Texas Instruments MSPM0G3507 Manuel utilisateur

User’s Guide

MSPM0G3507 LaunchPad Development Kit

(LP

‑

MSPM0G3507)

ABSTRACT

The MSPM0G3507 LaunchPad™ development kit is an easy-to-use evaluation module for the MSPM0G3507

microcontroller (MCU). The LaunchPad kit contains everything needed to start developing on the MSPM0Gxxxx

microcontroller platform, including an onboard debug probe for programming, debugging, and EnergyTrace™

technology. The board also features onboard buttons, LEDs, an RGB LED, a light sensor, and a temperature

sensor.

The following figure shows the LP-MSPM0G3507 LaunchPad Development Kit.

MSPM0G3507 LaunchPad Development Kit

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Table of Contents

1 Getting Started........................................................................................................................................................................3

1.1 Introduction........................................................................................................................................................................ 3

1.2 Key Features......................................................................................................................................................................3

1.3 What's Included..................................................................................................................................................................3

1.4 First Step: Out-of-Box Experience..................................................................................................................................... 3

1.5 Next Steps: Looking Into the Provided Code..................................................................................................................... 4

2 Hardware................................................................................................................................................................................. 5

2.1 Jumper Map....................................................................................................................................................................... 5

2.2 Block Diagram....................................................................................................................................................................7

2.3 Hardware Features............................................................................................................................................................ 7

2.4 Power............................................................................................................................................................................... 13

2.5 External Power Supply and BoosterPack Plug-in Module............................................................................................... 13

2.6 Measure Current Draw of the MSPM0 MCU....................................................................................................................13

2.7 Clocking........................................................................................................................................................................... 14

2.8 BoosterPack Plug-in Module Pinout.................................................................................................................................14

2.9 Design Files..................................................................................................................................................................... 14

3 Software Examples...............................................................................................................................................................14

4 Resources............................................................................................................................................................................. 15

4.1 Integrated Development Environments............................................................................................................................15

4.2 MSPM0 SDK and TI Resource Explorer.......................................................................................................................... 15

4.3 MSPM0G3507 MCU........................................................................................................................................................ 15

4.4 Community Resources.....................................................................................................................................................16

5 Schematics............................................................................................................................................................................17

6 Revision History................................................................................................................................................................... 24

Trademarks

LaunchPad™, EnergyTrace™, BoosterPack™, Code Composer Studio™, and TI E2E™ are trademarks of Texas

Instruments.

IAR Embedded Workbench™ is a trademark of IAR Systems AB.

Arm®, Cortex®, Keil®, and µVision® are registered trademarks of Arm Limited.

All trademarks are the property of their respective owners.

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1 Getting Started

1.1 Introduction

The MSPM0G3507 is Arm® 32-bit Cortex®-M0+ CPU with a memory protection unit and frequency up to

80 MHz. The device features 128KB of embedded flash memory combined with 32KB of on-chip RAM. The

integrated high-performance analog peripherals include two 12-bit 4-Msps SAR ADCs, two zero-drift chopper

op-amps (OPA), and one general-purpose amplifier (GPAMP) to help users design their system.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range

of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical

displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose

among many already available from TI and third-party developers.

Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded

Workbench™ IDE, and Keil®µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology

when paired with the MSPM0G3507 LaunchPad™ development kit. Developer can easily measure the power

consumption of their applications. More information about the LaunchPad development kit, the supported

BoosterPack™ plug-in modules, and the available resources can be found at TI's LaunchPad development kit

portal. To get started quickly and find available resources in the MSPM0 software development kit (SDK), visit

the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive online collateral, training with

MSP Academy, and online support through the TI E2E™ support forums.

See the MSPM0 Quick Reference Guide for more resources surrounding MSPM0 devices.

1.2 Key Features

• Onboard XDS110 debug probe

• EnergyTrace technology available for ultra-low-power debugging

• 2 buttons, 1 LED and 1 RGB LED for user interaction

• Temperature sensor circuit

• Light sensor circuit

• External OPA2365 (default buffer mode) for ADC (up to 4 Msps) evaluation

• Onboard 32.768-kHz and 48-MHz crystals

• RC filter for ADC input (unpopulated by default)

1.3 What's Included

1.3.1 Kit Contents

• MSPM0G3507 LaunchPad development kit

• 1 Micro USB cable

• 1 Quick Start Guide

1.3.2 Software Examples

•Out-of-Box Software Example

•SDK Examples

1.4 First Step: Out-of-Box Experience

An easy way to get started with the EVM is by using the preprogrammed out-of-box code. This code

demonstrates some key features of the EVM and is meant to be used with the LP-MSPM0G3507 out-of-box

demo GUI.

