Texas Instruments WR1843 Series Manuel utilisateur

SPRUIM4B–December 2018–Revised May 2020

xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

User's Guide

SPRUIM4B–December 2018–Revised May 2020

xWR1843 Evaluation Module (xWR1843BOOST)

Single-Chip mmWave Sensing Solution

The xWR1843 BoosterPack™ from Texas Instruments™ is an easy-to-use evaluation board for the

xWR1843 mmWave sensing device, with direct connectivity to the microcontroller (MCU) LaunchPad™

Development Kit. The BoosterPack contains everything required to start developing software for on-chip

C67x DSP core and low-power Arm®R4F controllers, including onboard emulation for programming and

debugging as well as onboard buttons and LEDs for quick integration of a simple user interface.

Contents

1 Getting Started............................................................................................................... 2

1.1 Introduction .......................................................................................................... 2

1.2 Key Features ....................................................................................................... 2

1.3 Kit Contents.......................................................................................................... 2

2 Hardware...................................................................................................................... 3

2.1 Block Diagram....................................................................................................... 5

2.2 Power Connections................................................................................................. 5

2.3 Connectors .......................................................................................................... 6

2.4 PC Connection...................................................................................................... 9

2.5 Connecting the BoosterPack to the DCA1000 ................................................................. 9

2.6 Connecting the BoosterPack to the LaunchPad or the MMWAVE-DEVPACK............................ 10

2.7 Antenna............................................................................................................. 11

2.8 Jumpers, Switches, and LEDs................................................................................... 13

3 Design Files and Software Tools......................................................................................... 16

3.1 Hardware........................................................................................................... 16

3.2 Software, Development Tools, and Example Code........................................................... 16

4 Design Revision History .................................................................................................. 18

5 Mechanical Mounting of PCB............................................................................................. 18

6 PCB Storage and Handling Recommendations........................................................................ 19

7 Troubleshooting ............................................................................................................ 19

8 References.................................................................................................................. 19

Trademarks

BoosterPack, Texas Instruments, LaunchPad, Code Composer Studio are trademarks of Texas

Instruments.

Arm is a registered trademark of Arm Limited.

Windows is a registered trademark of Microsoft Corporation.

All other trademarks are the property of their respective owners.

Getting Started

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xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

1 Getting Started

1.1 Introduction

The xWR1843 BoosterPack from Texas Instruments is an easy-to-use evaluation board for the xWR1843

mmWave sensing device, with direct connectivity to the microcontroller (MCU) LaunchPad Development

Kit. The BoosterPack contains everything required to start developing software for on-chip C67x DSP core

and low-power ARM R4F controllers, including onboard emulation for programming and debugging as well

as onboard buttons and LEDs for quick integration of a simple user interface.

The standard 20-pin BoosterPack headers make the device compatible with a wide variety of TI MCU

LaunchPads and enables easy prototyping.

1.2 Key Features

• Two 20-pin LaundPad connectors that leverages the ecosystem of the TI LaunchPad

• XDS110 based JTAG emulation with a serial port for onboard QSPI flash programming

• Back-channel UART through USB-to-PC for logging purposes

• Onboard antenna

• 60-pin, high-density (HD) connector for raw analog-to-digital converter (ADC) data over LVDS and

trace-data capability

• Onboard CAN-FD transceiver

• One button and two LEDs for basic user interface

• 5-V power jack to power the board

1.3 Kit Contents

The following items are included with the xWR1843BOOST kit.

• xWR1843 evaluation board

• Mounting brackets, screws, and nuts to place the printed-circuit board (PCB) vertical

• Micro USB cable to connect to PC

NOTE: A 5-V, > 2.5-A supply brick with a 2.1-mm barrel jack (center positive) is not included. TI

recommends using an external power supply that complies with applicable regional safety

standards, such as UL, CSA, VDE, CCC, PSE, and more. The length of the power cable

should be < 3 m.

1.3.1 mmWave Proximity Demo

TI provides sample demo codes to easily get started with the xWR1843 evaluation module (EVM) and to

experience the functionality of the xWR1843 radar sensor. For details on getting started with these demos,

see www.ti.com/tool/mmwave-sdk.

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Hardware

SPRUIM4B–December 2018–Revised May 2020

xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

2 Hardware

Figure 1 and Figure 2 show the front and rear view of the EVM, respectively.

