Acromag APCe7012E-LF Manuel utilisateur

APCe7012E-LF PCI Express AcroPack Carrier Board

USER’S MANUAL

ACROMAG INCORPORATED

30765 South Wixom Road

Wixom, MI 48393-2417 U.S.A.

Tel: (248) 295-0310

Email: solutions@acromag.com

Data and specifications are subject to change without notice.

8501138B

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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Table of Contents

1. GENERAL INFORMATION......................................................................................................................... 4

Intended Audience .................................................................................................................................. 4

Preface..................................................................................................................................................... 4

Trademark, Trade Name and Copyright Information.............................................................................. 4

Radio Frequency Interference Statement............................................................................................... 4

Environmental Protection Statement ..................................................................................................... 4

APCe7012E-LF Overview.......................................................................................................................... 4

KEY APCe7012E-LF FEATURES ................................................................................................................. 4

SIGNAL INTERFACE PRODUCTS................................................................................................................ 5

Cable................................................................................................................................................... 5

Termination Panel .............................................................................................................................. 5

Software Support..................................................................................................................................... 5

Windows......................................................................................................................................... 5

VxWorks.......................................................................................................................................... 5

Linux................................................................................................................................................ 6

2. PREPARATION FOR USE ........................................................................................................................... 7

UNPACKING AND INSPECTION ................................................................................................................ 7

BOARD CONFIGURATION ........................................................................................................................ 8

Power and Cooling Considerations .................................................................................................... 8

Carrier Fuses....................................................................................................................................... 9

Isolation Considerations..................................................................................................................... 9

Isolated Power.................................................................................................................................... 9

CARRIER ADDRESS ASSIGNMENT ............................................................................................................ 9

ACROPACK MODULE INSTALLATION ..................................................................................................... 10

FIELD GROUNDING CONSIDERATIONS .................................................................................................. 11

CONNECTORS ........................................................................................................................................ 11

Front Panel Field I/O Connectors ..................................................................................................... 11

AcroPack Field I/O Connector .......................................................................................................... 11

Mini-PCIe Connector ........................................................................................................................ 14

PCI Express Bus Connections............................................................................................................ 15

JTAG Programming/Debug Connector ............................................................................................. 16

3. PROGRAMMING INFORMATION ........................................................................................................... 17

4. THEORY OF OPERATION ........................................................................................................................ 17

DC/DC Converter.............................................................................................................................. 18

Slot Addressing................................................................................................................................. 18

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JTAG.................................................................................................................................................. 18

Power Supply Fuses.......................................................................................................................... 18

5. SERVICE AND REPAIR ............................................................................................................................. 19

PRELIMINARY SERVICE PROCEDURE...................................................................................................... 19

WHERE TO GET HELP ............................................................................................................................. 19

6. SPECIFICATIONS..................................................................................................................................... 20

PHYSICAL................................................................................................................................................ 20

Physical Configuration...................................................................................................................... 20

Connectors ....................................................................................................................................... 20

Isolation............................................................................................................................................ 20

Isolated Power.................................................................................................................................. 20

Power ............................................................................................................................................... 20

Fuses................................................................................................................................................. 21

PCIe BUS COMPLIANCE.......................................................................................................................... 21

ENVIRONMENTAL .................................................................................................................................. 21

EMC Compliance .............................................................................................................................. 21

Vibration and Shock Standard.......................................................................................................... 22

APCe7012E-LF Reliability Prediction ................................................................................................ 22

7. CERTIFICATE OF VOLATILITY .................................................................................................................. 23

8. REVISION HISTORY................................................................................................................................. 23

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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1. GENERAL INFORMATION

Intended Audience

This users’ manual was written for technically qualified personnel who will be

working with I/O devices using the AcroPack module.

Preface

The information contained in this manual is subject to change without notice,

and Acromag, Inc. (Acromag) does not guarantee its accuracy. Acromag

makes no warranty of any kind with regard to this material, including, but not

limited to, the implied warranties of merchantability and fitness for a

particular purpose. Further, Acromag assumes no responsibility for any errors

that may appear in this manual and makes no commitment to update, or keep

current, the information contained in this manual. No part of this manual may

be copied or reproduced in any form, without the prior written consent of

Acromag.

Trademark, Trade Name and Copyright Information

Acromag Incorporated. All other trademarks, registered trademarks, trade

names, and service marks are the property of their respective owners.

Radio Frequency Interference Statement

This is a Class A product. In a domestic environment this product may cause

radio interference, in which case the user may find it necessary to take

adequate corrective measures.

Environmental Protection Statement

This product has been manufactured to satisfy environmental protection

requirements where possible. Many components used (structural parts,

circuit boards, connectors, etc.) are capable of being recycled. Final

disposition of this product after its service life must be conducted in

accordance with applicable country, state, or local laws or regulations.

