HP 5900AF-48XG-4QSFP+ Instructions de montage

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Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP 5900AF-48XG-4QSFP+ Switch Chassis（JC772A）

HP 5900AF-48XG-4QSFP+ TAA Switch Chassis（JG554A）

HP FF 5900CP-48XG-4QSFP+ Switch Chassis (JG838A)

HP 5900CP-48XG-4QSFP+ 8Gb FC B-F Switch Chassis (E7W29A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.

2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.

3. Unscrew the screws on fan-assembly 3, and then remove fan-assembly 3.

4. Remove the power 4.

5. Remove the filler panel 5.

6. Unscrew the screws on top cover 6, and remove top cover 6.

7. Unscrew the screws on front panel 7, and then remove front panel 7.

8. Unscrew the screws on PCB 9, and remove PCB 9.

9. Unscrew the screws on PCB 10, and remove PCB 10.

10. Unscrew the screws on shielding plate 11, and remove shielding plate 11.

11. Unscrew the screws on wind cover 12, and then remove wind cover 12.

12. Unscrew the screws on PCB 13, and remove PCB 13.

13. Remove all of the labels.

14. Unscrew the screws on 3-2, and then remove 3-2.

15. Unscrew the screws on 3-3, and then remove 3-3.

16. Unscrew the screws on fan 3-4, and then remove fan 3-4.

17. Unscrew the screws on pcb 3-5, and then remove 3-5.

18. Unscrew the screws on pulled handle 3-6, and then remove pulled handle 3-6.

19. Remove shielding finger 3-7.

20. Remove all of the labels.

21. Unscrew the screws on pulled handle 5-1, and then remove pulled handle 5-1.

22. Remove shielding finger 5-3.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1 Remove mounting angle Figure 2 Rear of product

Figure 3 Treatments to the product Figure 4 Treatments to the product

Figure 5 Treatments to fan-assembly Figure 6 Treatments to filler panel

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3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for

materials and components

Details

(135+46)*2

3.25%

recycling

38*2

0.68%

recycling

3-1

170

1.53%

recycling

3-2

0.19%

recycling

3-3

0.21%

recycling

3-4

40*2

0.72%

Containing brominated flame

retardants

3-5

Complex

PWB

0.27%

The surface of PCB is greater

than 10 square centimeters;

3-6

0.22%

recycling

3-7

Be-Cu

4.3*8

0.31%

recycling

1050

9.44%

recycling

144

1.29%

recycling

2720

24.45%

recycling

320

2.88%

recycling

3920

35.24%

recycling

Complex

PWB

0.43%

The surface of PCB is greater

than 10 square centimeters;

Complex

PWB

103

0.93%

The surface of PCB is greater

than 10 square centimeters;

0.17%

recycling

0.51%

recycling

Complex

PWB

2360

21.22%

The surface of PCB is greater

than 10 square centimeters;

4. Revised record

Date

Version

Author

Modify content

2012.11.12

LiuBaoquan

Initial version

2013.11.08

LuanZhiming

Add the module JG838A、E7W29A

Ce manuel convient aux modèles suivants

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