Data Modul EDM-COMB-CR6 Manuel utilisateur

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USER MANUAL

eDM-COMB-CR6

12044128 Rev. 00

DATA MODUL AG | www.data-modul.com

Revision History

Revision

Revision History

Date

First release

10.10.2019

Reference to this Document

The purpose of all the figures and illustrations in this document is merely to provide a better explanation and can differ to the

actual appearance of the board. They are to be understood as schematic representations.

Trademarks:

Microsoft and Windows are registered trademarks of Microsoft Corporation.

HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.

Other trademarks are the property of their respective owners.

Technical and optical changes as well as misprints reserved.

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Contents

Preface .....................................................................................................................................................................................3

Using this Docum ent.............................................................................................................................................................3

Purpose ofthis Docum ent......................................................................................................................................................3

DangerSym bols & Levels ......................................................................................................................................................3

DangerSym bols.................................................................................................................................................................3

DangerLevels....................................................................................................................................................................3

GeneralSym bols................................................................................................................................................................3

TechnicalSupport.................................................................................................................................................................4

ListofAbbreviations..............................................................................................................................................................4

TechnicalData ..........................................................................................................................................................................5

Supported O perating System s ...............................................................................................................................................5

EFI/ BIO S..............................................................................................................................................................................5

API........................................................................................................................................................................................5

Tools.....................................................................................................................................................................................5

Standards & Certifications.....................................................................................................................................................5

Environm entalism ..............................................................................................................................................................5

EM C Standards..................................................................................................................................................................5

ElectricalSafety.................................................................................................................................................................5

Shock & Vibration..............................................................................................................................................................5

Block Diagram .......................................................................................................................................................................6

O rdering Inform ation .............................................................................................................................................................7

Hardw are Features.................................................................................................................................................................7

Platform ............................................................................................................................................................................7

CPU ...................................................................................................................................................................................7

M em ory.............................................................................................................................................................................7

Chipset..............................................................................................................................................................................7

Graphic & M edia................................................................................................................................................................7

IO ......................................................................................................................................................................................8

LAN ...................................................................................................................................................................................8

AdditionalInterfaces & Functions...........................................................................................................................................8

LVDS .................................................................................................................................................................................8

CRF M odule W iFi/BT/W iGig ................................................................................................................................................8

TPM ...................................................................................................................................................................................8

Hardw are M onitor..............................................................................................................................................................8

Em bedded Controller.........................................................................................................................................................9

Data M odulBoard Controller..............................................................................................................................................9

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O nM odule M em ory ..........................................................................................................................................................10

Environm entalConditions................................................................................................................................................10

Pow erSupply ......................................................................................................................................................................10

InputVoltage Requirem ents.............................................................................................................................................10

Pow erFeatures ................................................................................................................................................................10

Interfaces / Connectors .......................................................................................................................................................10

CO M Express connector,type 6 pin-out.............................................................................................................................10

O nboard Fan....................................................................................................................................................................10

CPLD JTAG & debug connector..........................................................................................................................................11

BIO S Setup .............................................................................................................................................................................12

Term s & Abbreviations.........................................................................................................................................................12

BIO S Update D escription .....................................................................................................................................................13

BIO S Setup Description .......................................................................................................................................................13

M ain................................................................................................................................................................................14

Advanced ........................................................................................................................................................................14

CPU Configuration............................................................................................................................................................14

Pow er& Perform ance.......................................................................................................................................................15

Trusted Com puting ..........................................................................................................................................................16

SerialPortConsole Redirection ........................................................................................................................................16

Connectivity Configuration ...............................................................................................................................................18

Therm alConfiguration......................................................................................................................................................19

SIO Configuration ............................................................................................................................................................19

USB Configuration ...........................................................................................................................................................21

Netw ork Stack Configuration ............................................................................................................................................21

CSM Configuration ...........................................................................................................................................................22

M odule Peripherals Configuration ....................................................................................................................................22

M odule HW M onitor.........................................................................................................................................................25

M odule W atchdog Configuration ......................................................................................................................................25

M odule Display Configuration ..........................................................................................................................................27

Chipset............................................................................................................................................................................28

Security...........................................................................................................................................................................32

Boot................................................................................................................................................................................34

Save & Exit......................................................................................................................................................................36

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Preface

Using this Document

In this Docum ent,the eDM -CO M B-CR6 is also referred to as „board“.

