HP ProDesk 600 G4 Instructions d'installation

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 600 G4 SFF Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Star screwdriver

OD 3.3mm

Cross screwdriver

OD 3.0mm

Cross screwdriver

OD 6.0mm

Hexagon socket wrench

4.6mm

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove side panel

2. Remove front bezel

3. Unplug ODD & HDD cables

4. Remove drive cage

5. Remove FIO cage

6. Remove ODD & HDD

7. Release all cables

8. Remove fan duct

9. Remove cooler

10. Remove CPU

11. Remove Memory

12. Remove WLAN module

13. Remove SSD module

14. Remove all PCIEXP cards

15. Remove 2nd serial card

16. Remove option card

17. Remove card reader

18. Remove antenna cable

19. Remove MB and bettery

20. Remove PSU

21. Remove speaker

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01



Push thumb latch on

the chassis rear side.

Push side panel in

the end as shown,

and then pick up from

chassis as shown.

See photo 1, 2, 3, 4

Photo 1

Photo 4

Rear

Front

Push

Thumb latch will lock

on this location

Photo 2

Photo 3

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01



Release 4 bezel

latches from chassis

by pulling outwards

the bezel latches

then as shown.

See Photo 5

Pick up bezel in the

order as shown.

See Photo 6

Photo 5

Lift up bezel away

from chassis

Rotate bezel until

the bezel latches

align this line.

Photo 6

EL-MF877-00 Page 5

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PSG instructions for this template are available at EL-MF877-01



Unplug ODD & HDD

cables as shown.

See Photo 7

Photo 7

ODD cable

HDD cable

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Press HDD cage first

then push button as

shown.

See Photo 8

Rotation drive cage

then pass through

HDD cables to drive

cage then remove

drive cage as shown.

See Photo 9, 10



Photo 8

Press HDD cage first

Push button

Photo 9

HDD SATA & PWR

cable pass through

to cage hole.

Hole for cable routing

Rotate

Photo 10

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Pick up FIO bracket

from chassis as shown.

See Photo 11

Push HDD latch then

push HDD in the order

and release screws as

shown.

See Photo 12, 13

Screw tool:

Star screwdriver OD

3.3mm.

Push ODD latch then

pull ODD as shown.

See Photo 14, 15

Photo 11

Photo 12

Photo 13

Push

EL-MF877-00 Page 8

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PSG instructions for this template are available at EL-MF877-01

Photo 14

Pull

Photo 15

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01



Release all cables

See Photo 16, 17,

18, 19, 20

Photo 16

Photo 17

Photo 18

Photo 19

Photo 20

Release cable from

fan duct hooks

EL-MF877-00 Page 10

Template Revision B

PSG instructions for this template are available at EL-MF877-01



Push fan duct latch

then pick up fan duct

from chassis as

shown.

See Photo 21, 22

Photo 22

Photo 21

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