ILumi MESHTEK-H52E Manuel utilisateur

……………..

MESHTEK-H52E

FEATURES

Simple & fast integration with development

kits and sample iOS & Android API

Built-in reliable Connection based mesh to

support large data packets, Mesh Network

(Node and Bridge) for Android

Long-range, module connectivity up to 100

meters

Compact form factor 15.24mm X 17.60mm X

3mm

Castellated SMT pads for easy and reliable

PCB mounting

Over the Air firmware update from one

device to an entire network

32-bit ARM® Cortex™ M4F nRF52832 CPU

Proximity support for beacon and location

based services

No. of GPIOs available for user - 11

Configurable I/O mapping for analog and

digital

Simultaneous master and slave operation

*Certifications: FCC, IC (In progress)

RoHS compliant

OPERATIONAL

•Operating voltage range: 1.7V to 3.6VDC

•Temperature range: -40°C to 85°C

•Low-power consumption

•Interface: SPI, UART, I2C

•512KB flash and 64KB RAM

APPLICATIONS

Lighting fixtures

Automotive

Home Automation

Power plugs, routers

Internet of Things (IoT)

Industrial Control

DESCRIPTION

With the smartest and most robust Bluetooth

Mesh Network technology on the market, ilumi’s

MeshTek provides an elegant and affordable

solution for manufacturers looking to quickly and

reliably bring BLE enabled IoT products to market.

The MESHTEK-H52E Smart Mesh Module with IPX

antenna allows users to connect External Antenna

which is required for various applications. This

complete platform solution includes software

drivers, sample applications, API guide, user

documentation and a world-class support.

The MESHTEK-H52E internal controller can be used

for applications up to 64KB flash; without the need

for external host MCU or software development

tools.

MESHTEK-H52E Bluetooth Module

with External Antenna

MESHTEK-H52E

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TABLE OF CONTENTS

1. DEVICE OVERVIEW ........................................................................................................................ 4

2. GENERAL SPECIFICATIONS ............................................................................................................ 6

3. PHYSICAL DIMENSIONS................................................................................................................. 7

4. LAYOUT AND MOUTING GUIDELINES ........................................................................................... 7

5. REGULATORY APPROVAL .............................................................................................................. 9

5.1. FCC AND IC COMPLIANCE ............................................................................................................. 9

5.1.1. FCC STATEMENT............................................................................................................................ 9

5.1.2. IC COMPLIANCE............................................................................................................................. 9

5.1.3. CONFORMITÉ AUX NORMS D´IC ................................................................................................. 10

5.1.4. OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ......... 10

5.1.5. OEM LABELING REQUIREMENTS FOR END PRODUCT ................................................................ 10

6. PRODUCT HANDLING.................................................................................................................. 12

6.1. SOLDER REFLOW PROFILE........................................................................................................... 12

7. PACKAGING AND LABELLING ...................................................................................................... 13

7.1. PACKAGING................................................................................................................................. 13

7.2. PACKAGING LABEL ...................................................................................................................... 13

8. ORDERING INFORMATION.......................................................................................................... 13

9. REVISION HISTORY ...................................................................................................................... 13

Table 1: PINOUT DRESCPTION ......................................................................................................................5

Table 2: ELECTRICAL SPECIFICATIONS........................................................................................................... 6

Table 3: MESHTEK-H52E FCC and IC Conformity .......................................................................................... 8

Table 4: ORDERING INFORMATION ............................................................................................................12

Figure 1: MESHTEK-H52E BLOCK DIAGRAM..................................................................................................4

Figure 2: MESHTEK-H52E PINOUT ................................................................................................................ 4

Figure 4: MESHTEK-H52E FOOTPRINT ..........................................................................................................7

Figure 5: REFLOW PROFILE ...........................................................................................................................7

MESHTEK-H52E

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TO OUR VALUED CUSTOMERS

It is our intention to provide you, our valued customer, with the best possible documentation to ensure

successful use of your MeshTek products. To this end, we will continue to update our publications to better

suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced.

Please note: images used in the manual are for reference purposes and may be different than the actual

product.

If you have any questions or comments regarding this publication, please contact the Marketing

Communications Department via Email at sales@ilumisolutions.com. We welcome your feedback.

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended

workarounds, may exist for current devices. As device/documentation issues become known to us, we will

publish an errata sheet. The errata will specify the revision of silicon and revision of the document to which it

applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

Contact the MeshTek team

Contact your local MeshTek sales representative

When contacting a sales office, please specify which device, revision of MeshTek-H52E data sheet (include

literature number) you are using.

