HP Engage 14 Instructions de montage

Product End-of-Life Disassembly Instructions

Product Category: Monitors & Display

Marketing Name / Model

[List multiple models if applicable.]

HP Engage 14

HSD-0085-Q

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for

the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on

the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Main Board*1, Power key board*1, Keypad Board*1

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button

style batteries

Li-Ion batteries. Include all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, RTC coin cell,

etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[ ] screws

[ ] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps Panel*1

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

USB3.1 type-C gen1 cable*1

All are inside monitor carton box

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Item Description

Notes

Quantity of

items

included in

product

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

Hexagon Screw Driver

Flathead screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Press quick release button to separate head and stand.

2. Use screwdriver to loosen the two screws and disassemble the rear cover.

3. Use flathead screwdriver to stick up rear cover bottom and stick up upper-left, upper-right corner with hands, and then

open the rear cover.

4. Remove conductive tape and unplug 2 cable.

5. Remove the conductive and insulating tape and the screw on the hinge.

6. Unplug lamp wire, eDP cable from connector, and take out ambient light board.

7. Unplug ambient light wire from the connector and loosen 4 screws on PCBs.

8. Remove all the gaskets, thermal pad, mylar, spacer on shielding. Remove all cable on PCBs.

9. Loosen 16 screws on middle frame to remove the deco and panel.

10. Loosen 4 screws on rear cover to remove the ctrl board and audio board, disassemble the RC lens.

11. Remove 2 LOGO on the rear cover.

12. Remove the lens on the deco.

13. Remove the screws form column, and separate plastic part.

14. Remove cable clip.

15. Remove the screw from hook, and remove hook.

16. Remove the screw from BKT, and remove life module, and disassemble lift module.

17. Remove the rubber from base.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained

in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Use tool to release screws on monitor, then separate the Stand from monitor head

2. Use tool to release screws, label, type C cable. Then remove cover-rear, tape, FFC. PCBA

Cover-rear has two nut, can separate by using tool.

3. Remove tape, screw, shielding.

4. Remove screw, bracket, FFC, wire, PCBA.

5. Remove screw, speaker, bracket, mylar.

6. Remove PCBA

7. Remove panel and sponge.

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