Ebyte E22-900M30S Manuel utilisateur

E22-900M30S User Manual

SX1262 868/915MHz 1W SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

1. Overview

1.1 Introduction

The E22-900M30S is based on the SX1262, a new generation of

LoRaTM RF chip manufactured by Semtech, USA. It is an ultra-small

and self-developed 868MHz、915MHz SMD LoRaTM wireless module.

Because it adopted the original SX1262 as main core, the PA and

LNA is built-in also based on the previous one, which makes the

maximum transmission power to 1W, at the same time, the receive

sensitivity is also further improved. The overall communication stability

is greatly improved compared to the products without power amplifiers and low noise amplifiers. The anti-interference

performance and communication distance have been further improved compared to the previous generation LoRaTM

transceiver, and far superior to the current FSK and GFSK modulation products. This products obtained FCC, CE and

RoHS certification already so users do not need to worry about the performance. Adopted industrial grade high precision

32MHz crystal, the product can cover an ultra-wide frequency range of 850~930MHz and is backward compatible with

SX1278 and SX1276.

Since the module is a RF transceiver module only, users need to use the MCU driver or use a dedicated SPI debug tool.

1.2 Features

l Communication distance tested is up to 12km；

l Maximum transmission power of 1W, software multi-level adjustable；

l Support the global license-free ISM 868/915MHz band；

l Support air date rate of 0.018-62.5kbps in the LoRaTM mode；

l Support 300kpbs in the FSK mode;

l Compatible with the transceiver of SX1278/SX1276;

l With large capacity, FIFO supports 256Byte data cache.;

l New SF5 spreading factor to support dense networks;

l Support 2.5V~5.5V power supply, more than 5.0V power supply can guarantee the best performance;

l Industrial grade standard design, support -40 ~ 85 °C for working over a long time；

l IPEX and stamp hole are optional, which is convenient for secondary development and integration.

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

1.3 Application

l Home security alarm and remote keyless entry；

l Smart home and industrial sensors；

l Wireless alarm security system；

l Building automation solutions；

l Wireless industrial-grade remote control；

l Health care products；

l Advanced Meter Reading Architecture(AMI)；

l Automotive industry applications.

2. Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min.

Max.

Power supply（V）

5.5

Voltage over 5.5V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）

-40

2.2 Operating parameter

Main parameter

Performance

Remark

Min.

Typ.

Max.

Operating voltage（V）

2.5

5.0

5.5

≥5.0V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning

down

Operating temperature（℃）

-40

Industrial design

Operating frequency（GHz）

850

868/915

930

Support ISM band

Power

consumptio

TX current（mA）

650

Instant power consumption

RX current（mA）

Sleep current（μA）

Software is shut down

Max Tx power（dBm）

29.5

30.0

Receiving sensitivity（dBm）

-149

-150

-151

Air data rate is 0.3kbps

Air data rate（bps）

0.6k

300k

Controlled via user’s programming

0.018k

62.5k

Controlled via user’s programming

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

Main parameter

Description

Remark

Distance for reference

12000m

Test condition：clear and open area, antenna gain: 5dBi，antenna

height: 2.5m，air data rate: 0.3kbps

FIFO

256Byte

Maximum length of single transmission

Crystal frequency

32MHz

Modulation

LoRa(recommended)

Package

SMD

Connector

2.54mm

Stamp hole

Communication interface

SPI

0-10Mbps

Size

38.5* 24*3.6 mm

Antenna

IPEX/IPEX

50 ohm impedance

3. Size and pin definition

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

No.

Name

Direction

Function

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

RXEN

Input

RF switch receiving control pin, connected to external microcontroller IO,

valid in high level

TXEN

Input

RF switch transmitting control pin, connected to external microcontroller IO

or DIO2, valid in high level

DIO2

Input/Output

Configurable universal IO port (see SX1262 manual for details)

VCC

Power supply, 2.5~5.5V(It is recommended to add external ceramic filter

capacitor)

VCC

Power supply, 2.5~5.5V(It is recommended to add external ceramic filter

capacitor)

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

DIO1

Input/Output

Configurable universal IO port (see SX1262 manual for details)

BUSY

Output

For status indication (see SX1262 manual for details)

NRST

Input

Chip reset trigger input pin, valid in low level

MISO

Output

SPI data output pin

MOSI

Input

SPI data output pin

SCK

Input

SPI data output pin

NSS

Input

Module chip select pin for starting an SPI communication

GND

Ground wire, connected to the power reference ground

ANT

Antenna interface, stamp hole (50 ohm characteristic impedance)

GND

Ground wire, connected to the power reference ground

4. Basic Operation

4.1 Hardware Design

l It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple

coefficient is as small as possible, and the module needs to be reliably grounded.

l Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse

connection is connected, the module may be permanently damaged.

l Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,

the module will be permanently damaged.

l Please check the stability of the power supply, the voltage can not be significantly frequent.

l When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, and the whole machine is beneficial for long-term stable operation.

