HP Engage Go Mobile System Instructions de montage

EL-MF877-00 Page 1

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: External Options

Marketing Name / Model

[List multiple models if applicable.]

HP Engage Go Mobile System

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description

Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style

batteries

Li-Ion batteries. Include all Li-Ion batteries if more than

one is provided with the product (such as a detachable

notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[6] screws

[X] snaps

[X] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

1(Main

battery)

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than

100 sq cm

Includes background illuminated displays with gas

discharge lamps (12.3”LED)

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

External electrical cables and cords

DC Cable for External Power Supply

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Excluding B&S parts (EPS)

EL-MF877-00 Page 2

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of

items

included in

product

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Electric screwdriver (Cross)

Electric screwdriver (Trox)

Plastic stick

M/B Support Fixture

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Follow steps described in Disassembly instruction (file attached)

2. If parts can be removed without using a tool, remove it first

3. Use correct screwdriver and torque value before unlock the screw.

4. Disconnect RTC battery cable and remove battery from M/B.

5. Dispose of all removed components according to regulation requirements.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the

product that require selective treatment (with descriptions and arrows identifying locations).

制表：审核：楊洋陈燕淋

Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver.

1 0.10 9 0.10 17 0.10 24 0.10

2 0.10 10 0.10 18 0.10 25 0.10

3 0.10 11 0.10 19 0.10 26 0.10

4 0.10 12 0.10 20 0.10 27 0.10

5 0.10 13 0.10 21 0.10 28 0.10

6 0.10 14 0.10 22 0.10

7 0.10 15 0.10 23 0.10

8 0.10 16 0.10 24 0.10

Sta. Ver.

ALL 0.1*

2018/4/4

首份SOP制作

陳博

A.Current station version list:

B.Version Modify list:

Date

Content

Design

Written by:

陳博

Date:

2018/4/4

Page:

1 of 42

Sub-assembly name:

CNNB 拆机 SOP

Document No.:

CNNB 拆机 SOP

Revision:

0.10

MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY

MODEL : CNNB

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期 :

發行部門：制表：陈燕淋工業工程課

1(1/1)

0.10

1. pull up the belt

2. hold against the belt cover (shown as the

red arrow)（Pics1）

3. push it out, remove the cover and put

away（pics 1）

Dis-assembly Hand Strap Cover 2018/4/4

Cover(black)

6053B1546401 black

6053B1573201 white

cover disassemble fixture 1

图一

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期 :

發行部門：制表：陈燕淋工業工程課

1. Remove the screws(6052B0101901

M2*L4)*2（pics2）

2. Remove the sheet metal*2 （pics2）

3. Remove the belt

Dis-assembly Hand Strap BRKT

2(1/1)

0.10 2018/4/4

tips：

❖torque：1.5±0.5 kg/cm

❖no screw stripped, cannot drop into the

system

❖screw tighten order：pics shown

❖vertical fasten，no tilt

Black item

6051B1234701 belt

6053B1547701 Sheet metal

White item

6051B1253701 belt

6053B1572901 Sheet metal

#1screw driver 1

Pics 1

Pics 2

sheet metal

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期 :

發行部門：制表：陈燕淋工業工程課

1. Remove screw(6052B0159001 M2*L3)*2(PICS1)

2. Push down A cove，take off A cover（pics2 ）

3. Remove FPR FFC & Pogo FPC（pics3）

4. Remove A cover

Dis-assemblyA cover

3(1/1)

0.10 2018/4/4

Pics 1

Pics 2

Pics 3

tips：

❖torque：1.5±0.5 kg/cm

❖no screw stripped, cannot drop into the

system

❖ ❖vertical fasten，no tilt

❖cannot pull up A cover，would cause

damage

#1screw drive 1

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期:

發行部門：制表：陈燕淋工業工程課

4(1/1)

0.10

1. remove(6053B1547901)screws6052B01200

01 M2*L2.5)*2 （pics 2）

2. Remove FFC(6035B0182801) （pics2）

3. Take off FPR(6042B0383501) （pics1）

Dis-assembly FPR 2018/4/4

tips：

❖torque：1.5±0.5 kg/cm

❖no screw stripped, cannot drop into the

system

❖screw tighten order：pics shown

❖vertical fasten，no tilt

#1screw driver 1

有FPR才需要此站

1 2

Pics 1

Pics 2

FPC

Sheet

metal

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期 :

發行部門：制表：陈燕淋工業工程課

Dis-assembly Pogo

1. Put A Cover on the fixture（pics 1）

2. Remove (6052B0120001 M2*L2.5 )*8（

pics 2）

3. Take off Pogo，put A Cover and Pogo

away

5(1/2)

0.10 2018/4/4

#1screw driver 1

A cover support fixture 1

Pics 1

Pics 2

tips：

❖torque：2.0±0.5 kg/cm

❖no screw stripped, cannot drop into the

system

❖screw tighten order：pics shown

❖vertical fasten，no tilt

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期 :

發行部門：制表：陈燕淋工業工程課

5(2/2)

0.10 2018/4/4

A Cover(black)

6070B1294601 W/Finger + W/NFC

6070B1294501

W/O Finger + W/NFC

6070B1294801

W/Finger + W/O NFC

6070B1294701

W/O Finger + W/O NFC

Tips：

•Visual inspect the incoming matl if defect

•Check if the matl PN is correct

W or w/o NFC，would

has different printing

A Cover(white)

6070B1294602 W/Finger + W/NFC

6070B1294502

W/O Finger + W/NFC

6070B1294802

W/Finger + W/O NFC

6070B1294702

W/O Finger + W/O NFC

Dis-assembly Pogo

注意事项︰PCB板需轻拿轻放，不得碰触板上之零件，如有不良，请立即通知领班或助理。

作業指導書

治具清单(治具规格)数量治具清单(治具规格)数量

步骤：

Document No. : CNNB 拆机SOP 站別 :

作業名稱 : Ver. : 编辑日期:

發行部門：制表：陈燕淋工業工程課

6(1/1)

0.10

1. Take apart battery connection（pics1）

2. Disassembly LCM FPC（pics1）

3. Disassembly touch control board FFC（

pics1）

Dis-assembly FPC 2018/4/4

tips：

•Carefully handle the matl, watch the direct

to avoid crash

•Be sure ESD protection is workable

Plug off

power at first

Pics 1

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