Infineon HybridPACK 2 Guide de l'utilisateur

Application Note AN 2010-08

V2.0, August 2010

HybridPACK™ 2

General Information and Mounting Instruction

IFAG ATV OPEV

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

Edition 2010-08-10

Published by

Infineon Technologies AG

59568 Warstein, Germany

Attention please!

THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE

IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE

REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR

QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION

NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON

TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND

(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL

PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN

IN THIS APPLICATION NOTE.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types

in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components

may only be used in life-support devices or systems with the express written approval of Infineon

Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-

support device or system, or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body, or to support and/or maintain and

sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other

persons may be endangered.

AN 2010-08

Revision History: date (10-08-10) V2.0, Previous Version: V1.0, November 2009

All Pages: Used new template. , Page 4 and 5: Added Chapter ” Proposal for Designing a Driver Board”

Page 7: Changed name of the JST connector from "09HVD4B-EMGF-SR" to "09HVD6B-EMGF-NR".

Page 9: Added comment ”IFX does not recommend the usage of a silicon gasket for sealing.”

Page 11: Changed drawing “A design example of fluid cooling system”

Page 14: Updated Figure 10

Author: Vase Klandjevski ( IFAG ATV OPEV AE )

We Listen to Your Comments

Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will

help us to continuously improve the quality of this document. Please send your proposal (including a

reference to this document) to: [IGBT.Application@infineon.com]

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

Table of Contents

1Introduction ...................................................................................................................................4

2Proposal for Designing a Driver Board ......................................................................................4

3Mounting a Driver Board onto the Module .................................................................................6

4Application of the Liquid Cooling System .................................................................................9

5Screws to Mount the Module to the Heat Sink.........................................................................12

6Mounting the Module to the Heat Sink .....................................................................................13

7Connecting the Bus Bars to the Power Terminals ..................................................................14

7.1 Connecting the Power Terminals with Ideal Strain Relief ......................................................15

8Storage and Transport ...............................................................................................................16

9Data Matrix (DMX) Part Marking ................................................................................................17

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

1 Introduction

The operation of high power modules results in power losses, which have to be dissipated

via a heat sink so that the maximum permissible temperature specified in the data sheet will

not be exceeded. Therefore, the mounting process of power modules is vital, because it

affects the module’s thermal performance and furthermore its reliability, which is critical for

automotive applications.

This application note gives mounting instructions for HybridPACKTM 2 module with

recommendations how to screw the module, assemble the PCB and mount the module onto

the heat sink.

Please also note that ground straps should be worn while working with the components and

valid ESD safety instructions should be followed at all time, since IGBT modules are

electronic-static sensitive components. In addition, maximum permissible values in the

product datasheet and application notes are absolute limits which generally, even for short

times, may not be exceeded as this may lead to destruction of the component. Moreover, this

application note cannot cover every type of application and condition. Hence, the application

note cannot replace a detailed evaluation and examination by you or your technical divisions

of the suitability for the targeted applications. The application note will, therefore, under no

circumstances become part of any supplier agreed warranty, unless the supply agreement

determines otherwise in writing.

2 Proposal for Designing a Driver Board

Based on the HybridPACK™ 2 dimensions a proposal for designing a driver board can be

offered (see Figure 1). The end-hole diameter for the module solder pin connection should

be 0,0

25,0

35,1 −

+mm should be taken.

PLEASE NOTE: The drawing below offers a proposal for solder pin connection based driver

board and therefore it is not binding. Detailed evaluation and examination by you or your

technical divisions must be done in order to verify the suitability of this proposal.

When designing a driver board which uses connectors (E.g. JST connector type "09HVD6B-

EMGF-NR") the geometry and the footprints of the connector must be taken in to account.

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

0,0

25,0

35,1

−

Figure 1 Proposal for designing a driver board for HybridPACK™ 2 module.

2010-03

2009 Application Note AN 2010-08

V2.0,

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3 Mounting a Driver Board onto the Module

The driver board could be mounted in two ways: through connectors (strongly

recommended) or alternative directly soldering on the top of the module.

When a driver board or module adapter board (PCB) is soldered directly on top of the

module, the contact joints (=solder connections) between PCB and module auxiliary contacts

should be mechanically relieved as much as possible. Relieve of the contact points is carried

out by mounting the PCB directly onto the module at the eight mounting stand-offs (Figure 2)

using self-tapping (thread forming) screws or similar assembly material. The length of the

used self-tapping screws is depended on the PCB thickness. Example: For mounting a PCB

with 1.6mm thickness a self-trapping screw with 3 mm diameter and 10mm length should be

used for example type Delta PT 30x10 from EJOT.

Position of the mounting

„self-tapping“ screws

Position of the guidance

holes

Figure 2 PCB mounting stand-off of HybridPACK™ 2 module.

The screws should be mounted in the sequence showed in Figure 2. The initial 1.5mm of the

mounting stand-off serve as guidance only and cannot take any force. The thread in the

plastics will form itself by driving in the screws. Apart from manually driving the screws into

the mounting stand-offs an electronically controlled or at least slowly turning electric

screwdriver (≤300rpm) is a preferred aid (due to the lack of accuracy we do not recommend

the use of pneumatic screwdrivers). The maximum applied force Mmax is 0.9Nm ±10%. The

effective length of the screw thread entering the mounting stand-off should be of a minimum

length of lmin≥6mm and a maximum length of lmax≤9mm giving consideration to the PCB

thickness and the weight of the driver PCB.

