Gigabyte AMD785G Manuel utilisateur

Federal Communications Commission (FCC) Statement

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable

protection against harmful interference in a residential installation. This equipment

generates, uses and can radiate radio frequency energy and, if not installed and used in

accordance with instructions contained in this manual, may cause harmful interference

to radio and television communications. However, there is no guarantee that interference

will not occur in a particular installation.

If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to

correct the interference by one or more of the following measures:

- REORIENT OR RELOCATE THE RECEIVING ANTENNA

- INCREASE THE SEPARATION BETWEEN THE EQUIPMENT AND THE RECEIVER

- CONNECT THE EQUIPMENT INTO AN OUTLET ON A CIRCUIT DIFFERENT FROM

THAT OF THE RECEIVER

- CONSULT THE DEALER OR AN EXPERIENCED AUDIO/TELEVISION TECHNICIAN

NOTE: Connecting this device to peripheral devices that do not comply with Class B

requirements, or using an unshielded peripheral data cable, could also result in

harmful interference to radio or television reception.

The user is cautioned that any changes or modifications not expressly approved

by the party responsible for compliance could void the user’s authority to operate

this equipment.

To ensure that the use of this product does not contribute to interference, it is

necessary to use shielded I/O cables.

copied or reproduced by any means.

While every precaution has been taken in the preparation of this manual, no responsibility

for errors or omissions is assumed. Neither is any liability assumed for damages resulting

from the use of the information contained herein.

Trademarks

All brand names, logos and registered trademarks mentioned are property of their

respective owners.

Electronic Emission Notices

Safety Environmental Instruction

Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

0 to 40 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

AMD AM3 Processor Family

Cooling Solutions

As processor technology pushes to faster speeds and higher performance with increasing

operation clock, thermal management becomes increasingly crucial while building computer

systems. Maintaining the proper computing environment without thermal increasing is the key to

reliable, stable, and 24 hours system operation. The overall goal is keeping the processor

below its specified maximum case temperature. Heatsinks induce improved processor heat

dissipation through increasing surface area and concentrated airflow from attached active

cooling fans. In addition, interface materials allow effective transfers of heat from the

processor to the heatsink. For optimum heat transfer, AMD recommends the use of thermal

grease and mounting clips to attach the heatsink to the processor.

Please refer to the website below for collection of heatsinks evaluated and recommended for

Socket AM3 processors by AMD. In addition, this collection is not intended to be a

comprehensive listing of all heatsinks that support AM3 processors.

Introduction

Features of motherboard

The AMD785G chipset motherboard series are based on the latest AMD785G Chipset

and the SB710 chipset which supports the following AM3 CPU in the 95W range:

Phenom II x 4；Phenom II x 3；Phenom II x2；Athlon II x4；Athlon II x3；Athlon II x2；

Sempron. With an integrated low-latency high-bandwidth DDRIII memory controller

and a highly-scalable Hyper Transport technology-based system bus up to HT 3.0.

AMD785G Platform Processor Chipset motherboard series deliver the outstanding

system performance and professional desktop platform solution.

The AMD785G Series motherboards support new generation Socket AM3 processors

with an integrated DDRIII memory controller for Dual channel DDRIII800 /DDRIII1066/

DDRIII1333 DDRIII Module up to 8GB, also provide a DDRIII 128Mb GPU Memory.

The motherboard is embedded with SB710 chipset of providing ULTRA ATA 133

connectors and Serial ATA2 with RAID 0, 1, 10 functions which support up to one IDE

and six Serial ATA2 devices to accelerate hard disk drives and guarantee the data

security without failure in advanced computing performance.

The AMD785G motherboards provide PCI-E Gigabit LAN chip which supports

10/100/1000Mbps data transfer rate. And the embedded ALC662 6-channel HD Audio

CODEC is fully compatible with Sound Blaster Pro standards that offer you with the

home cinema quality and satisfying software compatibility.

AMD785G Series motherboard series offer one PCI-Express2.0x16 graphics slots.

