Sensl J series Manuel utilisateur

ArrayJ-High Fill-Factor Arrays of J-Series SiPM Sensors

ArrayJ

USER MANUAL

SensL’s range of J-Series SiPM sensors have been used

to create high ll-factor, scaleable arrays. The sensors are

mounted onto PCB boards with minimal dead space, forming

arrays with industry-leading ll factor of up to 90%.

The back of each ArrayJ has either one or more multi-way

connectors, or a BGA (ball grid array). These allow access to

the fast output* and standard I/O from each pixel in the array,

and a common I/O from the summed substrates of the pixels.

The ArrayJ products with connectors can be used to interface

with the user’s own readout via a mating connector, or to a

SensL Breakout Board (BOB). The BOBs allow for easy ac-

cess to the pixel signals and performance evaluation of the

arrays.

ArrayJ products with the BGA can be reow soldered to the

user’s readout boards, or purchased ready-mounted on a

pinned PCB evaluation board for easy testing. A BGA ArrayJ

cannot be removed from it’s PCB evaluation board. This con-

trasts with an ArrayJ with connectors, as multiple arrays can

be evaluated with a single BOB.

ARRAYJ INPUTSAND OUTPUTS (I/O)

Figure 1 summarizes the array schematic for a portion of an

ArrayJ. Each SiPM sensor in the array has three electrical con-

nections: fast output, standard output and common.

The substrates (cathodes) of all sensors are summed together

to form the common I/O.

Each individual fast output and standard I/O (anode) are rout-

ed to its own output pin.

The pixel-level performance of the sensors in the array can be

found in the J-Series datasheet.

* The fast output is not available on the 2x2 array (ArrayJ-60035-4P).

Figure 1, Signal connections at the pixel level on the ArrayJ

products.

ATTENTION!

Great care should be taken when disconnecting the

ArrayJ PCBs from the mating connectors, either on one

of the BOBs, or the user’s own boards.

The board should be gently levered up, working

progressively around the board to lever the PCB from

the connector a little on all sides, and then repeating the

process until the connectors are free from each other.

Note that a BGA ArrayJ cannot be removed from its EVB.

Use of Scintillators with the ArrayJ Products

Please consult the Tech Note on the use of scintillators

with the TSV arrays, which can be downloaded here.

ArrayJ

USER MANUAL

CONTENTS

ArrayJ Inputs and Outputs (I/O) ........................................................................................................................................................ 1

ATTENTION! .................................................................................................................................................................................... 1

ArrayJ-60035-64P-PCB (8 x 8 Array of 6 mm Pixels) ........................................................................................................................ 3

ArrayJ-60035-64P Board Drawing ............................................................................................................................................ 3

Connector Schematic for the ArrayJ-60035-64P-PCB .............................................................................................................. 4

Connector Pin-Outs for the ArrayJ-60035-64P-PCB ................................................................................................................. 5

ArrayX-BOB6-64P (Breakout Board for the ArrayJ-60035-64P) ............................................................................................... 6

Header Signals on the ArrayX-BOB6-64P .................................................................................................................................. 7

ArrayX-BOB6-64S (Summed Breakout Board for the ArrayJ-60035-64P) ................................................................................. 8

Header Signals on the ArrayX-BOB6-64S .................................................................................................................................. 9

ArrayJ-60035-4P-BGA (2 x 2 Array of 6 mm Pixels) .......................................................................................................................... 10

ArrayJ-60035-4P-BGA Board Dimensions and Pin Location ..................................................................................................... 10

BGA Connections for the ArrayJ-60035-4P-BGA ...................................................................................................................... 11

ArrayJ-60035-4P-BGA - Solder Footprint and Reow Solder Prole .......................................................................................... 11

ArrayJ-60035-4P-PCB (ArrayJ-60035-4P-BGA Evaluation Board) ........................................................................................... 12

ArrayJ-60035-4P-PCB Pin-Outs ............................................................................................................................................... 12

ArrayJ-60035-4P-PCB Board Dimensions and Pin Locations .................................................................................................... 12

ArrayJ-40035-64P-PCB (8 X 8 Array of 4 mm Pixels)........................................................................................................................ 13

ArrayJ-40035-64P Breakout Board ........................................................................................................................................... 13

ArrayJ-40035-64P-PCB Board Drawing .................................................................................................................................... 13

Connector Schematics for the ArrayJ-40035-64P ..................................................................................................................... 14

Connector Pin-Outs for the ArrayJ-40035-64P .......................................................................................................................... 15

ArrayJ-300XX-16P-PCB (4 x 4 Array of 3 mm Pixels) ........................................................................................................................ 16

ArrayJ-300XX-16P-PCB Board Drawing .................................................................................................................................... 16

Connector Schematic for the ArrayJ-300XX-16P-PCB .............................................................................................................. 17

Connector Pin-Outs for the ArrayJ-300XX-16P-PCB ................................................................................................................. 17

ArrayJ-BOB3-16P (ArrayJ-300XX-16P Breakout Board) ............................................................................................................ 18

Header Signals for the ArrayX-BOB3-16P ................................................................................................................................. 19

ArrayJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) ....................................................................................................................... 20

ArrayJ-300XX-64P-PCB Board Drawing .................................................................................................................................... 20

Connector Schematics for the ArrayJ-300XX-64P ..................................................................................................................... 21