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

The HybridPACK™ 2 offers two guidance holes marked on the Figure 2 with the colour blue.

These guidance holes offer assistance by mounting the PCB on the module and allow

automated assembly.

To avoid damage or splitting of the stand-off, straight insertion of the screw into the stand-off

has to be observed during assembly (Figure 3).

A. Correctly assembled B. Incorrectly positioned screw

Figure 3 (A) Correctly assembled screw into the mounting stand-off.

(B) Incorrectly positioned screw into the mounting stand-off.

The recommended screws and torques are based on laboratory tests. Depending on screws

and tools used, it may be necessary to adapt the assembly process accordingly.

After mounting the PCB the solder process (manual soldering, selective soldering or wave

soldering) may begin. When adhering to this sequence of assembly, the mechanical strain to

the solder points can be minimised.

During the entire soldering process care needs to be taken that neither a too high soldering

temperature nor a too long process time at the auxiliary pins overheats the plastic case and

thus deforms it.

According to IEC 68 section 2, a maximum solder temperature of T=260°C for a maximum

process time of tmax≤10s has to be observed during the solder process.

Further information regarding solder processes can be referred to the application note

AN2005-06 “Soldering Econo und Easy modules”.

Instead of directly soldering, the PCB could also be mounted onto the module through

connectors. Such electrical connection between PCB and module can use every connector

which is designed for a pin cross-section of 0,64 x 0,64 mm, especially JST connector type

"09HVD6B-EMGF-NR". The module auxiliary terminals (pin connectors) are designed

especially for fitting to the JST connectors (surface and dimensions).

PCB

Modul

screw

PCB

Modul

screw

PCB

Modul

screw

PCB

Modul

screw

Modul

screw

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

Figure 4 Technical drawing of the HybridPACKTM 2 auxiliary terminals (pin connectors).

The picture above shows the dimension and the structure of the auxiliary terminals. Due to

the specific requirements of the JST connector the auxiliary terminals have the following

properties:

•The auxiliary terminals are made of 63% IACS (International Annealed Copper

Standard) copper material,

•Auxiliary terminals have gold (Au) surface with nickel (Ni) under plating,

•The tensile strength of the auxiliary terminals has to be equal or exceed 530MPa,

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

4 Application of the Liquid Cooling System

The power loss occurring in the module has to be dissipated in order not to exceed the

maximum permissible temperature specified in the datasheet during switching (Tvj_op = 150

°C) in operation. Therefore, the design of cooling system/heat sink is of great importance to

achieve good performance.

HybridPACKTM 2 differs from other power modules because of pin-fin array on the base plate,

which makes liquid cooling very effective in sense of thermal performance. The base plate is

made of copper (Cu) material with nickel (Ni) plating. The pin fin structure is suitable for

cooling fluids like water/ethylenglycol mixture.

PLEASE NOTE: During the mounting process damages of the nickel plating and mechanical

deformation of the pin fin structure should be strictly avoided.

As shown in the figure below the pin-fin array is on the module base plate to get maximum

heat exchange effect. An O-ring sealing type (202 x 64.2 x 3 )mm e.g. from company

Trelleborg (part number DRYD001590E768U) should be utilized on the heat sink in order to

confirm waterproof of the fluid cooling system. Such O-ring is held in a groove, which

surrounds the tray that holds the pin fin array, and this groove should be restricted to the

region on the heat sink that corresponds to the region around the pin fin structure see the

drawings below. With in this region there should be no contamination, scratches or other

base plate damages.

PLEASE NOTE: IFX does not recommend the usage of a silicon gasket or other sealing

methods. The usage of sealing methods different then O-ring may cause damage on

HybridPACK™ 2 module.

Figure 5 Technical drawing of HybridPACKTM 2 bottom side.

2010-03

2009 Application Note AN 2010-08

V2.0,

ust 2010

Figure 6 “X”- section Detail drawing of the HybridPACKTM 2 bottom side. The

sealing surface corresponds to the O-ring holding groove.

The suggested dimension of the tray holding the pin fin array is depicted in Figure 7a with

specified tolerances.

The contact surfaces between the base plate of the module and the surface of the heat sink

have to be free of degradation and contamination and should be cleaned with a fresh, lint

free cloth.

PLEASE NOTE: No thermal grease is needed for mounting the HybridPACKTM 2 on the

cooler.

The contact surface of the heat sink should not exceed the following values referenced to a

length of L=100mm:

Surface flatness ≤50µm

Surface roughness Rz ≤10µm

Surface roughness at the sealing surface Ra ≤1.6µm

The heat sink has to be of sufficient stiffness for the assembly and the subsequent transport

in order not to exert additional straining or pulling forces to the base plate of the module.

During the entire assembly process the heat sink has to be handled twist free.

An example of fluid cooling system design could be referred to datasheet of HybridPACKTM 2

and Figure 7. This cooling system is designed for O-ring sealing from Trelleborg with part

number DRYD001590E768U.

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