Please read this D ocum entbefore using this board.

This Docum entcontains inform ation aboutthe hardw are,softw are and configuration ofthe board.

Aw areness of the safety instructions and instructions for use in this Docum entw illensure the safe and correctuse ofthe

board.

In addition to the inform ation given here,you should com ply w ith the localregulations forthe prevention ofaccidents and

generally applicable safety regulations.

Purpose of this Document

The purpose of this docum ent is the definition of the technical param eters, the electrical connections and the m echanical

dim ensions ofthe eD M -CO M B-CR6.

Danger Symbols & Levels

In this Docum ent, sym bols are used to highlight im portant safety instructions and any advice relating to the board. The

instructions should be follow ed very carefully to avoid any risk ofaccident,personalinjury orproperty dam age.

Danger Symbols

Dangerous Voltage,dangerofelectric shock

Hazard point

All DATA M O DU L AG products are electrostatic sensitive

devices and are packaged accordingly. Do not open or

handle a DATA M O D U L AG product except at an

electrostatic-free w orkstation.Additionally,do notship or

store DATA M O DUL AG products nearstrong electrostatic,

electrom agnetic,m agnetic,orradioactive fields unless the

device is contained w ithin its original m anufacturer's

packaging. Be aw are that failure to com ply w ith these

guidelines w illvoid the DATA M O DUL AG Lim ited W arranty.

Danger Levels

DAN GER Indicates a hazardous situation,w hich w illresultin death

orserious injury.

W ARN IN G Indicates a hazardous situation, w hich could result in

death orserious injury.

CAUTIO N Indicates a hazardous situation,w hich m ay resultin m inor

orm oderate injury.

N O TICE Indicates a property dam age.

General Symbols

Additionalsupportorusefulinform ation.

The crossed-out refuse bin indicates that the products

have to be properly recycled ordisposed ofin accordance

w ith nationallegislation in the respective EU countries.

If you w ish to dispose of used electrical and electronic

products outside the European Union,please contactyour

localauthority so as to com ply w ith the localregulations.

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Technical Support

DATA M O DUL's technicians and engineers are com m itted to provide the best possible technicalsupport for our custom ers to

enable an easy use and im plem entation ofourproducts.W e recom m end to visitourw ebsite atw w w .data-m odul.com firstforthe

latestdocum entation,utilities and drivers,w hich have been m ade available to assistyou.Ifyou need further assistance after

visiting ourw ebsite please contactourtechnicalsupportdepartm entby em ailatsupport@ data-m odul.com .

List of Abbreviations

Abbreviation D escription

CO M Com puterO n M odule

DDC Display Data Channel

EM I

Electro M agnetic Interference

European Norm

FFC FlatFoilCable

HDM I High Definition M ultim edia Interface

I2C Inter-Integrated CircuitBus

LCD Liquid CrystalD isplay

LVDS

Low Voltage DifferentialSignal

NotAvailable

NC N otConnected

PCB Printed CircuitBoard

PVM Pulse W idth M odulation

SB Standby

SSP Synchronous SerialProtocol

TBD To Be Defined

TCO N Tim ing Controller

TM D S

TTL

Transition M inim ized D ifferentialSignaling

TransistorTransistorLogic

UL Underw riterLab

USB U niversalSerialBus

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Technical Data

Supported Operating Systems

M icrosoft® W indow s® 10 (64 bit)

