

frame.

The transport frame goes through 3 (4) processing sections:

•initial preheating area

•preheating area

•soldering area

•dwell area (for lead free process)

After pressing the START-key the transport frame brings the PCB into the initial preheating

area (soldering area), leaving it for TFseconds there while the PCB reaches it's preheating tem-

perature TP1.Then the transport frame travels into preheating and stays at this temperature for TP

seconds. So the PCB can reach TP2 temperature, where the volatile components of solder paste

vaporise out. Then the transport frame travels into reflow area to melt the solder paste into solid

connections (reflow temperature TRfor TRseconds). For lead free process transport frame travels

back to preheating for TDseconds to create plateau. The soldering process ends with cooling the

PCB down, the transport frame will run into its original position, while a optional fan is activated

for TCseconds. Separating the soldering process into four explicitly definable phases with mi-

croprocessor control and auto profiling system, the PID control and the precise stepper-motor-

driven transport system realise a highly accurate soldering process control.

1.1. Technical Data

pcb

size

................................

170x270 mm

pcb transport

........................

transport frame, moving back to feeding position after sol-

dering process

heating elements ............... 0,7kW and 1,3kW far infrared heater

control............................... microprocessor, PID-control, 12 soldering profiles

power

consumption

..............

2kW max, average cycle power 1,4kW

power supply

........................

230V±10%; 50Hz

dimensions (l x w x h)

...........

900x520x350mm

weight................................

...

45kg

Infrared reflow oven MR10

2. Installation

The reflow oven MR10 should be installed according to fig.2 and can be connected to used air

flue with fan, which is to be wired to one of the plugs in the rear panel of the machine. So the fan

is activated only in the cooling phase of the soldering process. The reflow oven doesn't need any

maintenance. If performance of heaters drops, check whether the fuses in the rear panel of the

machine are intact and change in case of damage.

Fig.2: Installation of MR10

Infrared reflow oven MR10

3. Control system

Fig.3 shows the functional blocks of MR10’s control system:

Fig.3: MR10 control systems

3.1. Control Panel

Control panel contains the following functional elements:

· Main switch

· LCD display

· Keyboard

· Temperature probe plug

Infrared reflow oven MR10

Fig.4: MR10 control panel

The following information are shown on LCD-display:

· soldering profile number

· soldering parameters belonging to this profile

· actual soldering phase

· with auto profiling system: actual soldering temperature on pcb

The keyboard has the following functions:

PROFILE................... chooses number of soldering profile

TIME ......................... time setup for all soldering phases (F/P/R/D/C)

TEMP......................... temperature setup for all soldering phases (P/R)

(-) ............................... reduces value of parameter on display

(+) ............................... increases value of parameter on display

ENTER....................... stores parameter on display to memory

if pressed during soldering process: stops actual process and starts next

one

START........................starts soldering process

STOP.......................... stops actual sequence of soldering process and moves

transport frame to feeding position

Infrared reflow oven MR10

if pressed during parameter setup process: display shows the actual tem-

perature of heaters

Infrared reflow oven MR10

4. Soldering parameters setup

The following parameters can be defined for the different soldering profiles:

Process time:

F..... initial preheating time

P..... preheating time

R..... reflow time

D.....dwell time

C..... cooling time

Process temperatures:

P..... preheating heater temperature

R..... reflow heater temperature

Fig.5: soldering profile

4.1. Manual Profile Setup

For manual setup of soldering process the temperatures of both heater areas and the times, the

pcb will stay in them, have to be defined as follows:

4.1.1. Heater Profile Setup

For heater temperature setup proceed as follows:

Process

time

process

temp.

Infrared reflow oven MR10

Action, Key

System answer

→press PROFILE key until number of pro-

file to be altered is shown

→press TEMP key LCD shows actual temperature setup for P-

area

→press (+) or (-) key until right value is

shown on display

→press ENTER key previously defined setup parameters are

stored to memory

→press TEMP key LCD display proceeds to temperature setup

for R-area

→adjust display value with (+) and (-) key

→press ENTER key

4.1.2. Time Setup

For time setup proceed as follows:

Action, key

System answer

→press PROFILE key until LCD-

display

shows the number of the profile to be al-

tered

→press TIME key LCD display shows actual time setup (first

for phase F)

→press (+) or (-) key until right value is

shown on display

→press ENTER key previously defined setup parameters are

stored to memory

→press TIME key LCD display shows actual time setup for

next phase (P)

...procedure continues as before for all soldering phases.

4.2. Auto Profiling (MR10A only)

Auto profiling mode measures the actual temperature on PCB and compares it with the desired

value, thus determining, how long the PCB has to stay in the single heating areas. The actual

temperature is measured with means of an temperature probe plugged into the control panel of

MR10A, whose active end is fixed to the PCB while running through soldering process.

Before auto profiling mode both heater area temperatures have to be defined according to 4.1.1.

Then proceed as follows:

Infrared reflow oven MR10

Action, key

System answer

→press PROFILE key to reach desired

number of the profile

desired profile number

→press ENTER key for several seconds profile setup

→press TEMP key

LCD shows actual temperature setup for Tpl

(starting temperature for heating proc-

ess)

→adjust right value by pressing (-) or (+)

key

→press ENTER key stores adjusted value to memory

...procedure continues as before for defining the other profile temperatures TP2 (end of heating

process), TR(reflow temperature) and TC(cooling temperature).

→press START The transport frame goes into the heating

areas; control system displays actual time

and measured temperature on the PCB. On

the end control system displays 4 measured

times.

→press ENTER for memorise measured

time intervals or STOP to skip them

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