HP Cray CS E1000 Instructions d'installation
MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Storage
Marketing Name / Model
[List multiple models if applicable.]
HPE Cray CS E1000 4TB SAS 5U84 42pk HDD Bdl
HPE Cray CS E1000 6TB SAS 5U84 42pk HDD Bdl
HPE Cray CS E1000 8TB SAS 5U84 42pk HDD Bdl
HPE Cray CS E1000 4TB 5U84 SED 42pk HDD Bdl
HPE Cray CS E1000 10TB 5U84 SED 42pk HDD Bdl
HPE Cray CS E1000 16TB 5U84 SED 42pk HDD Bdl
HPE Cray CS E1000 SAS 5U84 LFF Drv Encl
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HPE products to remove components and materials requiring selective treatment,
as defined by Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic
Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5 in each chassis.
1 in each of 2 power supplies.
1 in each of 5 DC fan modules.
1 in each of 2 I/O modules (IOMs).
14 Max
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with
gas discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
5 capacitors in each of 2 power supplies.
10
External electrical cables and cords
1 power cord for each of 2 power supplies.
2
MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in
product
3 SAS expansion cables for each of 2 IOMs.
1 RJ45 cables for each of 2 IOMs.
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts, and materials containing
refractory ceramic fibers
0
Components, parts, and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips driver
#0, #1, #2
Torx driver
T10, T25
Hex driver
#2
Socket driver
10mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the bezel and hubcaps from the front of the enclosure.
2. Remove all disk drives.
3. For each disk drive, remove the disk from the plastic carrier.
4. Remove both power supply units (PSUs), both IOMs, and fan modules.
5. Disassemble each PSU. See the PSU disassembly procedure.
6. Disassemble each IOM. See the IOM disassembly procedure.
7. Disassemble each fan module. See the fan module disassembly procedure.
8. Disassemble the chassis. See the chassis disassembly procedure.
MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
3.2.1 PSU Disassembly procedure
1. Remove the casing screws using a Phillips #1 bit and pull the top cover off.
MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
2. Remove the cable connection connecting the board—present on a PSU side—marked in the image below.
3. Remove the five screws connecting the PCBA to metal enclosure using Phillips #1 bit screwdriver, and then
separate the casing.
4. Pull the lugs in the direction shown in the image below.
MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
5. After removing all the connections, remove the PCA from the enclosure.
3.2.2 IOM Disassembly procedure
1. Remove the two screws from the lid.
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