3
Contents
1Introduction........................................................................................................................6
2Device overview..................................................................................................................7
2.1 Available versions................................................... Chyba! Záložka není definována.
2.2 Technical Description .................................................................................................7
2.3 Device specification....................................................................................................8
3Installation........................................................................................................................11
3.1 Mechanical Installation ............................................................................................11
3.2 Electrical installation ................................................................................................11
3.3 Cabling, grounding....................................................................................................12
3.4 Power Supply Requirements ....................................................................................13
4Modbus Communication Protocol ...................................................................................15
4.1 Modbus Protocol Overview......................................................................................15
4.1.1 Physical Communication Layer.............................................................................15
4.1.2 Transactions on Modbus networks ......................................................................15
4.2 Device Specific Features...........................................................................................16
4.2.1 Service Address.....................................................................................................16
4.2.2 Communication Buffer Length .............................................................................16
4.2.3 Response Time......................................................................................................16
4.3 Holding Registers Map..............................................................................................17
4.3.1 Holding Registers Map Overview .........................................................................17
4.3.2 Factory configuration section...............................................................................19
4.3.3 Service Configuration Section ..............................................................................20
4.3.4 User configuration section ...................................................................................20
4.3.5 Miscellaneous.......................................................................................................20
4.3.6 Measured variables ..............................................................................................20
4.3.7 Datalogger section................................................................................................22
4.3.8 Data types.............................................................................................................23
4.4 Discrete outputs map ...............................................................................................24
4.4.1 Overview of the discrete outputs map.................................................................24
4.4.2 Reset .....................................................................................................................24
4.4.3 Write EEPROM......................................................................................................24
