Embedded Artists LPC3250 Manuel utilisateur

LPC3250 Developer’s Kit v2 - User’s Guide

EA2-USG-1204 Rev A

LPC3250 Developer’s Kit v2

User’s Guide

Get Up-and-Running Quickly and

Start Developing Your Application On Day 1!

LPC3250 Developer’s Kit v2 - User’s Guide

Page 2

Embedded Artists AB

Davidshallsgatan 16

211 45 Malmö

Sweden

info@EmbeddedArtists.com

http://www.EmbeddedArtists.com

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translated into any language or computer language, in any form or by any means, electronic,

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Embedded Artists AB.

Disclaimer

Embedded Artists AB makes no representation or warranties with respect to the contents hereof and

specifically disclaim any implied warranties or merchantability or fitness for any particular purpose.

Information in this publication is subject to change without notice and does not represent a

commitment on the part of Embedded Artists AB.

Feedback

We appreciate any feedback you may have for improvements on this document. Please send your

comments to support@EmbeddedArtists.com.

Trademarks

All brand and product names mentioned herein are trademarks, services marks, registered

trademarks, or registered service marks of their respective owners and should be treated as such.

LPC3250 Developer’s Kit v2 - User’s Guide

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Table of Contents

1Document Revision History 6

2Introduction 7

2.1 Features 7

2.2 ESD Precaution 8

2.3 General Handling Care 9

2.4 LPC3250 Core Voltage Precaution 9

2.5 CE Assessment 9

2.6 Other Products from Embedded Artists 9

2.6.1 Design and Production Services 9

2.6.2 OEM / Education / QuickStart Boards and Kits 10

3LPC3250 OEM Board Design 11

3.1 LPC3250 OEM Board Schematics 11

3.1.1 Schematic Page 2: Crystals 11

3.1.2 Schematic Page 2: Booting 11

3.1.3 Schematic Page 2: SPI NOR FLASH 11

3.1.4 Schematic Page 2: Reset Generation 11

3.1.5 Schematic Page 2: I2C E2PROM 11

3.1.6 Schematic Page 3: 1.2V and 1.8V Fixed Voltages 12

3.1.7 Schematic Page 3: 1.2V Adjustable Voltage 12

3.1.8 Schematic Page 3: Input Voltage 12

3.1.9 Schematic Page 4: External Memories 12

3.1.10 Schematic Page 4: DDR SDRAM 12

3.1.11 Schematic Page 4: NAND Flash 13

3.1.12 Schematic Page 4: Buffers to External Interface 13

3.2 Memory Layout 13

3.3 LEDs 14

4OEM Base Board Design 15

4.1 Modifications to OEM Base Board 16

4.2 SP2: OEM Board Connector 16

4.3 SP2: Current Measurements 16

4.4 SP3: Expansion Connectors 16

4.5 SP4: External Memory Bus 17

4.6 SP5: Debug Interfaces 18

4.7 SP6: Ethernet Interface 20

4.8 SP6: SD/MMC Memory Card Interface 21

4.9 SP6: VBAT/ALARM Handling 22

4.10 SP7: I2C Peripherals 23

4.11 SP8: Analog Input 24

4.12 SP8: Digital IO 25

4.13 SP8: Serial Expansion Connector 25

LPC3250 Developer’s Kit v2 - User’s Guide

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4.14 SP8: NXP/Jennic RF Module Interface 27