1.4.1 Connecting to the Computer

Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED

illuminates if power connects. For proper operation, drivers are needed. TI recommends that you get the drivers

by installing an IDE such as TI's Code Composer Studio IDE or IAR Embedded Workbench IDE. Standalone

drivers are also available.

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1.4.2 Running the Out-of-Box Experience

Access the GUI Composer powered GUI for the Out-of-Box Experience (OoBE) through the TI Cloud Gallery.

Alternatively, the GUI is provided with the MSPM0 SDK as well for offline operation. Figure 1-1 shows the

welcome screen for the GUI. The GUI runs through three main examples:

• Blink LED – Change the rate of LED blinking

• Light Sensor – Read light sensor and plot results, and also modulate RGB brightness

• Thermistor – Read thermistor voltage and plot converted temperature over time. The RGB LED changes

colors to signify differences of temperature measured.

• Function Generator – Generate sine, square, and sawtooth waveforms, sample with ADC, and plot on graph.

Figure 1-1. Out-of-Box Experience Welcome Screen

1.5 Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It’s time to open an integrated development

environment and start editing the code examples. See Section 4 for available IDEs and where to download them.

The quickest way to get started using the LaunchPad development kit is to use TI’s cloud development tools.

The cloud-based Resource Explorer provides access to all of the examples and resources in MSPM0 SDK.

Code Composer Studio Cloud is a simple Cloud-based IDE that enables developing and running applications on

the LaunchPad development kit. SysConfig for MSPM0 is another graphical tool that can be utilized to easily and

quickly setup your MSPM0G3507 device, pins, and peripherals to fit your development needs. The out-of-box

source code and more code examples are provided and available on the download page. Code is licensed under

BSD, and TI encourages reuse and modifications to fit specific needs. Section 1.3.2 describes all functions in

detail and provides a project structure to help familiarize you with the code. With the XDS110 debug probe,

debugging and downloading new code is simple. A connection between the EVM and a PC through the provided

USB cable is all that is needed.

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2 Hardware

Figure 2-1 shows an overview of MSPM0G3507 LaunchPad development kit hardware.

XDS110 onboard debug probe

Enables debugging and

programming as well as

communication to the PC. The

XDS110 can also provide power

to the target MCU.

EnergyTrace Technology

Real-time power consumption and

state updates from the MSPM0G3507

MCU viewable in the EnergyTrace GUI

Reset

MSPM0G3507 reset

USB to PC

Button/Switch S1

Button/Switch S2

40-pin BoosterPack plug-in

module connector (J1-J4)

Light sensor

Jumper Isolation Block J101

Power (GND, 5V, and 3V3)

Back-channel UART to the PC (RXD, TXD)

SWD (SWDIO, SWCLK)

BSL

MSPM0G3507

Pullup voltage selection

UART to BP/XDS selection

LED

Thermistor

SW1 Select

SW2 Select

Analog Power

RGB LED

QEI interface

OPA2365

MSPM0G3507 pinout

extension block

Figure 2-1. MSPM0G3507 LaunchPad Development Kit Hardware

2.1 Jumper Map

Table 2-1 lists the default installation of the jumpers.

Table 2-1. LaunchPad Kit Header Description and Jumper Shunt Installation

Jumper Description Default setting Connected Pin or Signal Low Power Measurement

Recommendation

J101 XDS110-ET isolation block Installed

GND, 5V, 3V3, RXD, TXD,

NRST, SWDIO, SWCLK,

BSL

OFF to disconnect from

XDS-110 circuitry

J102 XDS110-ET OUT NA GND, 3V3, SWDIO,

SWCLK, NRST No external connection

J103 XDS110-ET IN NA GND, 3V3, SWDIO, SWCLK No external connection

J1/J3 BoosterPack pin header NA See schematic for details No external connection

J2/J4 BoosterPack pin header NA See schematic for details No external connection

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Table 2-1. LaunchPad Kit Header Description and Jumper Shunt Installation (continued)

