Intel H61 Express Manuel utilisateur

USER'S MANUAL

Intel H61 Express Chipset

Based

M/B for Intel LGA 1155 Processors

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

NO. G03-TI61AG-F

Rev: 1.0

Release date: July, 2011

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in any

area where it may become wet.

z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of

the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact malfunction

and crackles due to constant thermal expansion and contraction from the welding

spots’ that connect components and PCB. Computer should go through an adaptive

phase before it boots when it is moved from a cold environment to a warmer one to

avoid condensation phenomenon. These water drops attached on PCB or the surface

of the components can bring about phenomena as minor as computer instability

resulted from corrosion and oxidation from components and PCB or as major as short

circuit that can burn the components. Suggest starting the computer until the

temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer. Using

the close case may decrease the life of other device because the higher temperature in

the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution

and ensure environment protection of mother earth, please recycle.

CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS ........................1

1-1 FEATURES OF MOTHERBOARD................................................................1

1-1.1 SPECIAL FEATURES OF MOTHERBOARD .................................1

1-2 ISPECIFICATION..........................................................................................2

1-3 LAYOUT DIAGRAM......................................................................................3

CHAPTER 2 HARDWARE INSTALLATION ............................................................4

2-1 CPU INSTALLATION ..................................................................................4

2-2 MEMORY MODULE INSTALLATION...........................................................5

2-3 EXPANSION SLOTS.....................................................................................6

CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING............................6

3-1 MOTHERBOARD INTERNAL CONNECTORS ..................................................6

3-2 I/O BACK PANEL CONNECTORS.....................................................................8

3-3 HEADERS...........................................................................................................9

3-4 JUMPER SETTING.............................................................................................12

CHAPTER 4 USEFUL HELP....................................................................................13

4-1 HOW TO UPDATE BIOS ....................................................................................13

4-2 TROUBLE SHOOTING.......................................................................................13

CHAPTER 5 THUNDER PROTECTION FEATURE.................................................14

TABLE OF CONTENT

Chapter 1

Introduction of Intel H61 Motherboards

1-1 Features of Motherboard

The Intel H61 Express chipset based motherboard series are based on Intel H61

Express chipset technology which supports the innovative Intel LGA 1155 socket

Intel® Core™ i7, Intel® Core™ i5, Core™ i3.

The Intel H61 Express chipset based motherboard series comes with an integrated

DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system

memories which are expandable to 8 GB capacity.

The motherboard provides four serial ATA2 interfaces of 3.0 Gb / s data transfer rate

for four serial ATA devices.

The H61 Express chipset Based motherboard provides Gigabit LAN function by using

megabit LAN chip which support 10M / 100M /1000M/S data transfer rate. Embedded

6-channel HD CODEC is fully compatible with Sound Blaster Pro®standards that

offer you with the home cinema quality and absolutely software compatibility.

The H61 Express chipset based motherboard series offer one PCI-Express 2.0 x16

graphics slot and three PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity

for the I/O of peripherals.

Embedded USB controllers as well as capability of expanding to 10 of USB functional

ports these motherboards meet the future USB demands which are also equipped

with hardware monitor function on system to monitor and protect your system and

maintain your non-stop business computing.

Features like OC-CON Solid Capacitors also provide extra protection to the

motherboard to extend product life and ensure system stability.

1-1-1 Special Features of motherboard

CPU Vcore Input and Output adopt OC-CON solid capacitors. (High-polymer

Solid Electrolysis Aluminum Capacitors)

OC-CON solid capacitors make it possible for motherboard to work from 55 degrees

Centigrade below zero to 125 degrees centigrade.OC-CON capacitors possess

superior physical characteristics to prolong product life ten times than corresponding

motherboard without capacitors every time working temperature increases 20

degrees. Life of product of motherboard with solid capacitors declines only 10% of

those without solid capacitors as well under same conditions.