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

l The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference.

l High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If

it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is

spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to the

digital part of the module and routed in the Bottom Layer.

l Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or

other layers, which will affect the module's spurs and receiving sensitivity to varying degrees.

l Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-

frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding

can be done;

l If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage).

l Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0

l The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that

the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna

extension cable to extend the antenna to the outside of the case.

l The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.

l It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.

4.2 Software Programming

l This module is SX1268/SX1262+PA+LNA. Its driving mode is exactly the same as SX1268/SX1262. Users can

operate according to SX1268/SX1262 chip datasheet.

l DIO1 and DIO2 are general-purpose IO ports, which can be configured into multiple functions. DIO2 can be

connected to TXEN and not connected to the MCU's IO port. It can be used to control the RF switch transmission. If

not used, you can hang it. For details, see the SX1262 manual.

l DIO 3 is used to supply 32 MHz TCXO crystal oscillator.

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

5. Basic application

5.1 Basic circuit

6. FAQ

6.1 Communication range is too short

l The communication distance will be affected when obstacle exists.

l Data lose rate will be affected by temperature, humidity and co-channel interference.

l The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.

l Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

l The signal will be affected when the antenna is near metal object or put in a metal case.

l Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).

l When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is,

the lower the transmitting power is.

l Due to antenna quality or poor matching between antenna and module.

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

6.2 Module is easy to damage

l Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead

to a permanent damage to the module.

l Please check the stability of power supply and ensure the voltage not to fluctuate too much.

l Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic

susceptibility.

l Please ensure the humidity is within limited range for some parts are sensitive to humidity.

l Please avoid using modules under too high or too low temperature.

6.3 High bit error rate

l There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel

to avoid interference.

l The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line

should not be too long.

l Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.

l If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.

7. Welding operation guidance

7.1 Reflow Soldering Temperature

Profile Feature

Curve feature

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

Minimum preheating

temperature

100℃

150℃

Preheat temperature max (Tsmax)

Maximum preheating

temperature

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average rising rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temperature

183℃

217℃

Time（tL）Maintained Above（TL）

Time above liquidus

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temperature

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

Average descent rate

6℃/second max

Time 25℃ to peak temperature

Time of 25 ° C to peak

temperature

6 minutes max

8 minutes max

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

7.2 Reflow Soldering Curve

8. Related Model

Model

Chip

Frequency

Transmit

power dBm

Test distance

Packaging

Size

Communication

Interface

E22-900T22S

SX1262

868M 915M

SMD

16*26

UART

E22-230T22S

SX1262

230M

SMD

16*26

UART

E22-400T22S

SX1268

433M 470M

SMD

16*26

UART

E22-400M30S

SX1268

433M 470M

SMD

24*38.5

SPI

E22-900M30S

SX1262

868M 915M

SMD

24*38.5

SPI

E22-900M22S

SX1262

868M 915M

6.5

SMD

14*20

SPI

E22-400M22S

SX1268

433M 470M

6.5

SMD

14*20

SPI

Chengdu Ebyte Electronic Technology Co., Ltd. E22-900M30S User manual

9. Antenna Type

9.1 Antenna recommendation

The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the

communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent

performance and reasonable price.

Product

Type

Frequency

Interface

Gain

dBi

Size

Feeder

Features

TX433-NP-4310

Soft PCB

antenna

433M

SMA-J

43.8*9.5mm

Built-in flexible FPC soft

antenna

TX433-JW-5

Soft PCB

antenna

433M

SMA-J

50mm

Flexible, Omnidirectional

TX433-JWG-7

Soft PCB

antenna

433M

SMA-J

2.5

75mm

Flexible, Omnidirectional

TX433-JK-20

Soft PCB

antenna

433M

SMA-J

210mm

Flexible, Omnidirectional

TX433-JK-11

Soft PCB

antenna

433M

SMA-J

2.5

110mm

Flexible, Omnidirectional

TX433-XP-200

Sucker

antenna

433M

SMA-J

19cm

200cm

High Gain

TX433-XP-100

Sucker

antenna

433M

SMA-J

3.5

18.5cm

100cm

High Gain

TX433-XPH-300

Sucker

antenna

433M

SMA-J

96.5cm

300cm

High Gain

TX433-JZG-6

Soft PCB

antenna

433M

SMA-J

2.5

52mm

Ultra short straight，

Omnidirectional

TX433-JZ-5

Soft PCB

antenna

433M

SMA-J

52mm

Ultra short straight，

Omnidirectional

TX490-XP-100

Sucker

antenna

490M

SMA-J

12cm

100cm

High Gain

TX490-JZ-5

Soft PCB

antenna

490M

SMA-J

50mm

High Gain

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