Jumper Description Default setting Connected Pin or Signal Low Power Measurement

Recommendation

J4 Red LED1 Installed PAO to LED OFF to disconnect pin from

LED

J5 RGB LED2 – blue channel Installed PB22 to RGB LED OFF to disconnect pin from

RGB LED

J6 RGB LED2 – red channel Installed PB26 to RGB LED OFF to disconnect pin from

RGB LED

J7 RGB LED2 – green channel Installed PB27 to RGB LED OFF to disconnect pin from

RGB LED

J8 S1 Button and

BSL invoke Installed PA18

OFF to avoid current from

external pulldown depending

on pin configuration

J9 Thermistor signal selection (1) short to (2) PB.24 PB24 to thermistor circuit OFF to disconnect from

thermistor circuit

J10 5V power header NA 5V, GND No external connection

J11 3V3 power header NA 3V3, GND No external connection

J12 QEI interface header NA PA29, PA30, PB14, 3V3,

GND No external connections

J13 Analog power – power to thermistor

and OPA2365 Installed 3V3

OFF to disconnect power

to thermistor, and OPA2365

circuits

J14 SW1 selection to BP header – PA9/

PB23 (1) short to (2) PB.23 PB23 to J1.3 Don't care if not used in

BoosterPack connector

J15 SW2 selection to BP header – PA16/

PA18 (1) short to (2) PA16 PA16 to J3.29 Don't care if not used in

BoosterPack connector

J16 OPA0_OUT for light sensor circuit Installed PA22 to light sensor OFF to disconnect from

photodiode circuit

J17 OPA0_IN0- for light sensor circuit Installed PA27 to light sensor OFF to disconnect from

photodiode circuit

J18 OPA0_IN0+ for light sensor circuit Installed PA26 to light sensor OFF to disconnect from

photodiode circuit

J19 PA0 Open-drain IO pullup (1) Short to (2) 3.3 V PA0 to 3V3

OFF if pin initialized as

output low or input with

pullup/pulldown

J20 PA1 Open-drain IO pullup (1) Short to (2) 3.3 V PA1 to 3V3

OFF if pin initialized as

output low or input with

pullup/pulldown

J21 UART0_TX selection (1) short to (2) XDS_UART

function PA10 to XDS OFF to disconnect pin

J22 UART0_RX selection (1) short to (2) XDS_UART

function PA11 to XDS OFF to disconnect pin

J23-J28 MSPM0G3507 pin extension header

(unlabeled – bottom of board) NA See schematic for details No external connection

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2.2 Block Diagram

LEDs

red and

green

Debug

MCU

Reset

button

Micro-B

USB

ESD

protection

Target device

MSPM0G3507

40-pin

LaunchPad kit

standard headers

Light sensor

Power, UART, SWD to target

EnergyTrace

technology

Thermistor RGB

LED

User interface:

Buttons and red LED

External

debug, out

External

debug, in

UART

path

QEI

Header

extension

header

OPA2365

Figure 2-2. Block Diagram

2.3 Hardware Features

2.3.1 MSPM0G3507 MCU

The MSPM0G3507 devices provide 128KB of embedded flash program memory with built-in error correction

code (ECC) and 32KB of SRAM with hardware parity. The devices also incorporate a memory protection unit,

7-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit

4-Msps ADCs, a configurable internal shared voltage reference, one 12-bit DAC, three high speed comparators

with built-in reference DACs, two zero-drift op-amps with programmable gain, and one general-purpose amplifier.

The devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, three 16-bit

general purpose timers, one 32-bit high resolution timer, two windowed-watchdog timers, and one RTC with

alarm and calendar mode. These devices provide data integrity and encryption peripherals (AES, CRC, TRNG)

and enhanced communication interfaces (four UART, two I2C, two SPI, and one CAN 2.0/FD).

Device feature include:

• 1.62-V to 3.6-V operation

• Arm 32-bit Cortex-M0+ with memory protection unit, up to 80 MHz

• 128KB of flash with built-in ECC and 32KB of SRAM with hardware parity

• Two 12-bit 4-Msps ADCs

• 12-bit DAC

• Two zero-drift zero-crossover chopper op-amps

• Two 16-bit advanced control timers

• Three 16-bit general-purpose timers

• One 32-bit high-resolution time

• 60 GPIO

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LQFP64

PB12

PB11

PB10

PB9

PB8

PB7

PB6

PA11

PA10

PA9

PA8

PB5

PB4

PB3

PB2

PA7

PB1

PB0

PA6 / HFXOUT

PA5 / HFXIN

PA4 / LFXOUT

PA3 / LFXIN

PA2 / ROSC

VSS

VDD

PA31

NRST

PA30

PA29

PA28

PA1

PA0

PB13

PB14

PB15

PB16

PA12 / CAN_TX

PA13 / CAN_RX

PA14

PA15 / A1_0

PA16 / A1_1

PA17 / A1_2

PA18 / A1_3

PA19 / SWDIO

PA20 / SWCLK

PB17 / A1_4

PB18 / A1_5

PB19 / A1_6

PA21 / A1_7 / VREF-

PA22 / A0_7

PB20 / A0_6

PB21

PB22

PB23

PB24 / A0_5

PA23 / VREF+

PA24 / A0_3

PA25 / A0_2

PB25 / A0_4

PB26

PB27

PA26 / A0_1 / CAN_TX

PA27 / A0_0 / CAN_RX

VCORE

Figure 2-3. LQFP64 Pinout (Top View)

2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology

To keep development easy and cost effective, TI’s LaunchPad development kits integrate an onboard debug

probe, which eliminates the need for expensive programmers. The MSPM0G3507 has the XDS110 debug probe

(see Figure 2-4), which is a simple and low-cost debugger that supports all MSPM0 device derivatives.