Linux

EFI / BIOS

UEFIbased Firm w are using AM IAptio V core

Darkboot/ Bootlogo support

Legacy Free O peration

Bootfrom externalSPIas defined by CO M Express specification

M em ory-initialization according to SPD ,X.M .P.profiles supported

LID and Sleep signals supported

ACPIW ake Events (W O L S3-S5,USB S3-S4,LID S3,Pw rBtn S3-S5)

AC Pow erLoss configurable by setup

Spread Spectrum configurable by setup,defaultO N

ACPI6.1

DATA M O D U L fam ily feature:Em bedded Controllerspecification

API

eAPIas defined by CO M Express

Data M odulspecific extension to eAPI

Tools

BIO S update tool

FPGA update tool

APItesttool

Standards & Certifications

Environmentalism

2011/65/EU (of8.June 2011 directive ofthe European parliam entand ofthe councilon the restriction ofthe use ofcertain

hazardous substances in electricaland electronic equipm ent(RoHS))

2006/1907/EU (of 18. Decem ber 2006 of the European parliam ent and of the council concerning the Registration,

Evaluation,Authorisation and Restriction ofChem icals (REACH))

2012/19/EC (of 04. July 2012 directive of the European parliam ent and of the council on w aste electricaland electronic

equipm ent(W EEE))

The board is designed and m anufactured to m eetISO 14001.

The packing com plies w ith directive 1994/62/EU.

EMC Standards

EM I/EM C:according to EN55022

Electrical Safety

Designed to m eetEN60950 and UL60950.

Shock & Vibration

Shock and Vibration according to IEC/EN60068-2-6 and IEC/EN 60068-2-27.

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Block Diagram

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Ordering Information

M odelN am e PartN o. Description

eDM -CO M B-CR6-E-2276M E 12040447 CO M Express Type 6 Basic w ith Intel® Xeon® ,CM 246 chipset,ECC

eDM -CO M B-CR6-i7-9850HE 12040448 CO M Express Type 6 Basic w ith Intel® Core® i7,Q M 370chipset

eDM -CO M B-CR6-i3-9100HL 12040449 CO M Express Type 6 Basic w ith Intel® Core® i5,Q M 370chipset

eDM -CO M B-CF6-CF 12029280 Active cooling solution,w ith fan

eDM -CO M B-CF6-CP 12029281 Passive cooling solution,w ithoutfan

eDM -CO M B-CF6-CH 12029282 Heatspreader,3 m m plate w ith 8 m m standoffs,flatsurface

Hardware Features

Platform

The 9th Generation Intel® Core™processor fam ily are a 64-bit, m ulti-core processor (up to 6 cores) built on 14-nanom eter

process technology (Coffee Lake Refresh-H ).

CPU

The eDM -CO M B-CR6 supports allavailable Coffee Lake Refresh CPUs in FCBG A1440 package,14nm ,up to 45W TDP.

Package:42 m m x 28 m m x 1.395 m m ,FCBG A1440 c-states

Supported Features:

C-States:CO -C10

Intel® Virtualization Technology (Intel® VT)

Intel® Stream ing SIM D Extensions 4.2 (Intel® SSE4.2)

Intel® Hyper-Threading Technology (Intel® H T Technology)

Intel® 64 Architecture

Execute Disable Bit

Intel® Turbo BoostTechnology 2.0

Intel® Advanced VectorExtensions 2 (Intel® AVX2)

PCLM U LQ DQ (Perform Carry-Less M ultiplication Q uad w ord)Instruction

Intel® TransactionalSynchronization Extensions (Intel® TSX-N I)

PAIR –Pow erAw are InterruptRouting

GM M Scoring Accelerator

Intel® ProcessorTrace

High D efinition Contend Protection (HDCP)2.2

Security Features:

Intel® Active M anagem entTechnology 12.0 (Intel® AM T 12.0)

Intel® Trusted Encryption Technology (Intel® TXT)

