Grantech SYS86355VGGA-E Manuel utilisateur
SYS86355VGGA-E User Manual
Revision: 1.0
Release date: April 27, 2020
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 PRODUCT FEATURES ..............................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 MAIN BOARD DIAGRAM ...........................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 LOCATION OF INTERNAL JUMPER AND CONNECTOR........................................5
2-2 INTERNAL JUMPER AND CONNECTOR SETTING.................................................6
2-2-1 CONNECTORS .............................................................................................9
2-2-2 HEADERS .....................................................................................................13
TABLE OF CONTENT
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
4.0 Fourth Edition April 27, 2020
Item Checklist
Motherboard
Cable(s)
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Product Features
Intel®LGA 1150 Socket Core i7/i5/i3/Pentium Processor
Support 2 x DDR3 /DDR3L 1600/1333Mhz SO-DIMM up to 16GB
2 x Intel®i211AT Gigabit Ethernet
4 x USB3.0 (PCI-E to USB3.0), 8 x USB2.0
2 x SATA Ports, 1 x PCI-Ex16 Slot
1 x M-SATA (Co-lay Mini PCIe, Full size), 2 x Mini PCIe connector(Full size)
12 x RS232 serial port (COM1/COM2 support RS232/422/485)
2 x CRT Ports (CRT2 support Dummy load function)
Support SIM Card Socket, TPM Header
4 Phase CPU Power Support 84W CPU
Integrated HD Audio CODEC with 6.0 CH
2
1-2 Specification
Spec
Description
CPU
Intel®LGA 1150 Socket Core i7/i5/i3/Pentium Processor
Memory
2* DDR3/DDR3L 1600/1333MHz SO-DIMM slot up to 16GB
Expansion Slot
2* Full-size Mini PCIe slot (MINI_CARD Co-lay MSATA)
1 * PCIex16 Slot
1* SIM Card socket
Storage
2* SATA III 6G/s Connector
1* Full-size mSATA (MINI_CARD Co-lay mini-PCIE)
LAN Chip
2* Intel®i211AT GbE
Support Fast Ethernet LAN function of providing 10/100/1000Mbps
Ethernet data transfer rate
Audio Chip
Realtek ALC662 HD Audio Codec integrated
Audio driver and utility included
BIOS
AMI 32MB Flash ROM
Rear I/O
1 * HDMI
2 * VGA
2* RS 232/422/485 serial ports (COM1/2)
2* RJ45, 10/100/1000 Mbps
4* USB3.0 & 2* USB2.0 ports
1* MIC, Line-in, Line-out port
Internal I/O
1* Front panel header
1* PS/2 header
6* USB 2.0 header
10* RS 232 Serial port header (COM3/COM4/COM5-COM8,COM9-
COM12)
1 * dual RS 485 serial port header (DUAL_RS485)
1* parallel port header
1* TPM header
1* 8-bit GPIO (4* In and 4* Out)
1* SPEAK_CON amplifier header
1* LAN LED header
1* AT_ATX Mode header
1* CPU / Chassis Fan connectors
3
1-3 Main Board Diagram: Front
Intel CPU
Socket
Top/Middle:
USB2.0
Bottom:
HDMI
Top:
RJ-45
LAN Port1
Middle/Bottom:
USB3.0 Ports
Top:
Line-In
Middle:
Line-Out
Bottom:
MIC
CPUFAN Header
Top:
COM1
Bottom:
VGA1
SYSFAN1 Header
JW_FP
Header
SPEAK_CON
Header
SIM Card
Socket
Top:
COM2
Bottom:
VGA2
Top:
RJ-45
LAN Port2
Middle/Bottom:
USB3.0 Ports
PCIe x16 Slot
SODIMM1
ATXPWR
Connector
ATX12V
Connector
Mini-PCIe Slot
Mini-PCIE/
mSATA Slot
SATAIII Ports
(SATA1/2)
LAN_LED
Header
4
Main Board Diagram: Back
SODIMM2
5
Chapter 2
Hardware Installation
2-1 Location of Internal Jumper and Connector
Intel CPU
Top/Middle:
USB2.0
Bottom:
HDMI
Top:
RJ-45
LAN Port2
Middle/Bottom:
USB3.0 Ports
Top:
Line-In
Middle:
Line-Out
Bottom:
MIC
CPUFAN Header
Top:
COM1
Bottom:
VGA1
SYSFAN1 Header
JW_FP
Header
SPEAK_CON
Header
SIM Card
Socket
Top:
COM2
Bottom:
VGA2
Top:
RJ-45
LAN Port1
Middle/Bottom:
USB3.0 Ports
PCIe x16
Connector
SODIMM1
ATXPWR
Connector
ATX12V
Connector
Mini PCIe
Connector
JPCOM1
JPCOM2
LAN_LED
Header
COM5-COM8
COM3
JPCOM3
JPCOM4
COM4
COM3_SEL
DUAL_RS485
F_USB3
F_USB2
JP3
COM4_SEL
TPM1
PARALLEL
COM9-COM12
F_USB1
BATCON
PS2_VCC
PS2_CON1
JBAT
GPIO_CON
CASE_OPEN
AT_ATX_MODE
SATAIII Ports
(SATA1/2)
JP4
Mini-PCIE/
mSATA Slot
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