4.15 SP9: UART Multiplexing 28

4.16 SP9: RS232 Interface 29

4.17 SP9: RS422/485 Interface 30

4.18 SP10: CAN 31

4.19 SP10: IrDA 32

4.20 SP11: USB Channel 1 33

4.20.1 USB Channel 1 as USB Host 34

4.20.2 USB Channel 1 as USB Device 34

4.20.3 USB Channel 1 as USB OTG 34

4.21 SP12: USB Channel 2 35

4.21.1 USB Channel 2 as USB Host 36

4.21.2 USB Channel 2 as USB Device 36

4.21.3 USB Channel 2 as USB OTG 36

4.22 SP13: UART-to-USB Bridge 37

4.23 SP13: Power Supply 38

4.24 SP14: LCD Expansion Interface 39

4.25 SP15: I2S Audio Codec 40

4.26 Default Jumpers Positions 42

4.27 Usage of CPU Pins 43

5Getting Started 48

5.1 Powering 48

5.2 Installing USB Driver 48

5.3 Building Sample Applications 49

5.3.1 Compile Using CodeSourcery 50

5.3.2 Compile Using Keil’s uVision 50

5.4 Booting 50

5.4.1 Kickstart Loader 51

5.4.2 Stage 1 Loader 51

5.4.3 Service Boot 55

5.5 Handling SO-DIMM Boards 58

5.6 Things to Note 58

5.6.1 LPC3250 Adjustable Core Voltage 58

5.6.2 NAND FLASH Bad Block 58

5.6.3 Brand of Memory Chips 59

5.6.4 LPC3250 Peripherals 59

5.6.5 Current Consumption and Limits of USB Ports 59

5.6.6 LCD flickering 59

5.6.7 Initialization of External Memory Bus 60

5.6.8 USB OTG Transceiver 60

5.6.9 OEM Base Board revision 60

6LCD Expansion Connector 61

7Troubleshooting 64

LPC3250 Developer’s Kit v2 - User’s Guide

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7.1 Powering 64

7.2 Contact with OEM Board MCU 65

7.3 Using Applications to Verify Correct Operation 65

8Further Information 66

LPC3250 Developer’s Kit v2 - User’s Guide

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1 Document Revision History

Revision

Date

Description

2012-06-18

First official revision of document for the OEM Base Board

PB1

2012-10-16

Clarified I2S jumper positions in Figure 25.

PB2

2013-06-05

Correction about which connector to use for USB Device on USB2.

2017-04-28

Added information that accelerometer MMA7455LT is no longer

mounted.

LPC3250 Developer’s Kit v2 - User’s Guide

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2 Introduction

Thank you for buying Embedded Artists’ LPC3250 Developer’s Kit based on NXP’s ARM926EJ-S

LPC3250 microcontroller.

This document is a User’s Guide that describes the LPC3250 OEM Board and the OEM Base Board

hardware design, which together form the LPC3250 Developer’s Kit.

Note that there is a previous version of the LPC3250 Developer’s Kit that was based on the QVGA

Base Board. This manual is for the new OEM Base Board (not the same as the QVGA Base Board).

2.1 Features

Embedded Artists’LPC3250 OEM Board lets you get up-and-running quickly. The small form factor

OEM board offers many unique features that ease your learning curve and program development. The

board has been designed for OEM applications with volume discount available. The features of the

LPC3250 OEM Board are:

NXP's ARM926EJ-S LPC3250 microcontroller in BGA package, with 256 KByte internal RAM

External data memory: 64 MB DDR SDRAM (16-bit databus width)

External FLASH memories: 128 MB (1Gbit) NAND FLASH and 4 MB (32Mbit) SPI-NOR

FLASH

13.0000 MHz crystal for cpu

32.768kHz RTC crystal

256 Kbit I2C E2PROM for storing non-volatile parameters

Buffered 16-bit data bus for external expansion

Voltage translation buffers. 3.3V external bus can be used.

100/10M Ethernet PHY/interface based on National/TI DP83848

200 pos expansion connector (SODIMM-200 format, 0.6mm pitch)

Almost all LPC3250 pins available (except dedicated pins for on-board memories and

internal powering)

3.15-3.3V powering

Onboard reset generation

5 LEDs

Compact SODIMM size: 66 x 48 mm

Eight layer PCB design for compact design and best EMC performance

There is an accompanying OEM Base Board that can be used for initial prototyping work. The features

of the board are:

Interfaces and Connectors

200 pos, 0.6mm pitch SODIMM connector for OEM Board

LCD expansion connector with control signals for touch screen interface

Expansion connector with all OEM Board signals

Ethernet connector (RJ45)

MMC/SD interface & connector

LPC3250 Developer’s Kit v2 - User’s Guide

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USB2: Device or Host interface & connector

Provision for NXP JN5148 RF module (former Jennic) interface (RF module not included)

Full modem RS232

RS422/485 interface & connector

Provision for IrDA transceiver interface (transceiver not mounted)

I2S audio codec (mic in, line in, line out, headphone out)

JTAG connector

Trace/ETM connector (not mounted)

Power

Power supply, either via USB or external +5V DC

Coin cell powering supported (CR1025 battery not included) for RTC and LED on ALARM

output.