One PCI-Express 2.0 x16 deliver up to 8Gbyte/sec data transfer rate at each relative

direction. The AMD785G motherboards also carry two 32-bit PCI slots guarantee the

rich connectivity for the I/O peripheral devices. This motherboard support Hybrid

CrossFire function: when this function is selected through BIOS setting, the VGA Card

on PE1 and the integrated graphics chip together will activate a Hybrid CrossFire with

and the performance will be increased 15% to 75%.

Embedded USB controllers as well as capability of expanding to 8 of USB2.0

functional ports delivering 480Mb/s bandwidth of rich connectivity, these

motherboards meet the future USB demands which are also equipped with hardware

monitor function on system to monitor and protect your system and maintain your

non-stop business computing.

Some special features--- CPU Thermal Throttling/ CPU VID/OC-CON/ G.P.I Function/3D

Audio/Windows7 in this motherboard are designed for power user to use the

over-clocking function in more flexible ways. But please be caution that the

over-clocking maybe causes the fails in system reliabilities. This motherboard

provides the guaranteed performance and meets the demands of the next generation

computing. But if you insist to gain more system performance with variety possibilities

of the components you choose, please be careful and make sure to read the detailed

descriptions of these value added product features, please get them in the coming

section.

Special Features of Motherboard

CPU Thermal Throttling Technology---(The CPU Overheat Protection Technology)

To prevent the increasing heat from damage of CPU or accidental shutdown while at high

workload, the CPU Thermal Throttling Technology will force CPU to enter partially idle mode from

87.5% to 12.5% according to preset CPU operating temperature in BIOS (from 40℃to 90℃).

When the system senses the CPU operating temperature reaching the preset value, the CPU

operating bandwidth will be decreased to the preset idle percentage to cool down the processor.

When at throttling mode the beeper sound can be optionally selected to indicate it is in working.

(For detail operating please read Section 3-11 Bi-turbo Configuration)

CPU VID--- (Shift to Higher Performance)

The CPU voltage can be adjusted for the precisely over-clocking of extra demanding computing

performance.

OC-CON ---（High-polymer Solid Electrolysis Aluminum Capacitors）

The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade,

OC-CON capacitors possess superior physical characteristics that can be while reducing the

working temperature between 20 degrees Centigrade each time, intact extension 10 times of

effective product operation lives, at not rising degrees Centigrade of working temperatures each

time a relative one, life of product decline 10% only too.

G.P.I Function--- G.P.I is a technology with remarkable power saving function: when you are

using a computer with G.P.I mold turned on, you save averagely 10.5W in power consumption in

the whole process than normal computer without G.P.I technology.

3D Audio

OP with two-stage Butterworth filter and quadruple non-inverting amplifier enhances bass effect

under the 100MHz range to perfect audio effect, brings you stunning shock experience in video

game, true-to-life simulated feeling when watching films and the greatest touch as that in the

concert.

Specification

Spec

Description

Design

Micro ATX form factor; size:24.5cm*21.0cm

Chipset

AMD785G North Bridge Chipset

AMD SB710 South Bridge Chipset

CPU Socket

Phenom II x 4；

Phenom II x 3；

Phenom II x2；

Athlon II x4；

Athlon II x3；Athlon II x2；Sempron series AM3 CPU in the

95W range:

Support HT 3.0

Memory Socket

240-pin DDRIII Module socket x 2

Support 2pcs DDRIII800/DDRIII1066/DDRIII1333 Modules

Expandable to 8GB

Dual channel supported

GPU Memory

Embedded 128Mb DDRIII GPU sideport Memory

Expansion Slot

1 pcs PCI-Express 2.0 x16 by 16 lane

2pcs 32-bit PCI slots

Integrate IDE and

Serial ATA2 RAID

One IDE controllers support PCI Bus Mastering, ATA PIO/DMA

and the ULTRA DMA 33/66/100/133 functions that deliver the data

transfer rate up to 133 MB/s for 2 IDE Devices and for 6 Serial

ATA2 ports providing 300 MB/sec data transfer rate with RAID 0, 1,

10 functions

Gigabit LAN

Integrated PCI-E gigabit LAN chip.

