3.3.20 IPDS Version .........................................................................................................................23
3.4 COLOR MENU – Options Descriptions...................................................................................24
3.4.1 Color Management ................................................................................................................24
3.4.2 User CMYK Profile................................................................................................................24
3.4.3 User RGB Profile...................................................................................................................24
3.4.4 User Dest. Profile ..................................................................................................................25
3.4.5 RGB Grey to K.......................................................................................................................25
3.4.6 Preserve Black .......................................................................................................................25
3.4.7 Black Point Comp ..................................................................................................................25
3.4.8 Embedded ICC Prof...............................................................................................................25
3.4.9 HL Mapping Table.................................................................................................................26
3.4.10 OCA Mapping Table..............................................................................................................26
3.4.11 DEF REND INTENT..............................................................................................................27
3.4.12 CMOCA Options....................................................................................................................27
3.4.13 Remove User Files.................................................................................................................28
3.5 PAPER HANDLING Menu – Option Descriptions..................................................................29
3.5.1 Offset Stacking.......................................................................................................................29
3.5.2 UNIVERSAL SIZE..................................................................................................................29
3.5.3 OTHER ENV SIZE.................................................................................................................31
3.6 MAP INPUT TRAYS Menu Options .......................................................................................33
3.7 MAP OUTPUT BINS Menu Options .......................................................................................36
3.7.1 Descriptions of Output Bin Values.........................................................................................36
3.7.2 Descriptions of IPDS Bin Selection Numbers........................................................................37
3.7.3 Default Bin Mapping..............................................................................................................37
3.8 MARGINS Menu Options ........................................................................................................38
3.8.1 ALL INPUT TRAYS................................................................................................................40
3.8.2 TRAY 1 ADJUST....................................................................................................................40
3.8.3 TRAY 2 ADJUST....................................................................................................................40
3.8.4 TRAY 3 ADJUST....................................................................................................................41
3.8.5 TRAY 4 ADJUST....................................................................................................................41
3.8.6 TRAY 5 ADJUST....................................................................................................................42
3.8.7 MP FEEDER ADJUST...........................................................................................................42
3.8.8 MANUAL PAPER ADJ ..........................................................................................................43
3.8.9 MANUAL ENV ADJ...............................................................................................................43
3.9 RESOURCE CAPTURE Menu Options...................................................................................44
3.9.1 Capture Media .......................................................................................................................44
3.9.2 Capture Fonts ........................................................................................................................45
3.9.3 Capture Data Objects ............................................................................................................45
3.9.4 Capture CMR Objects............................................................................................................45
3.9.5 Remove Resources..................................................................................................................45
4Duplex Printing Using Preprinted Media.............................................................................47
5Finishing Support....................................................................................................................48
5.1 Offset Stacking..........................................................................................................................50
5.1.1 AS/400 and iSeries Offset Stacking........................................................................................50
5.1.2 Mainframe Offset Stacking.....................................................................................................51
5.2 Stapling.....................................................................................................................................53
5.2.1 AS/400 and iSeries Stapling...................................................................................................53
5.3 Mainframe Stapling...................................................................................................................60
5.4 Hole Punch................................................................................................................................63
5.4.1 Hole Punch From an Input Source ........................................................................................63