1-2 Specification

Spec Description

Design zATX form factor; PCB size:29.5CMx20.0 cm

Chipset zIntel H61 Express Chipset

CPU Socket

zsupports the innovative Intel LGA 1155 socket Intel®

Core™ i7, Core™ i5, Core™ i3 Processor

* For more detailed CPU support information please visit our website

Memory Sockets

zDDRIII module slot x 2

zSupport 2pcs DDRIII 1066/DDRIII 1333 memory modules

expandable to 8 GB

zSupport dual channel function

Expansion Slots z1pcs* PCI-Express2.0 x16by16 lane slot

z3pcs* PCI-Express2.0 x1 slots

Serial ATA2 zThe Intel H61chipset supports four internal Serial ATA

ports for four SATA devices providing 3.0 Gb/sec data

transfer rate

LAN Chip

zIntegrated PCI-E Gigabit LAN chip

zSupports Fast Ethernet LAN function provide

10Mb/100Mb/1000Mb/s data transfer rate

6-CH HD Audio z6-channel HD Audio Codec integrated

zAudio driver and utility included

BIOS zAMI 32MB SMT Flash ROM

Multi I/O

zPS/2 keyboard connector x1

zPS/2 mouse connector x1

zVGA connector x1

zDVI connector x1

zHDMI connector x1

zUSB 2.0 port x6 (for TI61AG series)

zUSB 2.0 port x4 and USB 3.0 port x 2 (for TI61AG3 series)

zUSB 2.0 header x2

zRJ-45 LAN connector x1

zAudio connector x1 (6-CH Audio)

zFront panel audio header x1

zHDMI-SPDIF header x1

zFront panel header x1

zPWRLED header x1

zSpeaker header x1

zSerial Port headerx1

zLPC_CON header x1

Item Checklist

zMotherboard

zDVD for motherboard utilities

zUser’s Manual

zSATA Cable(s)

zI/O back panel shield

1-3 Layout Diagram

CPU Socket ATX Power Conn.

CPU FAN1 Header

Front Panel Audio Header

USB 2.0 Headers

SYSFAN1 Header

ATX 12V

Power Connector

Line-IN

MIC-IN

PS/2 Keyboard

Port

VGA Port

DDRIII Slot x 2

Optional USB 2.0 or

USB 3.0 ports

JBAT1

SATAII Connecto

(SATA 1, 2, 3, 4)

Audio Connector

COM Header

PCI Express 2.0 x16 by 16 Lane slot

Line-OUT

KB/MS Powe

(

JP1

)

HDMI port

6-CH HD Audio Chip

HDMI-SPDIF Header

Front Panel Header

Intel H61 Chipset

PCI Express 2.0 x1 slots

Gigabit LAN Chip

DVI Port

VGA port over

DVI port

Power LED Header

Speaker Header

USB 2.0 Ports

LPC_CON Header

RJ-45 LAN Port

RJ-45 over

USB 2.0

orts

PS/2 Mouse

Port

HDMI Port

Optional

USB 2.0 /3.0 Ports

PS/2 MS over

PS/2 KB port

USB 2.0 ports

Chapter 2

Hardware Installation

WARNING! Turn off your power when adding or removing expansion cards or

other system components. Failure to do so may cause severe

damage to both your motherboard and expansion cards.

2-1 CPU Installation

This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,

referred to as the LGA 1155 socket.

The CPU that comes with the motherboard should have a cooling FAN attached to

prevent overheating. If this is not the case, then purchase a correct cooling FAN

before you turn on your system.

NOTED! Be sure that there is sufficient air circulation across the processor’s

heat sink and CPU cooling FAN is working correctly, otherwise it

may cause the processor and motherboard overheat and damage,

you may install an auxiliary cooling FAN, if necessary.

To install a CPU, first turn off your system and remove its cover. Locate the LGA

1155 socket and open it by first pulling the level sideways away from the socket then

upward to a 135-degree angle. Insert the CPU with the correct orientation as shown

below. The notched corner should point toward the end of the level. Because the

CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation

as shown.