APCe7012E-LF Overview

The APCe7012E-LF is a low-profile Peripheral Component Interconnect

Express (PCIe) card and is a carrier for a mini-PCIe or AcroPack mezzanine

module. This carrier board provides a modular approach to system assembly,

since each carrier can be populated with a choice of analog input/output,

digital input/output, communication, etc. AcroPack modules.

Model

Board Size

AcroPack

Slots

Operating Temperature

Range

APCe7012E-LF

2.711 x 6.299 inches

-40 to +85°C

(with 200 LFM airflow)

KEY APCe7012E-LF FEATURES

Interface for AcroPack modules – The APCe7012E-LF provides an electrical

and mechanical interface for a mini-PCIe or AcroPack module. AcroPack

modules are available from Acromag. Mini-PCIe cards are available from other

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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vendors in a wide variety of input/output configurations to meet the needs of

varied applications.

Board Identification – A unique carrier number can be set by a DIP switch.

This feature provides the capability to distinguish a particular AcroPack

module from others when multiple instances of the same module are used in

a system.

JTAG Programming Header –A standard 14-pin Xilinx JTAG programming

header is provided for programming and debugging the FPGA on some

AcroPack modules.

Individually Fused Power - Fused +1.5V, +3.3V, +5V, +12V, and -12V DC

power is provided. A fuse is present on each supply line serving each AcroPack

module. Fuses F1 - F3 (+12V, +5V, -12V) are user replaceable. Fuses F4 and F6

(+3.3V, +1.5V) are not user replaceable, you must return the board to

Acromag to replace these fuses.

SIGNAL INTERFACE PRODUCTS

This AcroPack carrier board will mate directly to all industry standard mini-

PCIe and AcroPack modules. Acromag provides the following interface

products (all connections to field signals are made through the carrier board

which passes them to the individual AcroPack modules).

Cable

Model 5028-420 Round cable, shielded, SCSI-2 to CHAMP 0.8mm, 2 meters

long.

Termination Panel

Model 5025-288 DIN-rail mountable panel provides 68 screw terminals for

universal field I/O termination, SCSI-3 connector.

Software Support

The AcroPack series products require support drivers specific to your

operating system. Supported operating systems include: Linux, Windows,

and VxWorks

Windows

Acromag provides software products (sold separately) to facilitate the

development of Windowsapplications interfacing with AcroPack modules.

This software (model APSW-API-WIN) consists of low-level drivers and

Dynamic Link Libraries (DLLs) that are compatible with a number of

programming environments. The DLL functions provide a high-level interface

to boards eliminating the need to perform low-level reads/writes of registers,

and the writing of interrupt handlers.

VxWorks

Acromag provides a software product (sold separately) consisting of

VxWorkssoftware. This software (Model APSW-API-VXW) is composed of

VxWorks(real time operating system) libraries for all AcroPack modules,

VPX I/O board products, and PCIe I/O Cards. The software is implemented as a

library of “C” functions which link with existing user code to make possible

simple control of all Acromag AcroPack modules.

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Linux

Acromag provides a software product consisting of Linuxsoftware. This

software (Model APSW-API-LNX) is composed of Linuxlibraries for all

AcroPack modules, VPX I/O board products, and PCIe I/O Cards. The software

is implemented as a library of “C” functions which link with existing user code

to make possible simple control of all Acromag AcroPack modules.

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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2. PREPARATION FOR USE

IMPORTANT PERSONAL AND PRODUCT SAFETY CONSIDERATIONS

It is very important for the user to consider the possible safety implications of

power, wiring, component, sensor, or software failures in designing any type

of control or monitoring system. This is especially important where personal

injury or the loss of economic property or human life is possible. It is

important that the user employ satisfactory overall system design. It is

understood and agreed by the Buyer and Acromag that this is the Buyer's

responsibility.

WARNING: This board utilizes static sensitive components and should only

be handled at a static-safe workstation. This product is an electrostatic

sensitive device and is packaged accordingly. Do not open or handle this

product except at an electrostatic-free workstation. Additionally, do not ship

or store this product near strong electrostatic, electromagnetic, magnetic, or

radioactive fields unless the device is contained within its original

manufacturer’s packaging. Be aware that failure to comply with these

guidelines will void the Acromag Limited Warranty.

UNPACKING AND INSPECTION

Upon receipt of this product, inspect the shipping carton for evidence of

mishandling during transit. If the shipping carton is badly damaged or water

stained, request that the carrier's agent be present when the carton is

opened. If the carrier's agent is absent when the carton is opened, and the

contents of the carton are damaged, keep the carton and packing material for

the agent's inspection.

For repairs to a product damaged in shipment, refer to the Acromag Service

Policy to obtain return instructions. It is suggested that salvageable shipping

cartons and packing material be saved for future use in the event the product

must be shipped.