Support Fast Ethernet LAN function of providing

10Mb/100Mb/1000 Mb/s data transfer rate

6 CH-Audio

Realtek ALC662 HD Audio 6-channel Audio Codec integrated

Support 6-channel 3D surround & Positioning Audio

Audio driver and utility included

BIOS

AMI 8MB DIP Flash ROM BIOS

Multi I/O

PS/2 keyboard and PS/2 mouse connectors

Coaxial S/PDIF Out Connector x1

HDMI Connector x1

DVI Connector x1 (HDMI Connector and DVI Connector can not be

used at the same time)

VGA Connector x1

USB2.0 port x 4 and header x 2

RJ-45 LAN Connector x1

Audio connector x1

Hard disk driver connector x 1/ SATA connector x 6

Serial Port header x1

HDMI_SPDIF header x1

Layout Diagram & Jumpers Setting

DDRIII 128Mb

GPU Memory

3D Audio button

Front Panel Header

ATA 133 IDE

Conn.(IDE1)

CPU Socket

ATX Power Conn.

PCI Slots

PS2 KB/MS Port

Audio Connector

DDRIII Slot x 2

ATX 12V Power Connector

Realtek ALC662

Audio Decode

CDIN

Gigabit LAN

Chip

Speaker

USB Header

Power Led

AMD 785G Chipset

Front Panel

Audio Header

KBMB/USB Power On(JP1)

COM

Header

USB Connector

PS/2 Mouse

PS/2 Keyboard

Line-OUT

MIC-IN

USB Connector

CPUFAN

SYS FAN1

PCI Express2.0 x16

@16-lane

VGA Connector

over DVI Connector

SYSFAN1

VGA Connector

HDMI Connector

Line-IN

HDMI Connector

RJ-45 LAN

Serial-ATAII Connectors

SATA1, 2, 3,4,5,6

8Mbit Flash ROM BIOS

HDMI-SPDIF

Power-saving LED

DVI Connector

SPDIF_OUT Connector

SPDIF_OUT

Connector

RJ-45 over

USB Connector

AMD SB710 Chipset

JBAT

Hardware Installation

WARNING! Turn off your power when adding or removing expansion cards or

other system components. Failure to do so may cause severe

damage to both your motherboard and expansion cards.

Hardware installation Steps

Before using your computer, you had better complete the following steps:

1. Check motherboard jumper setting

2. Install CPU and Fan

3. Install System Memory (DIMM)

4. Install Expansion cards

5. Connect IDE and Front Panel /Back Panel cable

6. Connect ATX Power cable

7. Power-On and Load Standard Default

8. Reboot

9. Install Operating System

10. Install Driver and Utility

Checking Motherboard’s Jumper Setting

(1) Keyboard/USB function Enabled/Disabled: JP1

Keyboard/Mouse & USB Power On Setting

2-3 Closed KB/USB Power ON Enabled

JP1

1-2 Closed KB/USB Power ON Disable (Default)

(2) CMOS RAM Clear (3-pin) : JBAT

A battery must be used to retain the motherboard configuration in CMOS RAM short

1-2 pins of JBAT to store the CMOS data.

To clear the CMOS, follow the procedure below:

1. Turn off the system and unplug the AC power

2. Remove ATX power cable from ATX power connector

3. Locate JBAT and short pins 2-3 for a few seconds

4. Return JBAT to its normal setting by shorting pins 1-2

5. Connect ATX power cable back to ATX power connector

Note: When should clear CMOS

1. Troubleshooting

2. Forget password

3. After over clocking system boot fail

CMOS RAM Clear Setting

2-3 Closed Clear CMOS

JBAT

1-2 Closed Normal

Install CPU

About AMD AM3 CPU Installation

This motherboard provides a socket AM2 surface mount, Zero Insertion Force (ZIF)

socket, referred to as the mPGA940 socket supports AMD AM3 series processors.

The CPU that comes with the motherboard should have a cooling FAN attached to

prevent overheating. If this is not the case, then purchase a correct cooling FAN

before you turn on your system.

WARNING! Be sure that there is sufficient air circulation across the processor’s

heatsink and CPU cooling FAN is working correctly, otherwise it may

cause the processor and motherboard overheat and damage, you

may install an auxiliary cooling FAN, if necessary.