MESHTEK-H52E

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1. DEVICE OVERVIEW

The MESHTEK-H52E Bluetooth Low Energy RF module integrates Bluetooth radio baseband, 32-bit MCU, digital

analog I/O, onboard MeshTek stack. Figure 1 shows the module’s Block diagram. Figure 2 shows the module’s

pinout and the description is shown in Table 1.

Figure 2: MESHTEK-H52E PINOUT

Figure 1: MESHTEK-H52E BLOCK DIAGRAM

Figure 1: MESHTEK-H52 PINOUTFigure 2:MESHTEK-H52 BLOCK

DIAGRAM

BLE

ARM Cortex M4F

CPU I/O

32MHz

Xtal

VDD (DC 1.7V to 3.6V)

SWD (2)

Programming Pins

I/O (11)

GND

Power

Amplifier

Band Pass

Filter

u.FL Connector

MESHTEK-H52E

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MESHTEK-H52E has u.FL connector present on the module, an external antenna with mating part needs to be

connected to the module.

Table 1: PINOUT DESCRIPTION

Sr. No.

Pin out

Pin Function

Description

GND

Power

Ground (0 V)

VDD

Power

Power Supply

P0.26

Digital I/O

General purpose I/O pin.

P0.27

Digital I/O

General purpose I/O pin.

P0.28

(AIN4)

Digital I/O

Analog input

General purpose I/O pin

SAADC/COMP/LPCOMP input

P0.29

(AIN5)

Digital I/O

Analog input

General purpose I/O pin

SAADC/COMP/LPCOMP input

P0.30

(AIN6)

Digital I/O

Analog input

General purpose I/O pin

SAADC/COMP/LPCOMP input.

P0.21

(RESET)

Digital I/O

General purpose I/O pin

Configurable as pin reset

P0.18

(TRACEDATA[0] /

SWO)

Digital I/O

General purpose I/O pin

P0.17

(MI2C_DATA)

Digital I/O

Digital output

General purpose I/O pin

I2C Data out

SWDCLK

Digital input

Serial Wire Debug clock input for debug and programming

SWDIO

Digital I/O

Serial Wire Debug I/O for debug and programming

P0.13

Digital I/O

General purpose I/O pin

P0.12

Digital I/O

General purpose I/O pin

P0.11

Digital I/O

General purpose I/O pin

Note: For more details, check out nRF52832 (QFN48) Cortex ARM M4F controller specifications

MESHTEK-H52E

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2. GENERAL SPECIFICATIONS

Table 2 provides the general specifications for the module and current consumption.

Table 2: ELECTRICAL SPECIFICATIONS

ELECTRICAL SPECIFICATIONS

Description

Min

Nom

Max

Notes

VDD - Supply Voltage

1.7V

3.0V

3.6V

Operating Temperature Range

-40 °C

85 °C

ESD - Human Body Model Class 2

4 kV

Built-in Crystal Frequency

32 MHz

Crystal Frequency Tolerance

+/- 10ppm

Reset pin time for successful reset

60 msec

Radio Operating Frequencies

2.402GHz 2.480 GHz

Radio On-Air Data Rate

1 Mbps

2 Mbps

Radio Output Power

+19dBm

RF output power

configured to +19dBm

using external PA in

continuous TX Mode

Receiver Sensitivity @ BLE Mode

-96 dBm

Ideal transmitter

Radio RSSI Accuracy

+/- 2 dB

UART Baud Rate

1000 kbps

SPI Bit Rate

0.125 Mbps

8 Mbps

TWI Bit Rate

100 kbps

400 kbps

Analog-to-Digital Converter (ADC)

Range

VDD

8/10/12-bit ADC

VIH –Input High Voltage

0.7 * VDD

VDD

VIL –Input Low Voltage

VSS

0.3 * VDD

VOH –Output High Voltage

VDD –0.4

VDD

VOL –Output Low Voltage

VSS

VSS + 0.4

Output standard drive current

20 mA

Pull-up resistance / Pull-down

resistance

11k

13k

16k

Transmit Current

90mA

+19dBm output Power

Receive Current

24.8mA

Radio RX Active

System ON, No RAM retention,

Wake on any event

1.2uA

System ON, Full RAM retention,

Wake on any event

1.5uA

MESHTEK-H52E

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3. PHYSICAL DIMENSIONS

Figure 4 shows the size and footprint for MeshTek-H52E module

Figure 4: MESHTEK-H52E FOOTPRINT

4. LAYOUT AND MOUTING GUIDELINES

We recommend 2 or more layers for the Carrier Board (Host PCB). The top side shall be mostly ground.

