Enclustra Mars ZX3 Manuel utilisateur

Mars ZX3 SoC Module

User Manual

Purpose

The purpose of this document is to present the characteristics of Mars ZX3 SoC module to the user, and to

provide the user with a comprehensive guide to understanding and using the Mars ZX3 SoC module.

Summary

This document first gives an overview of the Mars ZX3 SoC module followed by a detailed description of its

features and configuration options. In addition, references to other useful documents are included.

Product Information Number Name

Product MA-ZX3 Mars ZX3 SoC Module

Document Information Reference Version Date

Reference / Version / Date D-0000-424-004 05 21.08.2018

Approval Information Name Position Date

Written by DIUN, GKOE Design Engineer 18.04.2016

Verified by GLAC Technical Expert 27.04.2016

Approved by RPAU Quality Manager 21.08.2018

Enclustra GmbH – Räffelstrasse 28 – CH-8045 Zürich – Switzerland

Phone +41 43 343 39 43 – www.enclustra.com

Unauthorized duplication of this document, in whole or in part, by any means is prohibited without the prior

written permission of Enclustra GmbH, Switzerland.

Although Enclustra GmbH believes that the information included in this publication is correct as of the date

of publication, Enclustra GmbH reserves the right to make changes at any time without notice.

All information in this document is strictly confidential and may only be published by Enclustra GmbH,

Switzerland.

All referenced trademarks are the property of their respective owners.

Document History

Version Date Author Comment

05 21.08.2018 DIUN Minor corrections and style updates

04 04.05.2017 DIUN Updated EEPROM map, block diagram and footprint information

03 27.12.2016 DIUN Added tool support information and NAND flash programming in-

formation

02 11.08.2016 DIUN Minor updates and clarifications

01 03.05.2016 DIUN Version 01

D-0000-424-004 2 / 48 Version 05, 21.08.2018

Table of Contents

1 Overview 5

1.1 General ................................................... 5

1.1.1 Introduction ................................................ 5

1.1.2 Warranty .................................................. 5

1.1.3 RoHS .................................................... 5

1.1.4 DisposalandWEEE ............................................ 5

1.1.5 Safety Recommendations and Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.6 ElectrostaticDischarge .......................................... 6

1.1.7 Electromagnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2 Features................................................... 6

1.3 Deliverables ................................................ 6

1.4 Accessories................................................. 7

1.4.1 ReferenceDesign ............................................. 7

1.4.2 EnclustraBuildEnvironment ....................................... 7

1.4.3 MarsPM3BaseBoard........................................... 7

1.4.4 MarsEB1BaseBoard ........................................... 7

1.5 XilinxToolSupport ............................................ 8

2 Module Description 9

2.1 BlockDiagram............................................... 9

2.2 Module Configuration and Product Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.3 Article Numbers and Article Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.4 TopandBottomViews .......................................... 12

2.4.1 TopView .................................................. 12

2.4.2 BottomView................................................ 12

2.5 Top and Bottom Assembly Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.5.1 TopAssemblyDrawing .......................................... 13

2.5.2 BottomAssemblyDrawing........................................ 13

2.6 ModuleFootprint ............................................. 13

2.7 MechanicalData.............................................. 14

2.8 ModuleConnector ............................................ 14

2.9 UserI/O................................................... 15

2.9.1 Pinout.................................................... 15

2.9.2 DifferentialI/Os .............................................. 16

2.9.3 I/OBanks.................................................. 16

2.9.4 VREFUsage................................................. 17

2.9.5 VCC_IOUsage ............................................... 17

2.9.6 SignalTerminations ............................................ 18

2.9.7 MultiplexedI/O(MIO)Pins........................................ 19

2.9.8 AnalogInputs ............................................... 20

2.10 Power.................................................... 20

2.10.1 PowerGenerationOverview ....................................... 20

2.10.2 PowerEnable/PowerGood........................................ 21

2.10.3 VoltageSupplyInputs........................................... 21

2.10.4 VoltageSupplyOutputs ......................................... 22

2.10.5 PowerConsumption............................................ 22

2.10.6 HeatDissipation.............................................. 23

2.11 ClockGeneration ............................................. 23

2.12 Reset .................................................... 24

2.13 LEDs..................................................... 24

2.14 DDR3SDRAM ............................................... 24

2.14.1 DDR3SDRAMType ............................................ 25

2.14.2 SignalDescription............................................. 25

2.14.3 Termination................................................. 25

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2.14.4 Parameters................................................. 25

