Intel Celeron 847 Manuel utilisateur
TECHNICAL MANUAL
Of
Intel Celeron 847 + Intel NM70 Chipset
Based Mini-ITX M/B
NO. G03-NC9Q-F
Revision: 1.0
Release date: March 26, 2013
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................22
3-2 BIOS MENU SCREEN ................................................................................................23
3-3 FUNCTION KEYS .......................................................................................................23
3-4 GETTING HELP ..........................................................................................................24
3-5 MAIN BARS.................................................................................................................24
3-6 MAIN MENU................................................................................................................25
3-7 ADVANCED MENU.....................................................................................................26
3-8 CHIPSET MENU..........................................................................................................32
3-9 BOOT MENU...............................................................................................................36
3-10 SECURITY MENU.......................................................................................................38
3-11 SAVE & EXIT MENU...................................................................................................41
TABLE OF CONTENT
iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition 2013-03-26
Item Checklist
5Motherboard
5DVD for motherboard utilities
5User’s Manual
5Cable(s)
5I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
zIntel®Celeron 847 processor+ Intel®NM70 express chipset
zSupport 2 * DDRIII SO-DIMM 1066/1333 MHz up to 16GB and dual channel
function
zSupport PCI Express 2.0 x16 slot and Mini-PCIE/mSATA slot
zIntegrated with two 24-bit dual channel LVDS headers
zSupport 2 * Serial ATAII (3Gb/s) & 1 * Serial ATAIII (6Gb/s) Devices
zSupport 2 * COM ports (COM1 for RS232/422/485)
zHDMI, DVI-D and VGA Video Outputs
zSupport CPU Smart FAN
zSupports ACPI S3 Function
zCompliance with EuP Standard
zSupport Watchdog Timer Technology
zSupport Windows8 OS
2
1-2 Specification
Spec Description
Design z6-layer Mini-ITX form factor ;
zPCB size: 17.0x17.0cm
Embedded CPU zIntel®Celeron 847 Dual Core Processor (1.1GHz)
Chipset zIntel®NM70 Express Chipset
Memory Slot
zDDRIII SO-DIMM slot x2
zSupport DDRIII 1066/1333 MHz DDRIII SO-DIMM
expandable to 16GB
zSupport dual channel function
Expansion Slot z1 pcs of PCI Express x16 slot
z1 pcs of full-size Mini-PCIE/mSATA slot
LAN Chip
zIntegrated with Realtek RTL8111F PCI-E Gigabit LAN chip
zSupport Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip zRealtek ALC662 6-channel Audio Codec integrated
zAudio driver and utility included
USB 3.0 Chip zIntegrated with Asmeida ASM1042 PCI-E to SuperSpeed
USB Host Controller
BIOS z32M DIP Flash ROM
Multi I/O
Rear Panel I/O:
zHDMI port connector x1
zUSB 3.0 port connector x2
zCOM port connector x 2
zDVI-D port connector x 1
zVGA port connector x1
zUSB 2.0 port connector x4
zRJ-45 LAN connector x1
zAudio connector x3 (Line-in/SPDIF-out, Line-out, MIC)
Internal I/O Connectors& Headers
z24-Pin ATXPWR connector x 1
3
z4-Pin ATX12V connector x 1
zSATAII Connector x2
zSATAIII Connector x1
zFront panel audio header x1
zLANLED header x1
zCIR header x1
zGPIO header x1
zPS2 KB&MS header x1
zFront panel header x1
z9-Pin USB 2.0 header x1 (support two expansion USB 2.0
ports)
z4-Pin USB 2.0 header x1 (support one expansion USB 2.0
ports)
z24- bit Dual channel LVDS header x2
zLVDS Inverter header x2
1-3 Layout Diagram
Rear IO Diagram
MIC-IN
VGA Port
Line-IN/SPDIF-OUT
Line-OUT
HDMI Port
RJ-45 LAN Port
DVI-D Port
USB 2.0 Ports
Serial Port
USB 3.0 Ports
Serial Port
4
Motherboard Internal Diagram
USB 2.0 Heade
r
ATX Powe
r
connecto
r
DDRIII SODIMM Slot x 2
（DDRIII 1066
/
1333）
DVI-D Port
over VGA Port
Audio Connecto
r
Intel Celeron
847 CPU
Intel NM70 Chi
p
set
PCI Express 2.0 x16 Slot
LVDS1 Heade
r
Front Panel
Audio Heade
r
Front Panel Heade
r
CPUFAN Header
SATAII Ports
(
SATA2/3
)
RJ-45 Port over
USB 2.0 Ports
Serial Ports
M
ini-PCI
E
/mSATA
Slot
USB 3.0 Ports
over
HDMI Port
INVERTER2
SYSFA
N
1
H
eade
r
SATAIII Port
(
SATA1
)
LAN Activity
LED Header
USB 2.0 Ports
ATX12V
Powe
r
connecto
r
S
YSFAN2 Header
GPIO
Heade
r
LVDS2 Heade
r
INVERTER1
PS2_CON Header
CIR Header
5
Motherboard Jumper Position
JBAT
JP
3
JP1
JP
6
COPEN
JP
5
JP
8
JP
4
JP2
J
P
7
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