Figure 1. EVM (Front)

Hardware

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xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

Figure 2. EVM (Rear)

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Hardware

SPRUIM4B–December 2018–Revised May 2020

xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

2.1 Block Diagram

Figure 3 shows the block diagram.

Figure 3. Block Diagram

2.2 Power Connections

The BoosterPack is powered by the 5-V power jack (2.5-A current limit), shown in Figure 4. As soon as

the power is provided, the NRST and 5-V LEDs should glow, indicating that the board is powered on.

NOTE: After the 5-V power supply is provided to the EVM, it is recommended to press the NRST

switch (SW2) one time to ensure a reliable boot-up state.

Figure 4. Power Connector

Hardware

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xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

2.3 Connectors

2.3.1 20-Pin BoosterPack Connectors

The BoosterPack has the standard LaunchPad connectors (J5 and J6, shown in Figure 5) that enable it to

be directly connected to all TI MCU LaunchPads. While connecting the BoosterPack to other LaunchPads,

ensure the pin-1 orientation is correct by matching the 3V3 and 5-V signal marking on the boards.

Figure 5. 20-Pin BoosterPack Connectors

Table 1 and Table 2 provide the connector-pin information.

Table 1. J5 Connector Pin

Pin Number Description Pin Number Description

1 NERROUT 2 GND

3 NERRIN 4 DSS LOGGER

5 MCUCLK OUT 6 SPI_CS

7 NC 8 GPIO01

9 MSS LOGGER 10 nRESET

11 WARMRST 12 SPI_MOSI

13 BSS LOGGER 14 SPI_MISO

15 SOP2 16 HOSTINT

17 SOP1 18 GPIO02

19 SOP0 20 NC

(1) Voltage input to the GPADC available on the xWR1843.

(2) Indicates the state of the onboard VIO supply for the AWR device coming from the onboard PMIC. A HIGH on the PGOOD

signal (3.3 V) indicates the supply is stable. Because the I/Os are not failsafe, the MCU must not drive any I/O signals to the

AWR device before this I/O supply is stable to avoid leakage current into the I/Os.

(3) Controls the onboard PMIC enable. The MCU can use this to shut down the PMIC and AWR device during the periods it does

not use the AWR device and save power. The power up of the PMIC takes approximately 5 ms once the enable signal is made

high.

Table 2. J6 Connector Pin

Pin Number Description Pin Number Description

1 3V3 2 5 V

3 NC 4 GND

5 RS232RX (Tx from AWR device) 6 ANA1(1)

7 RS232RX (Rx into AWR device) 8 ANA2(1)

9 SYNC_IN 10 ANA3(1)

11 NC 12 ANA4(1)

13 SPI_CLK 14 PGOOD (onboard VIO)(2)

15 GPIO0 16 PMIC Enable(3)

17 SCL 18 SYNC_OUT

19 SDA 20 PMIC CLK OUT

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Hardware

SPRUIM4B–December 2018–Revised May 2020

xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave Sensing

Solution

2.3.2 60-Pin HD Connector

The 60-pin HD connector provides the high speed LVDS data, control signals (SPI, UART, I2C, NRST,

NERR, SOPs) and JTAG debug signals. The connector can be connected to the MMWAVE-DEVPACK

board to further get to the standard TSW1400 EVM. Figure 6 shows the HD connector, and Table 3

provides the connector information.

Figure 6. HD Connector

(1) Indicates the state of the onboard VIO supply for the AWR device coming from the onboard PMIC. A HIGH on the PGOOD

signal (3.3 V) indicates the supply is stable. Because the I/Os are not failsafe, the MCU must not drive any I/O signals to the

AWR device before this I/O supply is stable to avoid leakage current into the I/Os.

