HP ProDesk 485 G1 Instructions d'installation

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Product End-of-LifeDisassemblyInstructions

ProductCategory:

Personal Computers

MarketingName/ Model

[Listmultiplemodelsifapplicable.]

HP ProDesk485 G1Microtower BusinessPC

Purpose: Thedocumentisintendedforusebyend-of-liferecyclersortreatmentfacilities.Itprovidesthebasicinstructions

forthedisassemblyofHPproductstoremovecomponentsandmaterialsrequiring selectivetreatment,asdefinedbyEU

directive2002/96/EC,WasteElectricalandElectronicEquipment (WEEE).

1.0

ItemsRequiringSelective Treatment

1.1Itemslisted belowareclassified asrequiring selectivetreatment.

1.2Enterthe quantityofitemscontained withintheproduct whichrequireselectivetreatmentinthe right column,as

applicable.

ItemDescription Notes

Quantity

ofitems

included

inproduct

Printed Circuit Boards(PCB)orPrintedCircuit

Assemblies(PCA)

Withasurfacegreaterthan10 sq

Batteries

Alltypesincluding standardalkaline and lithiumcoin

orbuttonstylebatteries

Mercury

containing components

Forexample, mercuryinlamps,displaybacklights,

scannerlamps,switches,batteries

LiquidCrystalDisplays(LCD)withasurfacegreater

than100sqcm

Includesbackground

illuminated displayswithgas

dischargelamps

CathodeRayTubes(CRT)

Capacito

rs/ condensers(ContainingPCB

/PCT)

ElectrolyticCapacitors/Condensersmeasuring

greaterthan2.5cmindiameterorheight

Externalelectricalcablesandcords

Powercord

GasDischarge Lamps

PlasticscontainingBrominatedFlameRetardants

weighing>25 grams(notincludingPCBsorPCAs

alreadylisted asaseparateitemabove)

Componentsandpartscontainingtonerandink,

includingliquids,semi-liquids(gel/paste)andtoner

Includethecartridges, printheads, tubes,vent

chambers,andservicestations.

Componentsandwastecontainingasbestos

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Components,partsandmaterialscontaining

refractoryceramicfibers

Components,partsandmaterialscontaining

radioactivesubstances

2.0ToolsRequired

Listthe typeandsizeofthetoolsthatwouldtypicallybe usedtodisassemblethe product toapointwherecomponents

andmaterialsrequiringselectivetreatmentcanbe removed.

ToolDescription

ToolSize(if

applicable)

Screwdriver

icroshear

Screwdriver

PH1

Description #4

Description #5

3.0ProductDisassemblyProcess

3.1Listthe basicstepsthatshouldtypicallybefollowedtoremovecomponentsandmaterialsrequiring selectivetreatment:

1.Removeaccesspanel.(seeFigure1-3)

2.Removefront bezel.(see Figure4)

3.Disconnect coolercablethenremovethe coolerfromboard. (seeFigure5-7)

4.Disconnect 24 pinpowercable SATA cable SATA powercable CPUpowercable. (seeFigure8-11)

5.RemovetheODD andHDD fromchassis(seeFigure12-16)

6.Disconnect theMCR cablefromboardthen removetheMCR. (seeFigure17-19)

7.Disconnect systemfan cablethen removethe systemfanfromchassis(seeFigure20-22)

8.Disconnect FIOcablesand openthecableclip.(seeFigure23-24)

9.RemovetheFIOmodulefromchassis. (see Figure25-26)

10.DisconnectPWRcablethen removeit fromchassis.(seeFigure27-28)

11.Disconnectspeakercablethenremoveitfromchassis.(seeFigure29-31)

12.RemovetheMemoryfromchassis.(seeFigure32)

13.Removethebatteryfromtheboard.(seeFigure33)

14.RemoveMotherboardfromchassis. (see Figure34-36)

15.RemovetheI/Oshielding fromchassis.(seeFigure37)

16.RemovethePSUfromchassis.(seeFigure38&39)

17.RemovethePSUchassisand removethe PSUboard.. (seeFigure40-43)

18.RemovetheElectrolyticCapacitorsfromPSUboard. (seeFigure44-50)

3.2OptionalGraphic.Ifthe disassemblyprocessiscomplex, insertagraphicillustrationbelowtoidentifythe items

contained intheproduct that requireselectivetreatment(withdescriptionsandarrowsidentifying locations).

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Figure1Loose

thetwoscrews

fromaccesspanel

Figure2

Slidetheaccesspanelback

Figure3R

otatethe topofthe panel

away

toremoveit

Figure4Pullthe 3hooksandr

otate

toremovethe front

bezel

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Figure5DisconnectthecoolercablefromMB

Figure6Loose4screwsfromcoolerandremoveit

Figure7Removethe coolerfromboard

Figure8DisconnecttheSATAcablesformboard

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Figure9DisconnecttheCPUpowercablefromboard

Figure10 Disconnect the 24pinpowercablefromMB

Figure1

Disconnect

theSATA andpowercablesfrom

ODD

Figure12 LoosetheODDscrews

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Figure13Removethe ODDfromchassis

Figure14

Disconnect

the SATA and powercablesfrom

HDD

Figure15LoosetheHDD screws

Figure16 RemovetheHDDformchassis

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Figure17Disconnect theMCRcablefromMB

Figure18 LoosetheMCRscrews

Figure19Removethe MCRfromchassis

Figure20 Disconnect systemfancablefromboard

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Figure21Loose2screwsfromsystemfan

Figure22 Removethesystemfanfromchassis

Figure23

Disconnect

FIOcable

include

USB 3.0, USB

2.0, Audio

Figure24 Open the cableclip

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Figure25Loosethescrewofthe FIOcable

Figure26 RemovetheFIOcablefromchassis

Figure27Disconnect PWRcablefromMB

Figure28 RemovethePWRcable

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Figure29Disconnect speakercablefromboard

Figure30 Loosethescrewof speaker

Figure31Removethe speakerformchassis

Figure

Push

the hooks

onbothsides

andthen

pick up

thememory

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