IBT MI8382 Manuel utilisateur

MI8382

Intel N-series model N100 and N97

Mini-iTxSBC

USER’S MANUAL

Version 1.0

AUGUST 2023

Trademarks

All the

trademarks, registrations and

brands

mentioned herein are used for

identification purposes only and may be trademarks and/or registered

trademarks of their respective owners.

Warranty

Policy

•

Industrial standard products:

month (1

-year

)

warranty

from the date of shipment. If the date of

shipment cannot be ascertained, the product serial

numbers can be

used to determine the approximate shipping date.

•

3rd-party

parts:

12-month (1-year) warranty from delivery for the 3rd-party parts that are

not manufactured by us, such as CPU,

CPU cooler,

memory,

storage devices,

power adapter, panel and touchscreen.

＊

PRODUCTS, HOWEVER, THAT FAIL DUE TO MISUSE, ACCIDENT,

IMPROPER INSTALLATION OR UNAUTHORIZED REPAIR SHALL

BE TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL

BE BILLED FOR REPAIR AND SHIPPING CHARGES.

Attention during use:

•

Do not use this product near water.

•

Do not spill water or any other liquids on this product.

•

Do not place heavy objects on the top of this product.

Anti-static precautions

•

Wear an anti-static wrist strap to avoid electrostatic discharge.

•

Place the PCB on an anti-static kit or mat.

•

Hold the edges of PCB when handling.

•

Touch the edges of non-metallic components of the product instead of

the surface of the PCB.

•

Ground yourself by touching a grounded conductor or a grounded bit of

metal frequently to discharge any static.

There is danger of explosion if the internal lithium-ion battery is replaced

an incorrect type. Replace only with the same or equivalent type

recommended by the manufacturer. Dispose of used batteries according to

the manufacturer’s instructions or recycle them at a local recycling facility or

battery collection point.

Safety Information

Environmental

conditions:

•

Use this product in environments with ambient

temperatures

between

0˚C and 60˚C.

•

not leave this product in an environment where the storage

temperature may be below

-20°C

or above

80°C.

To prevent from

damages,

the product must be used in a controlled environment.

Care for your products:

•

Before cleaning the PCB, unplug all cables and remove the battery.

•

Clean the PCB with a circuit board cleaner or degreaser, or use cotton

swabs and alcohol.

•

Vacuum the dust with a computer vacuum cleaner to prevent the fan

from being clogged.

Disclaimer

We reserves

the right to make changes and improvements to the

products

described in this

document without prior notice.

Every effort has

been

made to ensure

the information in the document is

correct; however, no

guarantee

this document is error-free.

We assumes no liability for incidental or consequential damages arising

from misapplication or inability to use the product or the information

contained herein, nor for any infringements of rights of third parties, which

may result

from its use.