Figure 2-4. LP-MSPM0G3507 Debugger

The XDS110 ET also provides a "backchannel" UART-over-USB connection with the host, which can be very

useful during debugging and for easy communication with a PC. More details can be found in Section 2.3.4.

2.3.3 Debug Probe Connection Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the

XDS110-ET domain into the MSPM0G3507 target domain. This includes XDS110-ET SWD signals, application

UART signals, and 3.3-V and 5-V power.

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LDO

MSPM0G3507

Target MCU

BoosterPack Header

USB

IN OUT

USB Connector

XDS110-ETMSPM0G3507 Target

XDS110-ET

Debug Probe

MCU

XDS110

Debug

Out

External

Debug

SWD + BSL

Application

UART0

3.3-V

Power

5-V Power

EnergyTrace

To XDS

To BP

Header UART

Path

J101

Isolation

Pin Extension Header

Figure 2-5. Isolation Jumper Block

Reasons to open these connections:

• To remove any and all influence from the XDS110-ET debug probe for high accuracy target power

measurements

• To control 3.3-V and 5-V power flow between the XDS110-ET and target domains

• To expose the target MCU pins for other use than onboard debugging and application UART communication

• To expose the programming and UART interface of the XDS110-ET so that it can be used for devices other

than the onboard MCU.

Jumper Description

GND Ground

5V 5-V VBUS from USB

3V3 3.3-V rail, derived from VBUS in the XDS110-ET domain

RXD<< Backchannel UART: The target M0G3507 receives data through this signal. The arrows indicate the direction of the

signal

TXD>> Backchannel UART: The target M0G3507 sends data through this signal. The arrows indicate the direction of the

signal

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Jumper Description

NRST RST signal

SWDIO Serial wire debug: SWDIO data signal.

SWCLK Serial wire debug: SWDCLK clock signal

BSL Bootstrap loader signal

2.3.4 Application (or Backchannel) UART

The backchannel UART allows communication with the USB host that is not part of the main functionality of the

target application. This is very useful during development and also provides a communication channel to the

PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that

communicate with the LaunchPad development kit.

Figure 2-5 shows the pathway of the backchannel UART. The backchannel UART is the UART on UART0

(PA10, PA11) depending on the jumper settings on headers J21 and J22.

On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad

development kit enumerates on the host. You can use any PC application that interfaces with COM ports,

including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target

application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can

assist.

Figure 2-6. Application Backchannel UART in Device Manager

The backchannel UART is the "XDS110 Class Application/User UART" port. In this case, Figure 2-6 shows

COM14, but this port can vary from one host PC to the next. After you identify the correct COM port, configure it

in your host application according to its documentation. You can then open the port and begin communication to

it from the host.

On the target MSPM0G3507 side, the backchannel is connected to the UART0 module. The XDS110-ET has a

configurable baud rate; therefore, it is important that the PC application configures the baud rate to be the same

as what is configured on the UART0.

2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET

Many users have a preferred external debug probe and want to bypass the XDS110-ET debug probe to program

the MSPM0 target MCU. The bypass is enabled by jumpers on isolation block J101 and the connector J103.

Using an external debug probe is simple, and full JTAG access is provided through J103.

1. Remove jumpers on the JTAG signals on the J101 isolation block, including NRST, SWDIO and SWCLK.

2. Plug any Arm debug probe into J103.

a. J103 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.

3. Plug USB power into the LaunchPad development kit, or power the kit externally.

a. Make sure that the jumpers across 3V3 and GND are connected if using USB power.

b. External debug probes do not provide power, the VCC pin is a power sense pin.

c. For more details on powering the LaunchPad development kit, see Section 2.4

2.3.6 Using the XDS110-ET Debug Probe With a Different Target

The XDS110-ET debug probe on the LaunchPad development kit can interface to most Arm Cortex-M devices,

not just the onboard target MSPM0G3507 device. This functionality is enabled by the J102 10-pin Cortex-M

JTAG connector and a 10-pin cable. Header J102 follows the Cortex-M Arm standard, however, pin 1 is not a

voltage sense pin. The XDS110- ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the

user must provide level shifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can

be sourced from the XDS110-ET when jumper JP102 is connected. This allows the XDS110-ET to power the

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