This board is physically protected with packing material and electrically

protected with an anti-static bag during shipment. It is recommended that the

board be visually inspected for evidence of mishandling prior to applying

power.

The board utilizes static sensitive components and should only be handled at

a static-safe workstation.

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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BOARD CONFIGURATION

Power should be removed from the board when changing configurations,

changing/removing fuses, or when installing AcroPack modules, cables and

field wiring.

Figure 1 Connector, Switch, and Fuse Locations

Power and Cooling Considerations

Refer to the specifications for loading and power requirements. Be sure that

the system power supplies are able to accommodate the power requirements

of the carrier board, plus the installed AcroPack modules within the voltage

tolerances specified.

IMPORTANT: Adequate air circulation must be provided to prevent a temperature rise above the maximum

operating temperature.

The lack of air circulation within the computer chassis could be a cause for

some concern. Most, if not all computer chassis do not provide a fan for

cooling of add-in boards. The dense packing of the AcroPack modules to the

carrier board alone results in elevated module and carrier board

temperatures, and the restricted air flow within the chassis aggravates this

problem. Adequate air circulation must be provided to prevent a temperature

rise above the maximum operating temperature and to prolong the life of the

electronics. If the installation is in an industrial environment and the board is

exposed to environmental air, careful consideration should be given to air-

filtering.

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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Carrier Fuses

CAUTION: Acromag has used pins labeled as reserved in the Mini-PCIe specification for additional power

connections. If you are installing a Mini-PCIe card from another manufacturer remove fuses F1, F2 and F3.

Other fuse present on the board include +1.5V fuse F6. Also present on the

board is +3.3V fuse F4. These fuses are not user replaceable. Return the

carrier board to Acromag to replace these fuses. Both Mini-PCIe cards from

other manufacturers and the AcroPack modules can use +1.5V and +3.3V

power.

Fuse not present on the board include+3.3V Aux Fuses F5. Some standard

Mini PCIe cards may require +3.3V Aux to power the module. For a site using

such a module the +3.3V fuse will need to be remove and the +3.3 Aux fuse

will need to be installed. Return the carrier board to Acromag to remove and

install these fuses.

Isolation Considerations

WARNING: This AcroPack carrier is designed to provide isolation between the

AcroPack Field I/O signals and the host. The AcroPack module must also be

an isolated AcroPack module to maintain the isolation between the logic and

field I/O signals. Unless isolation is provided on the AcroPack module itself,

the field I/O connections are not isolated from the PCIe bus.

Isolated Power

The use of an optional isolated DC/DC Converter is required for use with a few

of Acromag’s isolated AcroPack modules. See Figure 1 for carrier board

location allocated for the isolated DC/DC converter.

The power supplies of one AcroPack site must be isolated from the power

supplies of other AcroPack sites. The separate isolated DC/DC converter

make this possible. The DC/DC converted should only be populated on the

carrier for an AcroPack needing the isolated power. Each isolated AcroPack

module will list the requirement of the external DC/DC converter if needed.

The isolated DC/DC converter provide dual +12V and -12V power to the

AcroPack module on field I/O pins 49 and 50 as listed in the Table below.

Table 1 Carrier Isolated Power

Supply Voltage

Current (Min)

Field I/O Pin

+12V +/- 8% (max)

0.16 A

501

-12V +/- 8% (max)

0.16 A

491

Return (GND)

1 A

481

Note 1: AcroPack carriers without provisions for the isolated power supplies

can provide external power from the field power to the AcroPack module on

pins 48, 49 and 50.

CARRIER ADDRESS ASSIGNMENT

Following are the instructions for setting the slot address of the carrier. By

assigning a unique address to each carrier, system software can distinguish

this carrier from other similarly configured carriers installed in a system.

Figure 2 below shows the location of switch SW1. Set the switch state as

AcroPack Series APCe7012E-LF PCI Express Carrier Board

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shown in Table below to assign a unique slot address to this carrier. Note:

switch positions are indicated on the switch. Factory default address is zero.

Table 2 Switch SW1 assignments

SW1 Position

Function

Factory Default

Not used

N/A

Not used

N/A

Not used

N/A

ACROPACK MODULE INSTALLATION

Power should be removed from the carrier board when installing an AcroPack

module, cables, termination panels, and field wiring. Refer to Figure 2 while

reading this section. To install, first insert the edge of the AcroPack module

into the carrier connector at an angle similar to that shown in the figure. Next,

using a rocking motion while gently applying force to keep the edge of the

board against the back of the carrier connector, position the module such that

the field I/O connector is just above the mating connector. Verify that the two

connectors are properly aligned. Once alignment is achieved, you can fully

seat the connector. It will snap into place. Install two M2.5 screws as shown.

Figure 2 AcroPack Module Installation

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