HP Compaq dx2200 Instructions d'installation
HP-00007-01, Appendix 3 22-Mar-2006
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
HP Compaq Business PC dx2200 MT
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Notes
Qty items in
product
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface > 10 square cm 3 (1 sys board,
2 P/S board)
Batteries All types including standard
alkaline and lithium coin or button
style batteries
1
Mercury containing components For example, mercury in lamps,
display backlights, scanner
lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge
lamps
0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT)
0
Electrolytic Capacitors/Condensers
greater than 2.5 cm in diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants
0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos
0
Components, parts and materials
containing refractory ceramic fibers
0
Components, parts and materials
containing radioactive substances
0
HP-00007-01, Appendix 3 22-Mar-2006
HP Restricted
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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Torx screwdriver T15
Phillips screwdriver
Diagonal cutters (dikes)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
SYSTEM BOARD
1 Remove the access panel:
a) Remove the two screws that secure the access panel to the computer chassis.
b) Slide the access panel back about 6 mm (1/4 inch), then rotate the top of the panel
away from the chassis (pivot on the bottom) and lift it off the unit
2 Remove the front bezel (see Figure 1 below):
a) Pull outward on all three tabs on the left side of the bezel (1)
b) Rotate the bezel off the chassis (2), beginning with the left side then the right side.
3 Disconnect the power, and data cables from the back of all installed drives.
4 Disconnect all cables from the system board.
5 Remove the heatsink from the system board (see Figure 2 below):
a) Disconnect the heatsink control cable from the system board.
b) Loosen the four captive screws that secure the heatsink to the system board.
c) Lift the heatsink from atop the processor and set it on its side to keep from
contaminating the work area with thermal grease.
6 Remove the six screws that secure the system board to the chassis (1)
(see Figure 3 below):
7 Slide the system board towards the front of the chassis (2) then remove it (3)
(see Figure 3 below).
NOTE: The system board in the computer may look slightly different from the one shown
here.
HP-00007-01, Appendix 3 22-Mar-2006
HP Restricted
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POWER SUPPLY PRINTED CIRCUIT ASSEMBLY
1 To remove the power supply (see Figure 4 below)
a) Remove all cables connected to all devices in the chassis.
b) Using a phillips screwdriver, remove the four screws that secure the power supply to
the chassis.
c) Slide the power supply toward the front of the computer, and then lift it out of the
chassis.
2 To remove the cover from the power supply (see Figures 5 & 6 below):
a) Using a phillips screwdriver, remove the six screws that secure the cover to the power
supply chassis.
b) Using dikes, cut the plastic cable clamp that secures the cables to the chassis.
c) Lift the cover off the power supply.
3 To remove the power supply PCA:
a) Cut the plastic cable clamp that secures the cables to the chassis
(see Figure 7 below).
b) Remove the four screws that secure the power supply PCA to the chassis
(see Figure 8 & 9 below).
c) Using diagonal cutters (dikes) cut all cables connected to the PCA (2 to switch, 2 to PC
inlet, 2 to power supply fan) (see Figure 10 below).
d) Remove the power supply PCA from the power supply chassis.
BATTERY
Locate the battery and battery holder on the system board. Depending on the type of
battery holder on the system board, follow the instructions below to remove the battery:
TYPE 1 BATTERY HOLDER (see Figure 11 below)
Lift the battery out of the holder.
TYPE 2 BATTERY HOLDER (see Figure 12 below)
To release the battery from its holder, squeeze the metal clamp that extends above one
edge of the battery. When the battery pops up, lift it out.
TYPE 3 BATTERY HOLDER (see Figure 13 below)
Pull back on the clip that holds the battery in place, and then remove the battery.
HP-00007-01, Appendix 3 22-Mar-2006
HP Restricted
Page 4
3.2 ILLUSTRATIONS
Figure 1: Removing the front bezel Figure 2: Removing the heatsink
Figure 3: Removing the system board Figure 4: Power supply screw locations
HP-00007-01, Appendix 3 22-Mar-2006
HP Restricted
Page 5
Figure 5: Cut the plastic cable clamp
Figure 6: Power supply cover screw locations
Figure 7: Cut the plastic cable clamp
Figure 8: Power supply PCA screw locations
Figure 9: Power supply PCA screw locations
Figure 10: Cut all cables connected to the
board
HP-00007-01, Appendix 3 22-Mar-2006
HP Restricted
Page 6
FIGURE 11: Type 1 battery holder
FIGURE 12: Type 2 battery holder
FIGURE 13: Type 3 battery holder
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