2.14.5 DDR3LowVoltageOperation ...................................... 26

2.15 QSPIFlash ................................................. 26

2.15.1 QSPIFlashType .............................................. 27

2.15.2 SignalDescription............................................. 27

2.15.3 Configuration ............................................... 27

2.16 NANDFlash ................................................ 28

2.16.1 NANDFlashType ............................................. 28

2.16.2 SignalDescription............................................. 28

2.16.3 Parameters................................................. 28

2.17 SDCard................................................... 29

2.18 GigabitEthernet.............................................. 29

2.18.1 EthernetPHYType............................................. 29

2.18.2 SignalDescription............................................. 30

2.18.3 ExternalConnectivity ........................................... 30

2.18.4 MDIOAddress............................................... 30

2.18.5 PHYConfiguration............................................. 31

2.19 USB2.0 ................................................... 31

2.19.1 USBPHYType ............................................... 31

2.19.2 SignalDescription............................................. 31

2.20 Real-TimeClock(RTC)........................................... 31

2.20.1 RTCType .................................................. 32

2.21 SecureEEPROM .............................................. 32

2.21.1 EEPROMType ............................................... 32

2.22 RevisionDetection............................................. 32

3 Device Configuration 33

3.1 ConfigurationSignals........................................... 33

3.2 Pull-UpDuringConfiguration ...................................... 34

3.3 BootMode................................................. 34

3.3.1 JTAGBootMode.............................................. 35

3.3.2 NANDFlashBootMode ......................................... 35

3.4 JTAG..................................................... 35

3.4.1 JTAGonModuleConnector ....................................... 36

3.4.2 ExternalConnectivity ........................................... 36

3.5 QSPIBootMode.............................................. 36

3.6 SDCardBootMode............................................ 36

3.7 QSPI Flash Programming via JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.8 QSPI Flash Programming from an External SPI Master . . . . . . . . . . . . . . . . . . . . . . . . 37

3.9 NANDFlashProgramming........................................ 37

3.10 FPGA and QSPI Flash Programming using Xilinx Impact . . . . . . . . . . . . . . . . . . . . . . . 38

3.11 Enclustra Module Configuration Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

4 I2C Communication 39

4.1 Overview .................................................. 39

4.2 SignalDescription............................................. 39

4.3 I2CAddressMap ............................................. 40

4.4 SecureEEPROM .............................................. 40

4.4.1 MemoryMap ............................................... 40

5 Operating Conditions 43

5.1 AbsoluteMaximumRatings ....................................... 43

5.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

6 Ordering and Support 45

6.1 Ordering .................................................. 45

6.2 Support................................................... 45

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1 Overview

1.1 General

1.1.1 Introduction

The Mars ZX3 SoC module combines the Xilinx Zynq®-7020 All Programmable SoC (System-on-Chip) de-

vice with fast DDR3 SDRAM, NAND flash, quad SPI flash, a Gigabit Ethernet PHY, USB 2.0 On-The-Go PHY

and a real-time clock, forming a complete and powerful embedded processing system.

The SO-DIMM form factor allows space-saving hardware designs and quick and simple integration of the

module into the target application.

The use of the Mars ZX3 SoC module, in contrast to building a custom SoC hardware, significantly reduces

development effort and redesign risk and improves time-to-market for the embedded system.

Together with Mars base boards, the Mars ZX3 SoC module allows the user to quickly build a system pro-

totype and start with application development.

The Enclustra Build Environment [15] is available for the Mars ZX3 SoC module. This build system allows

the user to quickly set up and run Linux on any Enclustra SoC module. It allows the user to choose the

desired target and download all the required binaries, such as bitstream and FSBL (First Stage Boot Loader).

It downloads and compiles all required software, such as U-Boot, Linux, and BusyBox based root file system.

1.1.2 Warranty

Please refer to the General Business Conditions, available on the Enclustra website [1].

1.1.3 RoHS

The Mars ZX3 SoC module is designed and produced according to the Restriction of Hazardous Substances

(RoHS) Directive (2011/65/EC).