Intel® Advanced Encryption Standard N ew Instructions (Intel® AES-N I)

Intel® Security Key

SM EP –SupervisorM ode Execution Protection

Intel® BootGuard

Intel® Softw are Guard Extensions (Intel® SGX)

Intel® M em ory Protection Extensions (Intel® M PX)

Memory

Tw o SO -D IM M sockets

M em ory type:DDR4,ECC/N on-ECC (Variants w ith Intel® CM 246 chipsetsupportECC m em ory)

Speed:up to 2666 M T/s

Size:up to 32 GB (2 x 16 G B)

Chipset

M obile Intel® 300 Series ChipsetQ M 370,H M 370 and CM 246 PCH

Graphic & Media

GFX type: Intel® Gen 9.5 Graphics Processing U nit(GT2)

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DirectX 12,Direct3D 2015,O penGL 4.5,O penCL 2.1 APIs

Display Pipes (3 independent)

3 x DDIs (DigitalDisplay Interfaces):

DisplayPort1.2 w ith supportforM ulti-Stream Transport

HDM I1.4 (requires externallevelshifter)

DVIport(requires externallevelshifter)

HDM I2.0a (w ith converter)

eDP 1.4,Resolutions up to 4K (UHD@ 60Hz)

Video Decode:H.265/H EVC @ level5.1 (4k),H .264/AVC @ Level5.1(4k),VC-1,W M V9,JPEG,VP8/VP9,M PEG2

Video Encode:H .265/HEVC @ level5.1 (4k),H.264/AVC @ Level5.1(4k),W M V9,JPEG,VP8/VP9,M PEG 2

4 x USB 3.0

8 x USB 2.0,1 x U SB O TG support

4 x SATA 3.0 (6Gb/s)w ith RAID support0/1/5/10

8 x PCIExpress® G en.3 lanes (x1/x2/x4 operation)

PEG G en 3 port(1 x16 link (default),2 x8 links or1 x8 + 2 x4 links)

SPIforonboard/externalBIO S flash

LPC bus / eSPI forEm bedded Controller/ TPM / externalSIO (m ultiplexed)

GPIO s,1M Hz SM B 2.0

IntelHD Audio

2 x UART

IEEE1588 support (Standard for a Precision Clock Synchronization Protocol for Netw orked M easurem ent and Control

System s)

LAN

Intel® GbE supportvia the onboard Intel® i219-LM GbE LAN controller(w ith AM T 11 support).

Additional Interfaces & Functions

LVDS

The eDM -CO M B-CR6 supports D ual channel LVDS 1/2x18/24bit up to 1920x1200 from an eD P2LVD S converter like NXP

PTN3460.O ptionally itbe possible to bypass LVDS converterto redirectthe eDP signals to the CO M Express connectorpins by 0R

resistors placed stubless on the PCB.

CRF Module WiFi/BT/WiGig

O ptionally the eDM -CO M B-CR6 supports a soldered CRF M odule (through CN Vi),support for IntelW ireless-AC (Gigabitw ireless

speed),e.g.:IntelW ireless-AC 9560.

TPM

O ptionally the eDM -CO M B-CR6 supports Trusted Platform M odule (Version 1.2 and 2.0).

Hardware Monitor

Hardw are M onitoring supports on the eDM -CO M B-CR6 design using the Nuvoton N CT7802Y.

Hardw are M onitorproviding follow ing inform ation:

CPU DIE tem perature m easured through PECIinterface

PCB tem perature m easured inside H W M onitor(place H W M atcoolspotofPCB)

LevelofVCC m odule inputvoltage

Levelof5V_SBY inputvoltage

LevelofVCCRTC voltage follow erO pAm p circuit.

The H ardw are M onitorprovides controlsignals to operate one a connected atthe CO M Express baseboard fan connectorand on

board connector.

Data Modul eDM-COMB-CR6 Manuel utilisateur

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