Forenex MBE71 Manuel utilisateur

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MBE71

User

Manual

MBE71

Motherboard

User Manual

(Preliminary)

SBC

with Dual Cortex-A72 @2.0Ghz

+ Quad Cortex-A53 @ 1.5Ghz Core

Version: V3.0

Document No: doc-mbe7118w40v30

PCB Bare Board: PB71m68v11

*The content of this document is subject to be change without notice

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Packing List

1 x MBE71 Motherboard.

Ordering Information

Part Number: MBE71-abcxyMN

HDMI 2.0, eDP1.3 (2xlane), GigE, 5G-Wifi with mPCIE Socket, OTG-USB 3.0 (Type-

A), USB2.0 (Type-A), Micro-SD Socket, Grove GPIOs, Reset CONN, Optic Fiber CONN, 4-

wire UART Port, IR Port, Debug Port, Audio, USB-Hub, DC-Jack.

• abc : The type of RK3399 Processor

R39: Dual Core-A72 @2.0Ghz,+ Quad Core-A53 @ 1.5Ghz, (0 ~ 85°C)

K39: Dual Core-A72 @2.0Ghz,+ Quad Core-A53 @ 1.5Ghz, ( -20°~ 105°C)

• x: The size code of DDR3 Memory on board

1 1GB of DDR3

2 2GB of DDR3

• y: The size code of eMMC on board

4 4GB

8 8GB

F 16GB

• MN : The Function code

SS Standards

S1 Add Wi-Fi module

PS SS + 802.3at (PoE+)

P1 S1 + 802.3at (PoE+)

Optional Accessories

FEP21-B4356C AP12356,11 a/b/g/n/ac (2T2R)+BT(V4.1 LE), Wi-Fi module

FR-e2L eDP to Dual LVDS Converter Board

FR-U2R2 USB to Dual full RS232/RS422/485 Convert Board

FR-WW01 USB to LTE 4G module Carrier Board

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Revision histories

Rev. No.

Date

Substantial Changes

1.0

2021/01

First issue.

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Manual

Table of Contents

1. General Information ........................................................................................................... 6

1-1. Features ................................................................................................................................. 6

1-2. Function Block Diagram ......................................................................................................... 8

1-3. Board Dimension.................................................................................................................... 9

1-4. I/O Connector Summary ........................................................................................................ 9

1-5. I/O Connector Placement .................................................................................................... 10

2. Peripherals Port Description............................................................................................. 11

2-1. Power Jack (J4)(W4)............................................................................................................. 11

2-2. Power Switch, Header (H15)................................................................................................ 11

2-3. RTC Battery Backup Connector (W1)................................................................................... 11

2-4. IR Receiver Connector (IR1) ................................................................................................. 12

2-5. Power LED Connector (W7) ................................................................................................. 12

2-6. Image File Update Jumper (JP1) .......................................................................................... 12

2-7. USB 3.0 Type-A Port (J2) ...................................................................................................... 13

2-8. USB 2.0 Type-A Port (J3) ...................................................................................................... 13

2-9. Gigabit Ethernet Port w/PoE+ (J6)....................................................................................... 14

2-10. PoE+ Power Extract Connector (W12)................................................................................. 14

2-11. Micro SD/SDHC Card Slot (J1) .............................................................................................. 14

2-13. eDP Interface (ZIF2) ............................................................................................................. 15

2-14. LCD Panel Power Selection (H2) .......................................................................................... 16

2-15. LCD Backlight Control Connector (W2)................................................................................ 16

2-16. PCAP Touch Interface (W3).................................................................................................. 16

2-17. HDMI® 2.0 Port (J5).............................................................................................................. 17

2-18. Reset, wifi LEDs, Buzzer Combo Connector (W19) .............................................................. 17

2-19. RS232 Debug Connector (W20) ........................................................................................... 18

2-20. Grove-I2C,SPI,ADC,GPIOs Connector (W15)........................................................................ 18

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2-22. USB host2.0, MEMS signals Combo Connector (W10) ........................................................ 19

2-23. HUB Extended Ports (W8, W9, W18)................................................................................... 19

2-24. Audio Codec Interface (H10)................................................................................................ 20

2-25. mini-PCIe Slot(J9) ................................................................................................................. 21

2-26. MIPI-CSI Interface (W13) (Optional) ,Under development.................................................. 22

3. Software Programming Guide .......................................................................................... 23

3-1. Android Programming Guide............................................................................................... 23

3-1-1. ADB installation...............................................................................................23

3-1-2. To install APK software over the ADB function of PC : ..........................................25

3-1-3. GPIO installation..............................................................................................25

3-2. Linux Programming Guide.................................................................................................... 26

3-2-1. GPIO installation..............................................................................................26

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1. General Information

The motherboard MBE71 Series integrated various useful peripheral circuit that provides

completed connectivity for a wide variety of industrial automation and transportation

applications. Besides, the high-performance media-processor also especially for

infotainment/entertainment, HMI applications.