1.1.4 Disposal and WEEE

The Mars ZX3 SoC module must be properly disposed of at the end of its life.

The Waste Electrical and Electronic Equipment (WEEE) Directive (2002/96/EC) is not applicable for the Mars

ZX3 SoC module.

1.1.5 Safety Recommendations and Warnings

Mars modules are not designed to be “ready for operation” for the end-user. These can only be used in

combination with suitable base boards. Proper configuration of the hardware before usage is required.

Ensure that the power supply is disconnected from the board before inserting or removing the Mars ZX3

SoC module, connecting interfaces, replacing SD cards and batteries, or connecting jumpers.

Touching the capacitors of the DC-DC converters can lead to voltage peaks and permanent damage; over-

voltage on power or signal lines can also cause permanent damage to the module.

D-0000-424-004 5 / 48 Version 05, 21.08.2018

Warning!

Use the Mars ZX3 SoC module only with base boards designed for the Enclustra Mars module family.

Inserting the Mars ZX3 SoC module into a SO-DIMM connector designed for memory (e.g. a computer

main board) may damage the module and the carrier board.

1.1.6 Electrostatic Discharge

Electronic boards are sensitive to electrostatic discharge (ESD). Please ensure that the product is handled

with care and only in an ESD-protected environment.

1.1.7 Electromagnetic Compatibility

The Mars ZX3 SoC module is a Class A product and is not intended for use in domestic environments. The

product may cause electromagnetic interference, for which appropriate measures must be taken.

1.2 Features

•Xilinx Zynq®-7020 All Programmable SoC, CLG484 package

•Dual ARM® Cortex™-A9 MPCore™with CoreSight™ and NEON™ extension

•Xilinx Artix-7 28 nm FPGA fabric

•108 user I/Os up to 3.3 V

•12 ARM peripheral I/Os (SPI, SDIO, CAN, I2C, UART) shared with FPGA I/Os

•96 FPGA I/Os (single-ended, differential or analog)

•Up to 1 GB DDR3 SDRAM

•512 MB NAND flash

•64 MB quad SPI flash

•Gigabit Ethernet

•USB 2.0 On-The-Go (OTG)

•Real-time clock

•SO-DIMM form factor (30 ×67.6 mm, 200 pins)

•The module can be operated using a single 3.3 V supply voltage

1.3 Deliverables

•Mars ZX3 SoC module

•Mars ZX3 SoC module documentation, available via download:

•Mars ZX3 SoC Module User Manual (this document)

•Mars ZX3 SoC Module Reference Design [2]

•Mars ZX3 SoC Module IO Net Length Excel Sheet [3]

•Mars ZX3 SoC Module FPGA Pinout Excel Sheet [4]

•Mars ZX3 SoC Module User Schematics (PDF) [5]

•Mars ZX3 SoC Module Known Issues and Changes [6]

•Mars ZX3 SoC Module Footprint (Altium, Eagle, Orcad and PADS) [7]

•Mars ZX3 SoC Module 3D Model (PDF) [8]

•Mars ZX3 SoC Module STEP 3D Model [9]

•Module Pin Connection Guidelines [10]

•Mars Master Pinout [11]

•Enclustra Modules Heat Sink Application Note [17]

•Enclustra Build Environment [15] (Linux build environment; refer to Section 1.4.2 for details)

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1.4 Accessories

1.4.1 Reference Design

The Mars ZX3 SoC module reference design features an example configuration for the Zynq-7000 SoC de-

vice, together with an example top level HDL file for the user logic.

A number of software applications are available for the reference design, that show how to initialize the

peripheral controllers and how to access the external devices. Pre-compiled binaries are included in the

archive, so that the user can easily check that the hardware is functional.

The reference design can be downloaded from the Enclustra download page [2].

1.4.2 Enclustra Build Environment

The Enclustra Build Environment [15] enables the user to quickly set up and run Linux on any Enclustra SoC

module. It allows the user to choose the desired target, and download all the required binaries, such as

bitstream and FSBL. It downloads and compiles all required software, such as U-Boot, Linux, and BusyBox

based root file system.

The Enclustra Build Environment features a graphical user interface (GUI) and a command line interface (CLI)

that facilitates the automatic build flow.

