Western Digital OpenFlex F3100 Manuel utilisateur

User Guide

OpenFlex™ F3100 and E3000

1ET2050

Version 1.0

October 2019

User Guide Table of Contents

Table of Contents

Copyright................................................................................................................................................................................... iv

Points of Contact....................................................................................................................................................................... v

Chapter 1. Overview........................................................................................................................................................................ 1

OpenFlex™ F3100 and E3000.................................................................................................................................................. 2

Servicing Features.............................................................................................................................................................. 3

Composable Infrastructures...............................................................................................................................................3

NVMe-oF..............................................................................................................................................................................4

Supported SKUs................................................................................................................................................................. 4

List of Compatible Devices............................................................................................................................................... 4

System Architecture Overview.................................................................................................................................................5

System High Speed Data Ingest Architecture.................................................................................................................5

System Thermal and Cooling............................................................................................................................................5

OpenFlex F3100 and E3000 Specification Summary.............................................................................................................. 7

Physical Design.........................................................................................................................................................................10

LEDs....................................................................................................................................................................................12

Cables................................................................................................................................................................................ 16

Restrictions and Limitations.....................................................................................................................................................16

Site Requirements.....................................................................................................................................................................17

Power Requirements.........................................................................................................................................................17

Rack Requirements............................................................................................................................................................17

Thermal and Cooling Requirements............................................................................................................................... 18

Servicing Requirements....................................................................................................................................................18

Chapter 2. Components...............................................................................................................................................................20

Chassis.......................................................................................................................................................................................21

Chassis Specifications.......................................................................................................................................................21

PSU............................................................................................................................................................................................ 22

PSU Specifications............................................................................................................................................................22

Fan Module............................................................................................................................................................................... 23

Fan Module Specifications............................................................................................................................................... 23

BMC Module............................................................................................................................................................................. 24

BMC Module Specifications.............................................................................................................................................24

Rails........................................................................................................................................................................................... 25

Rails Specifications........................................................................................................................................................... 25

User Guide Table of Contents

OpenFlexF3100......................................................................................................................................................................... 26

OpenFlexF3100 Specifications.........................................................................................................................................26

OpenFlex E3000 Fabric Device Blank.................................................................................................................................... 27

OpenFlex E3000 Fabric Device Blank Specifications.................................................................................................... 27

List of Field/Customer Replaceable Units.............................................................................................................................28

Chapter 3. Management............................................................................................................................................................... 29

OCGUI.......................................................................................................................................................................................30

Login Page........................................................................................................................................................................30

Dashboard.........................................................................................................................................................................30

Storage Device Page....................................................................................................................................................... 35

Chassis Device Page........................................................................................................................................................ 42

Basic Operational Functions............................................................................................................................................ 49

Power Cycling...................................................................................................................................................................74

Firmware Upgrade............................................................................................................................................................75

Part Replacement..................................................................................................................................................................... 81

Fan Module Replacement................................................................................................................................................82

PSU Replacement............................................................................................................................................................. 84

BMC Module Replacement..............................................................................................................................................88

OpenFlexF3100 Replacement...........................................................................................................................................91

Rails Replacement............................................................................................................................................................ 95

Chassis Replacement.......................................................................................................................................................113

Chapter 4. Safety......................................................................................................................................................................... 135

Electrostatic Discharge.......................................................................................................................................................... 136

Optimizing Location............................................................................................................................................................... 136

Power Connections................................................................................................................................................................ 136

Power Cords........................................................................................................................................................................... 136

Rackmountable Systems........................................................................................................................................................ 137

Restricted Access Location................................................................................................................................................... 137

Safety and Service..................................................................................................................................................................137

Safety Warnings and Cautions.............................................................................................................................................. 138

Chapter 5. Regulatory................................................................................................................................................................. 139

Europe (CE Declaration of Conformity)................................................................................................................................140

FCC Class A Notice............................................................................................................................................................... 140

ICES-003 Class A Notice—Avis NMB-003, Classe A........................................................................................................... 140

Japanese Compliance Statement, Class A ITE.................................................................................................................... 140

User Guide Table of Contents

KCC Notice (Republic of Korea Only), Class A ITE............................................................................................................. 140

Taiwan Warning Label Statement, Class A ITE.....................................................................................................................141

iii

User Guide Copyright

The following paragraph does not apply to the United Kingdom or any country where such provisions

are inconsistent with local law: Western Digital a Western Digital company PROVIDES THIS PUBLICATION

"AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED

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statement may not apply to you.