The heart of the MBE71 is the Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz

processor, which provides a complete platform for project evaluation and solution feasibility

testing that decreases the time to market and lowers initial cost.

1-1. Features

Processor:

Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz (MBE70Kxx)

Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz (MBE70xx)

System Memory:

1GB up to 2GB DDR3-1066 SDRAM onboard

Storage:

4GB up to 16GB eMMC Flash memory

Graphics:

ARM Mail-T860MP4 (Embedded 3D GPU), AFBC supported

Supports OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11

Video Decoder:

-H.264/H.265, 10bit, up to 4Kx2K@60fps,

-VP9, 8bit, up to 4Kx2K@60fps,

-MPEG-4/MPEG-2/VP8 up to 1080p@60fps

Video Encoder:

-H.264/MVC/VP8 encoders by 1080p@30fps

Display Interfaces:

Supports eDP 1.3, 2 lane (2.7Gbps per lane) , Res. up to1920x1200p@60fps

, 4 lane (2.7Gbps per lane) , Res. up to2560x1600p@60fps

Supports HDMI® V2.0, Res. up to 4Kx2K @60fps, HDCP1.4 /2.2

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Audio:

Realtek ALC5640 low power stereo codec

Inside Stereo Class-D speaker amplifiers provide 1.5W per channel into 8Ω or 2W

per channel into 4Ω

LAN:

Realtek RTL8211E Gigabit Ethernet transceiver with RGMII support

Extension USB device:

MicroChip USB2514, USB 2.0 high speed 4-port hub controllers

External extension memory Slot:

Micro-SD 3.0 slot enable capacity up to 256GB

Various interfaces for expansion peripherals:

USB-HUB Port Wafer x 3

Optic Fiber Wafer x 1, 4-wire UART Wafer x 1

Grove (I2C, SPI, ADC, GPIOs) Wafer x 1

Optional MIPI-CSI/DSI interface x 1, MEMS Wafer x 1, IR receiver Wafer x 1

Dimension (W x D x H):

126.5mm x 90mm x 18.7mm (4.98” x 3.5” x 0.76”)

Operating Temperature (3G and Wi-Fi not included):

-20°C ~ 70°C (MBE70E-K39 series)

0°C ~ 70°C (MBE70C-R39 series)

Operating Humidity:

0% ~ 90% relative humidity (non-condensing)

Operating System:

Android 7.1 / 8

Debian 9

Note:

1. The Operating Temperature is a result of the test performed in experimental

chamber. It is highly suggested to execute a solid testing under actually application

environment.

2. More frequent and larger data access on eMMC memory makes the lifespan

shorter. Therefore, it is highly recommended to use a Micro SD card for large data

access.

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1-2. Function Block Diagram

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1-3. Board Dimension

Dimension: 126.5mm (W) x 90mm (L) x 18.7mm (H)

Contact Service salesman for detail “.DXF” file.

1-4. I/O Connector Summary

External I/O (On board side):

Power Jack (J4),(W4)

Micro SD Socket (J1)

USB 3.0 Type-A Port (J2)

USB 2.0 Type-A Port (J3)

HDMI® Port (J5)

Gigabit Ethernet Port w/ PoE+ (J6)

Internal I/O

Image File Update Jumper (JP1)

RTC Battery Backup CONN (W1)

Power Switch, Header (H15)

Power LED CONN (W7)

USB host2.0, MEMS signals Combo CONN (W10)

Grove-I2C,SPI,ADC,GPIOs Combo CONN (W15)

Optic Fiber Light-Bar CONN (W14)

eDP Interface (ZIF2)

LCD Panel Power Selection, Header (H2)

LCD Backlight Control CONN (W2)

PCAP Touch CONN (W3)

4-wire UART CONN (W17)

RS232 Debug CONN (W20)

Reset, Wi-Fi LED, Buzzer Combo CONN (W19)

PoE+ Power Extract CONN (W12)

HUB Extended Ports, CONNs (W8, W9, W18)

Audio Codec Interface, Header (H10)

Mini-PCIe Slot (J9) for AP12356, 802.11 a/b/g/n/ac (2T2R)+BT(V4.1 LE) module

------Provides below are optional items ------

IR Receiver Connector, Wafer (IR1)

MIPI-CSI/DSI Interface (W13)

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1-5. I/O Connector Placement

Component Side

Solder Side

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