
Environment
Do not aim the device at strong light to focus, such as lamp light and sun light.
Transport, use and store the device within the range of allowed humidity and temperature.
Keep the camera away from water or other liquid to avoid damages to the internal
components.
Keep sound ventilation to avoid heat accumulation.
Heavy stress, violent vibration or water splash are not allowed during transportation,
storage and installation.
Pack the device with standard factory packaging or the equivalent material when
transporting the device.
It is recommended to use the device together with lightning arrester to improve lightning
protection effect.
It is recommended to get the grounding holes to be grounded to enhance the reliability of
the device.
It is recommended to use qualified video transmission cable to improve video quality. It is
recommended to use RG59 coaxial cable or higher standard.
Use standard components or accessories provided by manufacturer and make sure the
device is installed and maintained by professional engineers.
The surface of the image sensor should not be exposed to laser beam radiation in an
environment where a laser beam device is used.
Do not provide two or more power supply sources for the device; otherwise it might
damage the device.
When the camera is in the condition of PoC power supply, do not connect any other device
between the camera and PoC transceiver including UTC, Balun, optical transceiver,
distributor and convertor and so on; otherwise, the device might get burned.
PoC supply voltage is up to 52V. Do not dismantle the device during normal operation;
otherwise it might cause danger to both device and users due to high voltage.
Table of Contents
Foreword.................................................................................................................................................... I
1 Introduction............................................................................................................................................ 1
1.1 General.......................................................................................................................................... 1
1.2 Features........................................................................................................................................ 1
2 Design..................................................................................................................................................... 2
2.1 Dimension..................................................................................................................................... 2
2.2 Cable............................................................................................................................................. 3
3 Installation.............................................................................................................................................. 5
4 Configuration......................................................................................................................................... 7
4.1 Opening Main Menu...................................................................................................................... 7
4.2 Setting Audio Input........................................................................................................................ 8
4.3 Operating OSD Menu ................................................................................................................. 10
5 Maintenance......................................................................................................................................... 12