This publication could include technical inaccuracies or typographical errors. Changes are periodically made

to the information herein; these changes will be incorporated in new editions of the publication. Western

Digital may make improvements or changes in any products or programs described in this publication at any

time.

It is possible that this publication may contain reference to, or information about, Western Digital products

(machines and programs), programming, or services that are not announced in your country. Such references

or information must not be construed to mean that Western Digital intends to announce such Western Digital

products, programming, or services in your country.

Technical information about this product is available by contacting your local Western Digital representative

or on the Internet at: support@wdc.com

Western Digital may have patents or pending patent applications covering subject matter in this document.

The furnishing of this document does not give you any license to these patents.

Long Live Data™ is a trademark of Western Digital, Inc. and its affiliates in the United States and/or other

countries.

Western Digital trademarks are authorized for use in countries and jurisdictions in which Western Digital

has the right to use, market and advertise the brands. Other product names are trademarks or registered

trademarks of their respective owners.

One MB is equal to one million bytes, one GB is equal to one billion bytes, one TB equals 1,000GB (one trillion

bytes) and one PB equals 1,000TB when referring to storage capacity. Usable capacity will vary from the raw

capacity due to object storage methodologies and other factors.

References in this publication to Western Digital products, programs or services do not imply that Western

Digital intends to make these available in all countries in which Western Digital operates.

Product information is provided for information purposes only and does not constitute a warranty.

Information is true as of the date of publication and is subject to change. Actual results may vary. This

publication is for general guidance only. Photographs may show design models.

Western Digital

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User Guide Points of Contact

Points of Contact

For further assistance with a Western Digital product, contact Platform Engineering technical support. Please

be prepared to provide the following information: part number (P/N), serial number (S/N), product name

and/or model number, and a brief description of the issue.

Email:

support@wdc.com

Website:

https://portal.wdc.com/Support/s/

Western Digital

Overview

In This Chapter:

- OpenFlex™ F3100 and E3000.......................2

- System Architecture Overview..................... 5

- OpenFlex F3100 and E3000 Specification

Summary........................................................... 7

- Physical Design............................................. 10

- Restrictions and Limitations........................ 16

- Site Requirements.........................................17

User Guide 1. Overview

1.1 OpenFlex™ F3100 and E3000

The OpenFlex™ F3100 and E3000 is a 3U rack

mounted data storage enclosure built on the

OpenFlex platform. OpenFlex is Western Digital’s

architecture that supports Open Composable

Infrastructure (OCI). The OpenFlex F3100 and

E3000 are fabric devices that leverage this OCI

approach in the form of disagreggated data storage

using NVMe-over-Fabrics (NVMe-oF). NVMe-oF is

a networked storage protocol that allows storage

to be disaggregated from compute to make that

storage widely available to multiple applications

and servers. By enabling applications to share a

common pool of storage capacity, data can be easily

shared between applications, or needed capacity

can be allocated to an application regardless of location. Exploiting NVMe device-level performance,

NVMe-oF promises to deliver the lowest end-to-end latency from application to shared storage. NVMe-

oF enables composable infrastructures to deliver the data locality benefits of NVMe DAS (low latency, high

performance) while providing the agility and flexibility of sharing storage and compute.

The maximum data storage capacity is 614TB * when leveraging a full set of 10 F3100 fabric devices.

The enclosure runs on an input voltage of 200V - 240V and consumes ~1400W of power under typical

conditions. It requires a maximum of 1600W at full load.

Composable Infrastructure

An emerging category of

datacenter infrastructure that

seeks to disaggregate compute,

storage, and networking fabric

resources into shared resource

pools that can be available

for on-demand allocation (i.e.,

“composable”). Composability

occurs at the software level,

disaggregation occurs at the

hardware level using NVMe™-

over-Fabric—will vastly improve

compute and storage utilization,

performance, and agility in the

data center.

OpenFlex

OpenFlex is Western Digital’s

architecture that supports Open

Composable Infrastructure

through storage disaggregation

– both disk and flash natively

attached to a scalable fabric.

OpenFlex does not rule out

multiple fabrics, but whenever

possible, Ethernet will be used as

a unifying connect for both flash

and disk because of its broad

applicability and availability.

Open Composable API

Western Digital's new Open

Composable API is designed

for data center composability.

It builds upon existing industry

standards utilizing the best

features of those standards as

well as practices from proprietary

management protocols.