Other

OEM Board current measuring

Parallel NOR flash on external memory bus

16-bit register and LEDs on external memory bus

5-key joystick

3-axis accelerometer (I2C connected) - not mounted on boards after March 2017

LM75 temperature sensor (I2C connected)

5 push-button keys (four via I2C and one on P2.10)

9 LEDs (8 via I2C and one on P2.10)

Analog input

USB-to-serial bridge on UART #0 (FT232R) and ISP functionality

Reset push-button and LED

Speaker output on analog output from OEM Board, or from I2S audio codec

Compact size: 160x150 mm

2.2 ESD Precaution

Please note that the LPC3250 OEM Board and OEM Base Board come without

any case/box and all components are exposed for finger touches –and therefore

extra attention must be paid to ESD (electrostatic discharge) precaution.

Make it a habit always to first touch the metal surface of one of the USB or

Ethernet connectors for a few seconds with both hands before touching

any other parts of the boards. That way, you will have the same potential as

the board and therefore minimize the risk for ESD.

Never touch directly on the LPC3250 OEM Board and in general as little as possible on the OEM Base

Board. The push-buttons on the OEM Base Board have grounded shields to minimize the effect of

ESD.

Note that Embedded Artists does not replace boards that have been damaged by ESD.

LPC3250 Developer’s Kit v2 - User’s Guide

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2.3 General Handling Care

Handle the LPC3250 OEM Board and OEM Base Board with care. The boards are not mounted in a

protective case/box and are not designed for rough physical handling. Connectors can wear out after

excessive use. The OEM Base Board is designed for prototyping use, and not for integration into an

end-product.

For boards with LCD, do not exercise excessive pressure on the LCD glass area. That will damage the

display. Also, do not apply pressure on the flex cables connecting the LCD/touch screen. These are

relatively sensitive and can be damaged if too much pressure is applied to them.

Note that Embedded Artists does not replace boards where the LCD has been improperly

handled.

2.4 LPC3250 Core Voltage Precaution

The core voltage for the LPC3250 can be dynamically changed, via I2C commands sent to the

LTC3447 voltage converter. The voltage can be set to up to 2V. Note that this is above the limits of the

core voltage. Read the LPC3250 datasheet for details (the absolute maximum core voltage allowed is

1.39V).

Note that Embedded Artists do not replace LPC3250 OEM boards where the core voltage

(VDD(CORE)) has been raised above 1.39 Volt. It is the user’s responsibility not to exceed the

voltage specification found in the datasheet.

2.5 CE Assessment

The LPC3250 Developers Kit (consisting of the LPC3250 OEM Board and OEM Base Board) is CE

marked. See separate CE Declaration of Conformity document.

The LPC3250 Developers Kit is a class A product. In a domestic environment this product may cause

radio interference in which case the user may be required to take adequate measures.

EMC emission test has been performed on the LPC3250 Developers Kit. Standard interfaces like

Ethernet, USB, serial have been in use. General expansion connectors where internal signals are

made available (for example processor pins) have been left unconnected. Connecting other devices to

the product via the general expansion connectors may alter EMC emission. It is the user’s

responsibility to make sure EMC emission limits are not exceeded when connecting other devices to

the general expansion connectors of the LPC3250 Developers Kit.

Due to the nature of the LPC3250 Developers Kit –an evaluation board not for integration into an end-

product –fast transient immunity tests and conducted radio-frequency immunity tests have not been

executed. Externally connected cables are assumed to be less than 3 meters. The general expansion

connectors where internal signals are made available do not have any other ESD protection than from

the chip themselves. Observe ESD precaution.

Note that the LPC3250 OEM board is classified as a component and is hence not CE marked

separately. It can perform different functions in different integrations and it does not have a direct

function. It is therefore not in the scope of the CE Directive. An end product, where an OEM Board is

integrated into, is however very likely to need CE marking.

2.6 Other Products from Embedded Artists

Embedded Artists have a broad range of LPC and i.MX based boards that are very low cost and

developed for prototyping / development as well as for OEM applications. Modifications for OEM

applications can be done easily, even for modest production volumes. Contact Embedded Artists for

further information about design and production services.

2.6.1 Design and Production Services

Embedded Artists provide design services for custom designs, either completely new or modification to

existing boards. Specific peripherals and I/O can be added easily to different designs, for example,

LPC3250 Developer’s Kit v2 - User’s Guide

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communication interfaces, specific analog or digital I/O, and power supplies. Embedded Artists has a

broad, and long, experience in designing industrial electronics in general and with NXP’s LPC

microcontroller and i.MX application processor families in specific.

2.6.2 OEM / Education / QuickStart Boards and Kits

Visit Embedded Artists’ home page, www.EmbeddedArtists.com, for information about other OEM /

Education / QuickStart boards / kits or contact your local distributor.

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