Signal routing shall be done in the bottom or middle layers.

When laying out the Carrier board for the MESHTEK-H52E module, the areas under the antenna and

shielding connections should not have signal traces, ground planes or exposed vias.

For the best Bluetooth range performance, the antenna area of module shall extend 6.3mm outside

the edge of Carrier Board or 6.3mm outside the edge of a ground plane.

For the best Bluetooth range performance, keep all external metal away from the antenna area.

MESHTEK-H52E

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MESHTEK-H52E

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5. REGULATORY APPROVAL

5.1. FCC and IC Compliance

The MESHTEK-H52E module conforms to the product specifications listed in below Table 4.

Table 3: MESHTEK-H52E FCC and IC Conformity

Standard

FCC

FCC part 15 Subpart C Section 15.249

MESHTEK-H52E FCC ID: 2AEHU-MESHTEK-H52E

Industry Canada RSS-210

Industry Canada RSS-Gen

MESHTEK-H52E IC: 20059-MESHTEKH52E

5.1.1. FCC Statement

This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation. This equipment

generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the

instructions, may cause harmful interference to radio communications. However, there is no guarantee that

interference will not occur in a particular installation. If this equipment does cause harmful interference to

radio or television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and the receiver

Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference, and

This device must accept any interference received, including interference that may cause undesired

operation.

FCC CAUTION: Any changes or modifications NOT explicitly APPROVED by ilumi could cause the module to

cease to comply with FCC rules part 15, and thus void the user's authority to operate the equipment.

5.1.2. IC compliance

This device complies with Industry Canada license-exempt RSS standard(s).

Operation is subject to the following two conditions:

1. This device may not cause interference, and

2. This device must accept any interference, including interference that may cause undesired operation

of the device.

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and

maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio

interference to other users, the antenna type and its gain should be chosen in such a way that the equivalent

isotropically radiated power (e.i.r.p.) is not more than that is necessary for successful communication.

This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and

your body.

MESHTEK-H52E

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5.1.3. Conformité aux norms d´IC

Cet appareil est conforme à la(aux) norme(s) RSS sans licence d’Industry Canada. Son utilisation est soumise

aux deux conditions suivantes:

1. Cet appareil ne doit pas causer d’interférences et

2. il doit accepter toutes interférences reçues, y compris celles susceptibles d’avoir des effets indésirables

sur son fonctionnement.

Conformément aux réglementations d’Industry Canada, cet émetteur radio ne peut fonctionner qu’à l’aide

d’une antenne dont le type et le gain maximal (ou minimal) ont été approuvés pour cet émetteur par Industry

Canada. Pour réduire le risque d’interférences avec d’autres utilisateurs, il faut choisir le type d’antenne et son

gain de telle sorte que la puissance isotrope rayonnée équivalente (p.i.r.e) ne soit pas supérieure à celle requise

pour obtenir une communication satisfaisante.

Cet équipement respecte les limites d’exposition aux rayonnements IC RSS-102 définies pour un

environnement non contrôlé. Il doit être installé et utilisé en maintenant une distance minimum de 20 cm entre

le radiateur et votre corps.

5.1.4. OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS

The MESHTEK-H52E Module has been certified for integration into products only by OEM integrators under

the following conditions:

This device is granted for use in configurations in which the antennas used for this transmitter must be installed

to provide a separation distance of at least 20cm from all person and not be co-located with any other

transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.

As long as the two conditions above are met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end-product for any additional compliance

requirements required with this module installed (for example, digital device emissions, PC peripheral

requirements, etc.).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location

with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and

the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM

integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a

separate FCC and Industry Canada authorization.

5.1.5. OEM Labeling requirements for end product

For an end product using the MESHTEK-H52E module there must be a label containing, at least, the following

information:

CONTAIN FCC ID: 2AEHU-MESHTEK-H52E

CONTAIN IC: 20059-MESHTEKH52E

The label must be affixed on an exterior surface of the end product such that it will be visible upon inspection

in compliance with the modular approval guidelines developed by the FCC.

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