1.4.3 Mars PM3 Base Board

•Mars 200-pin SO-DIMM socket

•FMC LPC (Low Pin Count) connector (72 I/Os)

•40-pin GPIO connector (optional, shared with FMC I/Os)

•RJ45 Gigabit Ethernet connector

•Mini HDMI connector for PCIe and LVDS applications (module dependent)

•Cypress FX3 USB 3.0 device controller (16-bit Slave-FIFO interface or 32-bit Slave-FIFO interface shared

with FMC I/Os)

•USB 3.0 B device connector

•USB 2.0 A host connector

•Micro USB 2.0 B device connector with FTDI USB device controller

•Battery holder for the real-time clock

•microSD card holder

•Fan connector, various switches and LEDs

•Single 12 V DC supply voltage or USB bus-powered (with restrictions)

•Form factor: 100 ×72 mm (pico-ITX)

Please note that the available features depend on the equipped Mars module type.

1.4.4 Mars EB1 Base Board

•Mars 200-pin SO-DIMM socket

•2×Mini Camera Link connectors (requires FPGA support)

•HDMI 1.3 connector (requires FPGA support)

•40-pin GPIO connector (Anios)

•3×12-pin GPIO connector (two of the connectors with Pmod™ compatible pinout)

•RJ45 Ethernet connector

•USB 2.0 A host connector

•Micro USB 2.0 device connector (shared)

•FTDI USB 2.0 device controller with micro USB device connector

•microSD card holder

•Various switches and LEDs

•Integrated Xilinx compatible JTAG adapter

D-0000-424-004 7 / 48 Version 05, 21.08.2018

•Single 12 V DC supply voltage or USB bus-powered (with restrictions)

•Form factor: 120 ×80 mm

Please note that the available features depend on the equipped Mars module type.

1.5 Xilinx Tool Support

The SoC devices equipped on the Mars ZX3 SoC module are supported by the Vivado HL WebPACK Edition

software, which is available free of charge. Please contact Xilinx for further information.

D-0000-424-004 8 / 48 Version 05, 21.08.2018

2 Module Description

2.1 Block Diagram

Figure 1: Hardware Block Diagram

The main component of the Mars ZX3 SoC module is the Xilinx Zynq-7000 SoC device. Most of its I/O pins

are connected to the Mars module connector, making 108 user I/Os available to the user.

The SoC device can boot from the on-board QSPI flash, NAND flash or from an external SD card. For de-

velopment purposes, a JTAG interface is connected to Mars module connector.

The available standard configurations include 512 MB NAND flash, a 64 MB quad SPI flash and 512 MB or 1

GB DDR3 SDRAM.

Further, the module is equipped with a Gigabit Ethernet PHY and a USB 2.0 OTG PHY, making it ideal for

communication applications.

A real-time clock is available on the module and is connected to the global I2C bus.

On-board clock generation is based on a 33.33 MHz crystal oscillator.

The module can be operated using a single input supply of 3.3 V DC. All other necessary supply voltages are

generated on-board. Some of these voltages are available on the Mars module connector to supply circuits

on the base board.

Four LEDs are connected to the SoC pins for status signaling.

2.2 Module Configuration and Product Codes

Table 1 describes the available standard module configurations. Custom configurations are available; please

contact Enclustra for further information.

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Product Code SoC DDR3/DDR3L SDRAM Temperature Range

MA-ZX3-20-1C-D9 XC7Z020-1CLG484C 512 MB 0 to +70◦C

MA-ZX3-20-2I-D10 XC7Z020-2CLG484I 1024 MB -40 to +85◦C

Table 1: Standard Module Configurations

The product code indicates the module type and main features. Figure 2 describes the fields within the

product code.

Figure 2: Product Code Fields

Please note that for the first revision modules or early access modules, the product code may not respect

entirely this naming convention. Please contact Enclustra for details on this aspect.

2.3 Article Numbers and Article Codes

Every module is uniquely labeled, showing the article number and serial number. An example is presented

in Figure 3.

Figure 3: Module Label

The correspondence between article number and article code is shown in Table 2. The article code repre-

sents the product code, followed by the revision; the R suffix and number represent the revision number.

The revision changes and product known issues are described in the Mars ZX3 SoC Module Known Issues

and Changes document [6].

D-0000-424-004 10 / 48 Version 05, 21.08.2018

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