Ebyte E220-400M30S Manuel utilisateur

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

E220-400M30S

LLCC68 433 / 470MHz 1W SPI SMD Lora Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

Contents

Disclaimer...............................................................................................................................................................................2

Features...........................................................................................................................................................................3

1 Introduction..........................................................................................................................................................................4

1.1 Brief Introduction..................................................................................................................................................... 4

1.2 Application................................................................................................................................................................4

2 Specification and parameter................................................................................................................................................ 4

2.1 limit parameters........................................................................................................................................................ 4

2.2 Operating parameter................................................................................................................................................. 5

3 Size and pin definition......................................................................................................................................................... 6

4 Basic operation.................................................................................................................................................................... 7

4.1 Hardware design....................................................................................................................................................... 7

4.2 Programming............................................................................................................................................................ 8

5 Basic application..................................................................................................................................................................9

5.1 Basic circuit.............................................................................................................................................................. 9

6 FAQ......................................................................................................................................................................................9

6.1 Communication range is too short............................................................................................................................ 9

6.2 Module is easy to damage...................................................................................................................................... 10

6.3 BER(Bit Error Rate) is high................................................................................................................................... 10

7 Production guidance.......................................................................................................................................................... 11

7.1 Reflow soldering temperature................................................................................................................................ 11

7.2 Reflow soldering curve...........................................................................................................................................11

8 E220 series.........................................................................................................................................................................12

9 Antenna recommendation.................................................................................................................................................. 12

9.1 Recommendation.................................................................................................................................................... 12

10. Packing method for batch order......................................................................................................................................13

Revision history.................................................................................................................................................................... 13

About us................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

Disclaimer

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subject to intellectual property rights. Reproduction, use, modification or disclosure to

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The information contained herein is provided “as is” and EBYTE assumes no

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including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

Features

Compared with the SX1276 module, the LLCC68 module has significant advantages of lower power consumption,

faster speed and longer distance;

The measured distance can reach 10km;

Built-in PA+LNA, greatly improving the communication distance and stability;

The maximum transmitting power is 1W, software is multi-level adjustable;

Support global license free ISM 433 / 470MHz band;

In LoRaTM mode, the data transmission rate is 1.76kbps ~ 62.5kbps;

FSK mode supports up to 300kbps data transmission rate;

FIFO has large capacity and supports 256 byte data cache;

Support spread spectrum factor SF5, SF6, SF7, SF8, SF9, SF10, SF11;

Support 3 ~ 5.5V power supply, more than 3.3V power supply can guarantee the best performance;

Industrial standard design, support - 40 ~ 85 ° C long-term use;

Dual RF interface is optional (IPEX / stamp hole), which is convenient for secondary development and integration.

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

1 Introduction

1.1 Brief Introduction

E220-400M30S is 1W module developed independently

based on new generation of LoRaTM RF chip LLCC68 from

Semtech. LLCC68 is suitable for 433MHz and 470MHz SMD

wireless module and uses industrial 32mhz crystal oscillator.

The original imported LLCC68 is used as the core of the

module, a power amplifier (PA) and a low noise amplifier

(LNA) are built on the original basis, so that the maximum

transmission power reaches 1W and the receiving sensitivity is

further improved. In the overall communication Compared

with products without power amplifier and low noise amplifier,

the stability is greatly improved. Compared with the previous

generation of LoRaTM transceivers, the anti-interference

performance and communication distance have been improved, further opening the gap with FSK and GFSK modulation

products. The product can cover an ultra-wide frequency range of 410~493MHz.

Because the module is a pure RF transceiver module, it needs to use MCU driver or special SPI debugging tool.

1.2 Application

Home security alarm and remote keyless entry;

Smart home and industrial sensors, etc;

Wireless alarm security system;

Building automation solutions;

Wireless industrial remote controller;

Health care products;

Advanced meter reading architecture (AMI);

Automotive industry applications.

2 Specification and parameter

2.1 limit parameters

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

Main parameter

Performance

Remarks

Min

Max

Supply voltage (V)

5.5

Over 5.5V permanently burned module

Blocking power (DBM)

The burning probability is small in close range use

Working temperature (℃)

-40

+85

Industrial grade

2.2 Operating parameter

Main parameter

Performance

Remarks

Min

Type

Max

Working voltage (V)

5.5

≥5 V ensures output power

Communication level (V)

3.3

Probably burnout when using 5V TTL

Working temperature (℃)

-40

+85

Industrial Design

Operating frequency band (MHz)

410

433/470

493

Support ISM band

Power

Consumption

TX current（mA）

600

Instantaneous power consumption

RX current（mA）

12.5

Sleep current （μA）

Software shutdown

Max TX power（dBm）

Receiving sensitivity（dBm）

-129

-124dbm,BW_L=125kHz,SF =

7,LORATM;

-129dbm,BW_L=125kHz,SF =

9,LORATM;

-121dbm,BW_L=250kHz,SF =

7,LORATM;

-129dbm,BW_L=250kHz,SF

=10,LORATM;

-117dbm,BW_L=500kHz,SF =

7,LORATM;

-127dbm,BW_L=500kHz,SF

=11,LORATM;

Air data rate

GFSK（bps）

0.6k

300k

User programming control

LoRa（bps）

1.76k

62.5k

User programming control

Main parameter

Description

Remark

Reference distance

10km

In clear and open environment, the antenna gain is 5dBi, the antenna

height is 2.5m, and the air speed is 2.4kbps.

