HPE Altoline 6900 Instructions de montage

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HPE Altoline 6900 48G 4XG 2QSFP ARM ONIE AC Switch (JL223A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips screwdriver

various sizes

Flat-blade screwdriver

various sizes

Small adjustable wrench

Needle nose pliers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the chassis lid

1. Using a Phillips screwdriver, remove the screws (qty 14)

2. Slide the lid off the chassis

2. Remove the two power supplies

1. Locate the power supplies on the right side as you are facing the back of the chassis

2. While pressing the release lever toward the handle, pull the power supply out of the chassis

3. Repeat for the other power supply

3. Remove the DIMM PCA

1. Using a Phillips screwdriver, remove the screw securing the small PCA mounted near the center of the main

PCA

2. Remove the DIMM PCA by lifting straight up to disconnect the connector

4. Remove the main PCA

1. Using a flat-blade screwdriver, loosen the four screws holding down the CPU heat sink

2. Remove the heat sink

3. Using a small adjustable wrench, remove the hexagonal studs near the center of the main PCA

4. Disconnect the front LED cable from the main PCA

5. Peel the air flow diverter away from the inside wall of the chassis

6. Using a Phillips screwdriver, remove the twelve screws holding down the main PCA

7. Slide the main PCA toward the back of the chassis then lift the right side to remove it

5. Remove the remaining three heatsinks

1. Flip the main PCA over

2. Use needle nose pliers to pinch the four heat sink fasteners while removing a heat sink from the main PCA

3. Repeat the above step for the other two heat sinks

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Ce manuel convient aux modèles suivants

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