To install a CPU, first turn off your system and remove its cover. Locate the ZIF

socket and open it by first pulling the level sideways away from the socket then

upward to a 90-degree angle. Insert the CPU with the correct orientation as shown

below. The notched corner should point toward the end of the level. Because the

CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation

as shown.

CPU ZIF mPGAB Socket

Colden Arrow

SocketAM2

When you put the CPU into the ZIF socket, No force required to insert of the CPU, and

then press the level to locate position slightly without any extra force.

Install Memory

This motherboard provides two 240-pin DDRIII DUAL INLINE MEMORY MODULES

(DIMM) socket for DDRIII memory expansion to maximum memory volume of 8 GB

DDR SDRAM.

Valid Memory Configurations

Bank

240-Pin DIMM

PCS

Maximum Capacity

DDRIII1

DDRIII800/DDRIII1066/DDRIII1333/

4GB

DDRIII2

DDRIII800/DDRIII1066/DDRIII1333/

4GB

Total

System Memory (Max 4 GB)

8GB

Recommend DIMM Module Combination

：

1. One DDRIII Memory Module ----Plug in DDRIII1

2. Two DDRIII Memory Modules---Plug in DDRIII1 and DDRIII 2 for Dual channel

function

Dual channel Limited!

1. Dual channel function only supports when 2 DDRIII Modules plug in either both DDRIII1

& DDRIII2.

2. Memory modules plugged in DDRIII1 & DDRIII2 must be of the same type, same size,

and same frequency for dual channel function.

Install DDRIII modules to your motherboard is not difficult, you can refer to figure

below to see how to install a 240-Pin DDRIII800/DDRIII1066/DDRIII1333/DDRIII1600

module.

DIMM2 (BANK2+BANK3)

DIMM1 (BANK0+BANK1)

DDRIII1 &DDRIII2:

Dual Channel

NOTE! When you install DIMM module fully into the DIMM socket the eject tab should be

locked into the DIMM module very firmly and fit into its indention on both sides.

Expansion Cards

Procedure For Expansion Card Installation

1. Read the documentation for your expansion card and make any necessary

hardware or software setting for your expansion card such as jumpers.

2. Remove your computer’s cover and the bracket plate on the slot you intend to use.

3. Align the card’s connectors and press firmly.

4. Secure the card on the slot with the screen you remove above.

5. Replace the computer system’s cover.

6. Set up the BIOS if necessary.

7. Install the necessary software driver for your expansion card.

2-5-2 Assigning IRQs For Expansion Card

Some expansion cards need an IRQ to operate. Generally, an IRQ must exclusively

assign to one use. In a standard design, there are 16 IRQs available but most of

them are already in use.

Standard Interrupt Assignments

IRQ

Priority

Standard function

N/A

System Timer

N/A

Keyboard Controller

N/A

Programmable Interrupt

3 *

Communications Port (COM2)

4 *

Communications Port (COM1)

5 *

Sound Card (sometimes LPT2)

6 *

Floppy Disk Controller

7 *

Printer Port (LPT1)

N/A

System CMOS/Real Time Clock

9 *

ACPI Mode when enabled

10 *

IRQ Holder for PCI Steering

11 *

IRQ Holder for PCI Steering

12 *

PS/2 Compatible Mouse Port

N/A

Numeric Data Processor

14 *

Primary IDE Channel

15 *

Secondary IDE Channel

* These IRQs are usually available for ISA or PCI devices.

NOTE! If using PCI cards on shared slots, make sure that the drivers support “Shared

IRQ” or that the cards don’t need IRQ assignments. Conflicts will arise between the

two PCI groups that will make the system unstable or cards inoperable.

Expansion Slot

One PCI-Express2.0 x16@16 lane graphic slot offer 8Gbyte/sec data transfer rate at

each relative direction and up to 16Gbyte/sec concurrent bandwidth at full speed.

Fully compliant to the PCI Express Base Specification revision2.0, support PCI

Express VGA card, and other PCI Express device. Two 32-bit PCI slots guarantee the

rich connectivity for the I/O of peripherals.

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