USER MANUAL MI8382 MINI-ITX

PAGE1

Contents
 
1. Models and Attentions ...................................................................................................3
1.1 Models........................................................................................................................................... 3
1.2 Attentions ...................................................................................................................................... 3
2. Specification ..................................................................................................................4
3. Functional Block Diagram..............................................................................................7
4. Mechanical Drawing ......................................................................................................8
5. Jumpers / Headers and Connectors..............................................................................9
6. Definition of Jumpers /Headers and Connectors .........................................................12 
1) Mark No.4 ATX_IN1/DC_IN3 ..................................................................................................... 12 
ATX_IN1 (ATX 4P Power Input Connector)...................................................................................... 12 
DC_IN3 (DC 12V Power Input Wafer 4*1 Pin 2.54mm) ................................................................... 12 
2) Mark No.5 DC_OUT1/DC_OUT1_PATCH1 .............................................................................. 12 
DC_OUT1/ (DC 12V+5V Power Output Wafer 4*1 Pin 2.54mm)..................................................... 12 
DC_OUT1_PATCH1 (DC 12V+5V Power Output Wafer 4*1 Pin 2.54mm)...................................... 12 
3) Mark No.8 LVDS1/EDP1 (eDP/LVDS Signal Header 15*2 Pin 2.00mm).................................. 13 
4) Mark No.9 LVDS_P1 (eDP/LVDS Backlight Control Wafer 6*1 Pin 2.00mm)........................... 13 
5) Mark No.10 JV_LVDS1 (LVDS VDD Select Jumper 3*2 Pin 2.54 mm) .................................... 14 
6) Mark No.11 JC_LVDS1 (LVDS Backlight PWM/CCFL Select Jumper 3*1 Pin 2.54 mm)......... 14 
7) Mark No.12 EDP2 (eDP Signal Header 15*2 Pin 2.00 mm) ..................................................... 14 
8) Mark No.13 EDP_P2 (eDP Backlight Control Wafer 6*1 Pin 2.00 mm).................................... 15 
9) Mark No.14 JV_EDP2 (eDP VDD Select Jumper 3*1 Pin 2.54 mm) ........................................ 15 
10) Mark No.16 J_SPK1 (L/R Amplifier Wafer 4*1 Pin 2.00 mm) ................................................... 15 
11) Mark No.18 P_SATA1 (SATA Power Wafer 4*1 Pin 2.00 mm).................................................. 15 
12) Mark No.21 RJ45_1 (GBE LAN RJ45 Connector) .................................................................... 15 
13) Mark No.24 F_USB1 (Front USB2.0 Header 5*2 Pin 2.54 mm) ............................................... 16 
14) Mark No.25 F_USB2 (Front USB2.0 Header 5*2 Pin 2.54 mm) ............................................... 16 
15) Mark No.27 F_USB3 (Front USB2.0 Wafer 4*1 Pin 2.00 mm) ................................................. 16 
16) Mark No.28 COM1 (COM1 DB9M Connector).......................................................................... 16 
17) Mark No.29 J_COM1 (COM1 Header 5*2 Pin 2.00 mm) .......................................................... 17 
18) Mark No.30 JV_COM1 (COM1 Pin1/PIN9 VDD Select Jumper 3*2 Pin 2.54 mm) .................. 17 
19) Mark No.31 J_COM2 (COM2 Header 5*2 Pin 2.00 mm) .......................................................... 17 
20) Mark No.32 JV_COM2 (COM2 Pin1/PIN9 VDD Select Jumper 3*2 Pin 2.54 mm) .................. 18 
21) Mark No.33 J_COM3 (COM3 Header 5*2 Pin 2.00 mm) .......................................................... 18 
22) Mark No.34 JV_COM3 (COM3 Pin1/PIN9 VDD Select Jumper 3*2 Pin 2.54 mm) .................. 18 
23) Mark No.35 J_COM4 (COM4 Header 5*2 Pin 2.00 mm) .......................................................... 19 
24) Mark No.36 JV_COM4 (COM4 Pin1/PIN9 VDD Select Jumper 3*2 Pin 2.54 mm) .................. 19 
25) Mark No.37 J_COM5 (COM5 Wafer 3*1 Pin 2.00 mm) ............................................................ 19 
26) Mark No.38 J_COM6 (COM6 Wafer 3*1 Pin 2.00 mm) ............................................................ 19 
27) Mark No.39 J_LPT1 (Parallel Jumper 13*2 Pin 2.00 mm)........................................................ 20 
28) Mark No.40 J_CASH1 (Cash Drawer Wafer 6*1 Pin 2.00 mm) ................................................ 20 
29) Mark No.41 JP_CDPWR1 (Cash Drawer VDD Select Jumper 3*1 Pin 2.54 mm) ................... 20 
30) Mark No.42 J_GPIO1 (GPIO Wafer 5*2 Pin 2.00 mm) ............................................................. 21 
31) Mark No.43 F_PANEL1 (Front Panel Header 5*2 Pin 2.54 mm) .............................................. 21 
USER MANUAL MI8382 MINI-ITX
PAGE2

32) Mark No.44 J_TCH1 (I2C Touch Wafer 6*1 Pin 2.00 mm)........................................................ 21

33) Mark No.45 SYS_FAN1 (System FAN Wafer 4*1 Pin 2.54 mm)............................................... 21

34) Mark No.46 CPU_FAN1 (CPU FAN Wafer 4*1 Pin 2.54mm).................................................... 22

35) Mark No.47 J_COPEN1 (Case Open Header 2*1 Pin 2.54mm)............................................... 22

36) Mark No.49 CLR_CMOS1 (CMOS Clear Jumper 3*1 Pin 2.54 mm)........................................ 22

37) Mark No.50 J_AT/ATX1 (AT/ ATX Select Jumper 3*1 Pin 2.54 mm) ........................................ 22

38) Mark No.51 J_ME1 (ME Flash Jumper 3*1 Pin 2.54 mm) ........................................................ 22

39) Mark No.52 J_ESPI1 (ESPI Debug Header 6*2 Pin 2.00 mm)................................................. 23

7. BIOS setup ..................................................................................................................24

USER MANUAL MI8382 MINI-ITX

PAGE3

Models and Attentions

1.1 Models

This manual is applied to following models:

1.2 Attentions

1) Notes under a table or figure indicate the difference of models, or alternative definition of

specific pin of the header (jumper/connector).

2) How to identify the first pin of a header or jumper

◼Usually, there is a thick line or a triangle near the header’s or jumper’s pin 1.

◼Square pad, which you can find on the back of the motherboard, is usually used for pin 1.

Model

CPU

COM

LAN

HDMI

VGA

LVDS/

eDP

USB

M.2

KEY-E

M.2

KEY-B

SATA

3.0

N100

LVDS

PCIE

+UAB2.0

PCIE x1

/SATA

MI8385

N50

LVDS

PCIE

+UAB2.0

PCIE x1

/SATA

i3-N300

LVDS

PCIE

+UAB2.0

PCIE x1

/SATA

N97

LVDS

PCIE

+UAB2.0

PCIE x1

/SATA

MI8380

3) Some models is reserved for the futur. (no P/N yet attribued)

MI8387

MI8382

USER MANUAL MI8382 MINI-ITX

PAGE4

General Specifications

Model

MI8380

MI8385

CPU

Model

Intel® Core™

Processor

Intel® Processor

i3-N300

N50

N100

N97

Clock

Speed

up to 3.80G

up to 3.40G

up to 3.60G

Multi-

Core

Octa

Dual

Quad

TDP

12W

Display

1 * VGA (DB15): max resolution up to 1920*1080@60Hz [1]