When you install the CPU into the LGA 1155 socket, there’s no force required CPU

insertion; then presses the level to locate position slightly without any extra force.

Pin-1 Indicator

Ali

nment ke

2-2 Memory Module Installation

This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES

(DIMM) socket for DDR III memory expansion available to maximum memory volume

of 8 GB DDRIII SDRAM.

Valid Memory Configurations

Bank 240-Pin DIMM PCS Maximum Capacity

DIMM1 DDR III 1066/ DDR III1333 X1 4GB

DIMM2 DDR III 1066/ DDR III1333 X1 4GB

Total System Memory (Max 4GB) 2 8GB

Recommend DIMM Module Combination

：

1. One DDRIII Memory Module ----Plug in DIMMM1.

2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function

Dual channel Limited!

1. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1

& DIMM2.

2. Memory modules plugged in the same color DIMM must be of the same type, same

size, and same frequency for dual channel function.

Install DDR SDRAM modules to your motherboard is not difficult, you can refer to

figure below to see how to install DDRIII 1066/DDRIII 1333 SDRAM module.

DIMM2(BANK2+BANK3)

DIMM1(BANK0+BANK1)

DIMM1 & DIMM2: Dual Channel

NOTE! When you install DIMM module fully into the DIMM socket the eject

tab should be locked into the DIMM module very firmly and fit into its

indention on both sides.

Installation Tips：

Open the two plastic clips of memory slots then push down the module

vertically into the slot. See to it that the hole of the module fit into the notch of

the slot;

The two plastic clips will automatically close if the memory module is fitted in a

proper way.

2-3 Expansion Slots

The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16

graphics slot and three PCI Express 2.0 x1 I/O slots guarantee the rich connectivity

for the I/O of peripherals.

Chapter 3

Connectors, Headers &Jumper Setting

3-1 Motherboard Internal Connectors

(1) Power Connector (24-pin block): ATXPWR1

ATX Power Supply connector: This is a new defined 24-pins connector that

usually comes with ATX case. The ATX Power Supply allows using soft power

on momentary switch that connect from the front panel switch to 2-pins Power

On jumper pole on the motherboard. When the power switch on the back of the

ATX power supply turned on, the full power will not come into the system board

until the front panel switch is momentarily pressed. Press this switch again will

turn off the power to the system board.

** We recommend that you use an ATX 12V Specification 2.0-compliant power

supply unit (PSU) with a minimum of 350W power rating. This type has 24-pin

and 4-pin power plugs.

** If you intend to use a PSU with 20-pin and 4-pin power plugs, make sure that the

20-pin power plug can provide at least 15A on +12V and the power supply unit

has a minimum power rating of 350W. The system may become unstable or may

not boot up if the power is inadequate.

** If you are using a 20-pin power plug, please refer to Figure1 for power supply

connection. Power plug form power supply and power connectors from

motherboard both adopt key design to avoid mistake installation. You can insert

the power plug into the connector with ease only in the right direction. If the

direction is wrong it is hard to fit in and if you make the connection by force if is

possible.

PCI-E 2.0 x1 Slot

PCI-E 2.0 x1 6 by 16 Lane Slot

Figure1：20-pinpowerplug Figure2：24-pin power plug

(2) ATX 12V Power Connector (8-pin block) : ATX12V1

This is a new defined 8-pin connector that usually comes with ATX Power

Supply. The ATX Power Supply which fully supports LGA 1155 processor must

including this connector for support extra 12V voltage to maintain system power

consumption. Without this connector might cause system unstable because the

power supply can not provide sufficient current for system.

Pin 1

(3) SATA2 Port connectors: SATAII-1~SATAII-4

These connectors support the provided SATA hard disk cable to connect the

motherboard and SATA2 hard disk drives.

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