• 614TB * • 200V - 240V Input Voltages • Dual 1600W PSUs

• 12GBps NVMe-oF over QSFP28

Cables

• 3U Form Factor • Operational Temperature: 5°C to

35°C

• 68.5 kg / 151.1 lbs. • Hot-swappable PSUs and Fans • Dynamic Provisioning Supported

* Max storage capacity depends on device version and device configuration.

User Guide 1. Overview

1.1 OpenFlex™ F3100 and E3000

1.1.1 Servicing Features

The OpenFlex F3100 and E3000 are equipped with several features that make servicing simpler and safer.

Every CRU component has been designed with toolless removal features.

The BMC Module, Fan Module, PSU, and F3100 devices are all hotswappable components. This document

provides full instructions on how these features operate in the Management (page 29) section.

1.1.2 Composable Infrastructures

An emerging category of datacenter infrastructure that seeks to disaggregate compute, storage, and

networking fabric resources into shared resource pools that can be available for on-demand allocation (i.e.,

“composable”). Composable occurs at the software level, disaggregation occurs at the hardware level.

Western Digital’s vision for Open Composable Infrastructures is based on four key pillars:

•Open

◦Open in both API and form factor

◦Designed for robust interoperability of multi-vendor solutions

•Scalable

◦Ability to compose solutions at the width of the network

◦Enable self-organizing systems of composable elements that communicate horizontally

•Disaggregated

◦Pools of resources available for any use case that is defined at run time

◦Independent scaling of compute & storage elements to maximize efficiency & agility

•Extensible

◦Inclusive of both disk and flash

◦Entire ecosystem of composable elements managed & orchestrated using a common API

framework

◦Prepared for yet-to-come composable elements – e.g., memory, accelerators

1.1.2.1 Open Composable

The Western Digital Open Composable Infrastructure (OCI) uses a common API to manage and

coordinate with all fabric-attached storage including pools of flash and disk. The infrastructure also

supports the management of networking and compute resources. The API is used for all managed

elements to accelerate the ability to use disaggregated resources where components are no longer sub-

components, but core elements connected to the network.

1.1.2.2 Open Composable API (OCAPI)

Western Digital’s Open Composable API is a RESTful interface for OpenFlex that enables a Unified Fabric

Control Plane for Storage Fabric Devices. This allows for composing disaggregated storage resources—

with compute, networking, and memory—into virtual systems in the future. These virtual systems will be

dynamically provided to the right application at the right time, ensuring SLAs can be met automatically.

•Volume management (create / modify / delete namespaces, format media)

User Guide 1. Overview

1.1 OpenFlex™ F3100 and E3000

•Monitor hardware sensors (temperatures, voltages, fan speeds, hardware state)

•Configure hardware (update firmware, reboot individual components or systems, assert LEDs)

•Monitor performance (statistics, bandwidth, IOPS, latency)

•Capture inventory data (serial number, part number, etc.)

•Capture log information

•Configure policies (user access lists, authentication, LUN masking, HTTPS/TLS encryption/security

with certificate/key settings)

•Self-discovery of other locally-available resources configurable using the Open Composable API for

OpenFlex

1.1.2.3 OCGUI

The Open Composable Graphical User Interface (OCGUI) is the graphical representation of all of the data

shared up to the fabric by the OCAPI. This GUI is presented to the user by browsing to the IP address

of any device on the fabric. The GUI has a "command-center" design layout that presents all vital health,

utilization, and performance statistics related to devices on the network at a glance.

1.1.3 NVMe-oF

Non-Volatile Memory Express over Fabric (NVMe-oF) is one of the primary enabling technologies for the

OpenFlex platform. NVMe-oF enables the high-speed, low-latency storage performance of NVMe over

a fabric switching network. OpenFlex products drive network communications across the fabric using

100Gb/s Ethernet protocol. This allows for a complex network of computing devices to all share the same

storage resources with very high performance.

1.1.4 Supported SKUs

The following table lists the versions of this Western Digital product that are supported by this document.

Table 1: List of Supported SKUs

Component Capacity SKU

OpenFlex E3000 Chassis 3U10 Enclosure N/A 1ES1778

OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 12.8TB 1EX2413

OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 15.36TB 1EX2416

OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 25.6TB 1EX2414

OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 30.72TB 1EX2417

OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 51.2TB 1EX2415

OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 61.44TB 1EX2418

1.1.5 List of Compatible Devices

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