1 * LVDS/eDP (Header): LVDS max resolution up to 1920*1200@60Hz (Default)

or eDP max resolution up to 4096*2160@60Hz

1 * eDP

(Header):

max resolution up to

4096*2160

60Hz

Memory

Support DDR4 3200 MHz, 1 * SO-DIMM Slot, Up to 16GB

Storage [2]

1 * SATA3.0 7P Connector (With 1 * SATA Power Wafer)

1 * M.2 Key-B Slot (PCIe x2/SATA, Default PCIe x1/SATA, Support PCIe x1 NVMe/

SATA SSD, Auto Detect, 2242/2280)

Ethernet

2 * Realtek GBE LAN Chip (10/100/1000 Mbps, RJ45)

Audio

Realtek Audio codec

1 * Line-Out + MIC 2in1 3.5mm Jack (Default CTIA, OMTP SEL by res)

1 * R/L Amplifier Wafer, 3-W (per channel) into an 8-Ω Loads

Expansion Slot

1 * M.2 Key-E Slot (PCIE+USB2.0, Support WIFI+BT, 2230) [3]

COM

1 * RS232 (COM1, DB9M/ Header, Full Lanes) [5]

3 * RS232 (COM2-4, Header, Full Lanes)

2 * RS232 (COM5-6, Header, Two Lanes)

USB

4 * USB3.0 (TYPE-A, Rear IO)

2 * USB2.0 (TYPE-A, Rear IO) [1]

4 * USB2.0 (Header, Internal) [4]

1 * USB2.0 (Wafer, Internal) [3] [4]

Other Ports

1 * Parallel Jumper

1 * Cash Drawer Wafer

1 * 8-bit GPIO Wafer

1 * Front Panel Header

1 * I2C Touch Wafer

1 * System FAN Wafer

1 * CPU FAN Wafer

1 * Case Open Header

1 * CMOS Clear Jumper

1 * AT or ATX Select Jumper

1 * CMOS Clear Jumper1 * Power Debug Wafer

System

Windows 10 IoT Enterprise 2021 LTSC, Windows 10 (21H2),

Windows 11 (21H2) or later, Linux Kernel 5.17 or later

Temperature

Storage: -20~75℃

Operating: 0~60℃

minimum order qty maybe requiered

MI8382 MI8387

USER MANUAL MI8382 MINI-ITX

PAGE5

BIOS

AMI UEFI BIOS (Support Watchdog Timer)

Power Supply

DC12V

1 * DC 12V Power Input Φ2.5mm Jack (Mini-din 4P Jack Optional)

1 * ATX 4P Power Input Connector (Wafer Optional)

1 * DC 12V+5V Power Output Wafer

Factor

170mm*170mm

Notes:

[2]: SATA signal of SATA1 colay with one of PCIE signal for M.2_KEYB_SSD1. (BOM selectable)

[3]: USB2.0 signal of M.2_KEYE_WLAN1 colay with F_USB3 (Mark 27), they can’t be selected simultaneously. (BOM

selectable)

[4]: USB2.0 signal of F_USB2 and R_USB3 (mark 26) come from the same HUB IC. When R_USB3 is’t used, this interface can

be deleted.

[5]: COM1 (Mark 28) and J_COM1 (Mark 29) use the same signal. They cannot be used simultaneously. (BOM selectable)

USER MANUAL MI8382 MINI-ITX

PAGE6

USER MANUAL MI8382 MINI-ITX

PAGE7

* For reference only

3.Functional Block Diagram

Intel®

Alder lake-N

Processor

Families

(6-15W)

CODEC

PCIE*1

Line-out+MIC

2in1 P-Jack Lout,MIC

ESPI Super

I/O

COM 1-4

Header

FAN

Wafer*2

eDP1/LVDS

Header Converter DDI

COM 5-6

Wafer

AMP

Amplifier

Wafer

3*RS232

2*RS232

COM 1

DB9/M

FAN*2

GPIO*8

DDR4

SO-DIMM

CH A

HDA

GPIO

Wafer

PCIE

M.2 Key-E Slot

VGA DB15/F

eDP Header DDI 4*USB3.0+4*USB2.0 2*Dual USB3.0

TYPE-A

HUB USB2.0

Dual USB2.0

Header

Dual USB2.0

TYPE-A 2*USB2.0

2*USB2.0

Dual USB2.0

Header

USB2.0

Wafer

USB2.0

PCIE x1/SATA

M.2 Key-B Slot

SATA 7P Port SATA

LPT Header

Cash Drawer

Wafer

4*GPIO

I2C

F_PANEL

Header

PWR ON, RESET

HDD LED, PWR LED

GbE LAN

RJ45

Converter

PCIE x1

RS232

Converter TCP

USER MANUAL MI8382 MINI-ITX

PAGE8

4.Mechanical

Drawing

USER MANUAL MI8382 MINI-ITX

PAGE9

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