Intel Q77 Manuel utilisateur
TECHNICAL MANUAL
Of
Intel Q77 Express Chipset
Based Mini-ITX M/B
NO. G03-NF9E-R11-F
Revision: 2.0
Release date: October 1, 2019
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................23
3-2 BIOS MENU SCREEN ................................................................................................24
3-3 FUNCTION KEYS .......................................................................................................24
3-4 GETTING HELP ..........................................................................................................25
3-5 MAIN BARS.................................................................................................................25
3-6 MAIN MENU................................................................................................................26
3-7 ADVANCED MENU.....................................................................................................27
3-8 CHIPSET MENU..........................................................................................................34
3-9 BOOT MENU...............................................................................................................39
3-10 SECURITY MENU.......................................................................................................40
3-11 SAVE & EXIT MENU...................................................................................................41
TABLE OF CONTENT
iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Date
2.0 2019-10-01
Item Checklist
Motherboard
Cable(s)
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
zIntel®Q77 express chipset
zSupports 3rd and 2nd Generation Intel®Core™ i7, Core™ i5, Core™ i3 series
processor in LAG1155 Package
zSupport 2 * DDRIII SO-DIMM 1066-1333 MHz up to 16GB and dual channel
function
zIntegrated with Intel®82574L and Intel®82579LM Gigabit Ethernet LAN chip
zIntegrated ALC662 6-channel HD Audio Codec
zSupport USB 3.0 data transport demands.
zSupport PCI Express x16 and Mini-PCIE slot
zIntegrated with 24-bit dual channel LVDS
z4* SATAII ports and 2* SATAIII ports
zHDMI, DVI-D and VGA Video Outputs
zSupport CPU Smart FAN
zSupports ACPI S3 Function
zCompliance with EuP Standard
zSupport Watchdog Timer Technology
2
1-2 Specification
Spec Description
Design zMini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm
Chipset zIntel Q77 Express Chipset
CPU Socket zSupports 3rd and 2nd Generation Intel® Core™ i7,
Core™ i5, Core™ i3 series processor in LAG1155 Package
* for detailed CPU support information please visit our website
Memory Slot
zDDRIII SO-DIMM slot x2
zSupport DDRIII 1066/1333 MHz DDRIII SO-DIMM
expandable to 16GB
zSupport dual channel function
Expansion Slot z1 pcs of PCI Express x16 slot
z1 pcs of Mini-PCIE slot
Dual LAN Chip
zIntegrated Intel®82574L and 82579LM Gigabit Ethernet
LAN chip that supportFast Ethernet LAN function of
providing 10/100/1000Mbps Ethernet data transfer rate
Audio Chip zRealtek ALC662 6-channel Audio Codec integrated
zAudio driver and utility included
BIOS z64M DIP Flash ROM
Multi I/O
zHDMI port connector x1
zVGA port connector x1
zDVI-D port connector x 1
zCOM port connector x 2
zUSB 3.0 port connector x2
zUSB 2.0 port connector x4
zRJ-45 LAN connector x2
zAudio connector x1 (Line-in, Line-out, MIC)
zUSB 2.0 header x1 (support two expansion USB 2.0 ports)
zUSB 3.0 header x1 (support two expansion USB 3.0 ports)
zSATAII Connector x4
zSATAIII Connector x2
zFront panel audio header x1
3
zKBMS header x1
zLVDS header x1
zLVDS Inverter header x1
zHDMI_SPDIF header x1
zGPIO header x1
zTX-RXCOM header x1
zCIR header x1
zNICLED header x2
zSpeaker header x1
zPWRLED header x1
zFront panel header x1
1-3 Layout Diagram
Rear IO Diagram
MIC-IN
VGA Port
Line-IN
Line-OUT
USB 3.0 Ports
HDMI Port
RJ-45 LAN Ports
DVI-D Port
USB 2.0 Ports
Serial Port
Serial Port
4
Motherboard Internal Diagram
*Note: PE1 slot supports PCI-Express 2.0 x16 specification when using Intel®Sandy Bridge CPU and
supports PCI-Express 3.0 x16 specification when using Intel®Ivy Bridge CPU.
USB 2.0 Heade
r
USB 3.0 Ports
over HDMI Port
ATX Powe
r
connecto
r
ATX 12V
Power Connecto
r
DDRIII SODIMM Slo
t
x 2
（DDRIII 1066
/
1333）
Speaker Header
DVI-D Port over
VGA Por
t
Audio Connecto
r
Intel LGA1155
CPU Socket
HDMI_SPDIF
Heade
r
GPIO Heade
r
Intel
Q
77 Chi
p
set
*PCI Express x16 Slot (PE1)
CPUFAN
H
eade
r
RJ-45 Port over
USB 2.0 Ports
LVDS Heade
r
SATAII Ports
(SATA3/4/5/6)
PWRLED Header
Front Panel
Audio Heade
r
Front Panel Heade
r
SYSFA
N
2
Header
SYSFA
N
1 Heade
r
B
atter
y
Connector
CIR Heade
r
SATAIII Ports
(
SATA1
/
2
)
TX-RX COM
Header
RJ-45 Port over
USB 2.0 Ports
Serial Ports Inverte
r
KBMS Heade
r
M
ini-PCIE Slo
t
USB 3.0 Heade
r
N
ICLED Heade
r
5
Motherboard Jumper Position
Audio Chip
JBAT
J
P5
JP2
LAN Chi
p
JP1
JP4
JP
6
CASE_OPEN
JP3
JP
9
LAN Chi
p
Table des matières
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