Table 3. J1 Connector Pin

Pin Number Description Pin Number Description

1 5V 2 5V

3 5V 4 TDO

5 TDI 6 TCK

7 SPI_CS 8 TMS

9 SPI_CLK 10 HOSTINT

11 SPI_MOSI 12 SPI_MISO

13 PGOOD (onboard VIO)(1) 14 NERROUT

15 DMM_CLK 16 SYNC_IN

17 DMM_SYNC 18 GND

19 TRACE_DATA0 20 NC

21 TRACE_DATA1 22 NC

23 TRACE_DATA2 24 GND

25 TRACE_DATA3 26 LVDS_FRCLKP

27 TRACE_DATA4 28 LVDS_FRCLKM

29 TRACE_DATA5 30 GND

31 TRACE_DATA6 32 NC

33 TRACE_DATA7 34 NC

35 TRACE_DATA8 36 GND

37 TRACE_DATA9 38 NC

39 TRACE_DATA10 40 NC

41 TRACE_DATA11 42 GND

Hardware

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xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

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Table 3. J1 Connector Pin (continued)

Pin Number Description Pin Number Description

43 TRACE_DATA12 44 LVDS_CLKP

45 TRACE_DATA13 46 LVDS_CLKM

47 TRACE_DATA14 48 GND

49 TRACE_DATA15 50 LVDS_1P

51 I2C_SDA 52 LVDS_1M

53 I2C_SCL 54 GND

55 RS232RX (Rx into AWR device) 56 LVDS_0P

57 RS232TX (Tx from AWR device) 58 LVDS_0M

59 nRESET 60 GND

2.3.3 CAN Interface Connector

The J3 connector provides the CAN_L and CAN_H signals from the onboard CAND-FD transceiver

(TCAN1042HGVDRQ1). These signals can be directly wired to the CAN bus.

Because the digital CAN signals (Tx and Rx) are muxed with the SPI interface signals on the AWR device,

one of the two paths must be selected. This is done by placing the switch S2 on the "CAN" position.

Figure 7 shows the CAN connector.

Figure 7. CAN Connector

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Hardware

SPRUIM4B–December 2018–Revised May 2020

xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

2.4 PC Connection

The connectivity is provided through the micro USB connector over the onboard XDS110

(TM4C1294NCPDT) emulator. This connection provides the following interfaces to the PC:

• JTAG for Code Composer Studio™ (CCS) connectivity

• UART1 for flashing the onboard serial flash, downloading FW through Radar Studio, and getting

application data sent through the UART

• MSS logger UART (can be used to get MSS code logs on the PC)

When the USB is connected to the PC, the device manager should recognize the following COM ports,

shown in Figure 8:

• XDS110 Class Application/User UART – UART1 port

• XDS110 Class Auxiliary Data Port – MSS logger port

Figure 8. COM Ports

If Windows®is unable to recognize the COM ports, users must install the EMU pack available at XDS

Emulation Software Package.

2.5 Connecting the BoosterPack to the DCA1000

The BoosterPack can be connected to the DCA1000 FGPA platform to allow for LVDS streaming over

Ethernet. For detailed information on how to capture LVDS data using the DCA1000, see the following

resources.

•DCA1000 Product Page

•DCA1000 User's Guide

•DCA1000 Training Video

Hardware

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xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave

Sensing Solution

2.6 Connecting the BoosterPack to the LaunchPad or the MMWAVE-DEVPACK

The development pack may be required with the BoosterPack for the following use cases:

• Connecting to Radar Studio

Radar Studio TSW1400+Devpack, mmwave Studio TSW1400+Devpack/DCA1000 tool is a tool that

provides capability to configure the mmWave front end from the PC. This tool is available in the DFP

package and refers to single dfp landing page for both pieces of software.

• Capturing high-speed LVDS data using the SW1400, TSW1400 or DCA1000 FPGA platform from TI

(see High Speed Data Capture and Pattern Generation Platform).

The TSW1400 FPGA platform allows users to capture the raw ADC data over the high-speed debug

interface and post process it in the PC.

• Getting DSP trace data through the MIPI 60-pin interface

• Use the DMM interface

This BoosterPack can be stacked on top of the Launchpad or the MMWAVE-DEVPACK by using the two

20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse

connection. Hence, care must be taken to ensure reverse mounting does not take place.

On the xWR1843 BoosterPack, TI has provided 3V3 markings near pin 1, shown in Figure 9. The same

marking is provided on compatible LaunchPads (must be aligned before powering up the boards).

Figure 9. 3V3 and 5V Marking on BoosterPack

For details on these use cases, see the MMWAVE-DEVPACK User's Guide.

NOTE: The DCA1000 EVM has internal DEVPACK functionality. For more information, see the

DCA1000EVM Data Capture Card User's Guide.

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