FIFO

256Byte

Maximum length of single transmission

Crystal frequency

32MHz

Modulation mode

LoRa

Lora modulation is recommended

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

3 Size and pin definition

Pin No.

Item

Direction

Description

GND

Ground, connect to power reference ground

GND

Ground, connect to power reference ground

GND

Ground, connect to power reference ground

GND

Ground, connect to power reference ground

GND

Ground, connect to power reference ground

RXEN

Input

RF switch receive control pin, connect external MCU IO, high level

effective

Packaging method

SMD

Interface mode

Stamp hole

The spacing is 2.54mm

Communication interface

SPI

0-10Mbps

Dimension

38.5*24 mm

Including shield

RF interface

Stamp hole / IPEX

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

TXEN

Input

RF switch emission control pin, connected to external MCU IO or dio2,

high level effective

DIO2

Input / output

Configurable universal IO port (see llcc68 manual for details)

VCC

Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter

capacitor externally)

VCC

Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter

capacitor externally)

GND

Ground, connect to power reference ground

GND

Ground, connect to power reference ground

DIO1

Input / output

Configurable universal IO port (see LLCC68 manual for details)

BUSY

Output

For status indication (see LLCC68 manual for details)

NRST

Input

Chip reset trigger input pin, low level effective

MISO

Output

SPI data output pin

MOSI

Input

SPI data input pin

SCK

Input

SPI clock input pin

NSS

Input

The module chip selection pin is used to start a SPI communication

GND

Ground, connect to power reference ground

ANT

RF interface, stamp hole

GND

Ground, connect to power reference ground

For the pin definition, software driver and communication protocol of the module, please refer to the official LLCC68

datasheet of Semtech.

4 Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and

the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply, such as reverse

connection may cause permanent damage to the module;

Please check the power supply to ensure that it is between the recommended supply voltage. If it exceeds the

maximum value, the module will be permanently damaged;

Please check the stability of the power supply. The voltage should not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to keep more than 30% margin,

which is conducive to the long-term stable operation of the whole machine;

The module should be far away from the power supply, transformer, high frequency wiring and other parts with

large electromagnetic interference;

The high-frequency digital wiring, high-frequency analog wiring and power wiring must avoid the lower part of the

module. If it is necessary to pass through the lower part of the module, it is assumed that the module is welded on

the top layer, and the copper is laid on the top layer of the module contact part (all copper is laid and well grounded),

which must be close to the digital part of the module and laid on the bottom layer;

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

Assuming that the module is welded or placed in the top layer, it is also wrong to route at will in the bottom layer or

other layers, which will affect the spurious and receiving sensitivity of the module in different degrees;

Assuming that there are large electromagnetic interference devices around the module will greatly affect the

performance of the module, it is recommended to keep away from the module according to the intensity of

interference, and appropriate isolation and shielding can be done if the situation permits;

Assuming that there are lines (high-frequency digital, high-frequency analog and power lines) with large

electromagnetic interference around the module, the performance of the module will be greatly affected. According

to the intensity of interference, it is recommended to keep away from the module. If the situation permits,

appropriate isolation and shielding can be done;

If 5V level is used for communication line, 1k-5.1k resistor must be connected in series (not recommended, there is

still risk of damage);

The antenna installation structure has a great influence on the module performance, so it is necessary to ensure that

the antenna is exposed, preferably vertically upward. When the module is installed inside the housing, the

high-quality antenna extension line can be used to extend the antenna to the outside of the housing;

The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance.

4.2 Programming

This module is LLCC68+PA+LNA, and its driving method is completely equivalent to LLCC68, and users can

operate in accordance with the LLCC68 chipset datasheet;

DIO1, DIO2 and DIO3 are common IO ports, which can be configured into multiple functions. DIO2 can be

connected to TXEN, not to IO port of MCU, and is used to control RF switch emission. See LLCC68 manual for

details, and can be suspended if not used;

The internal use of 32mhz passive crystal oscillator, without pin control, software program control can be;

The differences between LLCC68 and SX1262 / SX1268 were as follows

1. SX1262 / SX1268 supports spread spectrum factors SF5, SF6, SF7, SF8, SF9, SF10, SF11 and SF12;

LLCC68 supports spread spectrum factors SF5, SF6, SF7, SF8, SF9, SF10 and SF11.

2. LLCC68 can set the spread spectrum factor and receive bandwidth:

LoRa® Rx/Tx, BW = 125 – 250 – 500 kHz

LoRa®，SF = 5 - 6 - 7 - 8 - 9 for BW = 125 kHz ，

LoRa®，SF = 5 - 6 - 7 - 8 - 9 - 10 for BW = 250 kHz ，

LoRa®，SF = 5 - 6 - 7 - 8 - 9 - 10 - 11 for BW = 500 kHz；

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-400M30S User Manual

5 Basic application

5.1 Basic circuit

6 FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance);

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power;

Due to antenna quality or poor matching between antenna and module.

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