Connector Pin-Outs for the ArrayJ-300XX-64P .......................................................................................................................... 22

ArrayJ-BOB3-64P (ArrayJ-300XX-64P & ArrayJ-40035-64P Breakout Board) ........................................................................... 23

Header Signals for the ArrayJ-BOB3-64P .................................................................................................................................. 24

Biasing and Readout from the Standard Breakout Boards ............................................................................................................... 25

SMA Connector ........................................................................................................................................................................ 25

Balun Transformer ..................................................................................................................................................................... 25

EMI Considerations ................................................................................................................................................................... 26

Appendix A - Example of Using the Breakout Board to readout Fast signals ..................................................................................... 27

Appendix B - Example of Using the Breakout Board to readout Standard signals ............................................................................. 28

Appendix C - Example of Using the Summed Breakout Board ......................................................................................................... 29

Ordering Information ......................................................................................................................................................................... 30

ArrayJ

USER MANUAL

ARRAYJ-60035-64P-PCB (8 X 8ARRAY OF 6 MM PIXELS)

Array Size Sensor

type Readout Board Size Pixel Pitch No. Connections No. Connectors

8 x 8 60035 Pixel 50.44 x 50.44 mm26.33 mm 160 2 x 80-way

The ArrayJ-60035-64P is comprised of 64 individual 6mm J-Series sensors arranged in a 8

x 8 array.

The performance of the individual pixels and details of the bias to apply can be found in the

J-Series datasheet.

The connections to each array are provided by two Samtec 80-way connectors, type QTE-

040-03-F-D-A. These connectors mate with the Samtec QSE-040-01-F-D-A board-to-board

connector and the Samtec EQCD High Speed Cable Assemblies. The 64 SiPM pixels all have

substrate connections (cathode) summed to form a common I/O. The 80-way connectors

provide connections as follows:

• 64 x fast output

• 64 x standard I/O

• 32 x common I/O

• 16 x shield contacts to the Common

ARRAYJ-60035-64P BOARD DRAWING

The complete ArrayJ-60035-64P-PCB CAD is available to download.

ArrayJ

USER MANUAL

CONNECTOR SCHEMATIC FOR THE ARRAYJ-60035-64P-PCB

Figure 2, Connector schematic for the ArrayJ-60035-64P

The connector location and array pixel numbering is indicated on the array schematics on the previous page.

ArrayJ

USER MANUAL

CONNECTOR PIN-OUTS FOR THE ARRAYJ-60035-64P-PCB

J1 J2

PIN SIGNAL PIN SIGNAL PIN SIGNAL PIN SIGNAL

1S17 2S1 1S49 2S33

3F17 4F1 3F49 4F33

5S25 6S9 5S57 6S41

7F25 8F9 7F57 8F41

9S18 10 S2 9S50 10 S34

11 F18 12 F2 11 F50 12 F34

13 S26 14 S10 13 S58 14 S42

15 F26 16 F10 15 F58 16 F42

17 S19 18 S3 17 S51 18 S35

19 F19 20 F3 19 F51 20 F35

21 S27 22 S11 21 S59 22 S43

23 F27 24 F11 23 F59 24 F43

25 S20 26 S4 25 S52 26 S36

27 F20 28 F4 27 F52 28 F36

29 S28 30 S12 29 S60 30 S44

31 F28 32 F12 31 F60 32 F44

33 CM 34 CM 33 CM 34 CM

35 CM 36 CM 35 CM 36 CM

37 CM 38 CM 37 CM 38 CM

39 CM 40 CM 39 CM 40 CM

41 S21 42 S5 41 S53 42 S37

43 F21 44 F5 43 F53 44 F37

45 S29 46 S13 45 S61 46 S45

47 F29 48 F13 47 F61 48 F45

49 S22 50 S6 49 S54 50 S38

51 F22 52 F6 51 F54 52 F38

53 S30 54 S14 53 S62 54 S46

55 F30 56 F14 55 F62 56 F46

57 S23 58 S7 57 S55 58 S39

59 F23 60 F7 59 F55 60 F39

61 S31 62 S15 61 S63 62 S47

63 F31 64 F15 63 F63 64 F47

65 S24 66 S8 65 S56 66 S40

67 F24 68 F8 67 F56 68 F40

69 S32 70 S16 69 S64 70 S48

71 F32 72 F16 71 F64 72 F48

73 CM 74 CM 73 CM 74 CM

75 CM 76 CM 75 CM 76 CM

77 CM 78 CM 77 CM 78 CM

79 CM 80 CM 79 CM 80 CM

CM Common I/O

Sn Standard I/O of pixel n

Fn Fast output of pixel n

ArrayJ

USER MANUAL

ARRAYX-BOB6-64P (BREAKOUT BOARD FOR THE ARRAYJ-60035-64P)

The ArrayX-BOB6-64P is an evaluation board allowing easy access

to all the signals of a SensL ArrayJ-60035-64P, 6 mm 8 x 8 TSV

SiPM array.

The Breakout Board features two Samtec 80-way connectors, type

QSE-040-01-F-D-A. These connectors mate with the Samtec QTE-

040-03-F-D-A board-to-board connector on the array. Since the

connectors are keyed, orientating the array on the BOB is straight-

forward.

All signals on the array are routed via the mating connectors to head-

er pins. These pins are formed of four 50-way (25 x 2 row) 2.54 mm

pitch headers; J3, J4, J5 and J6. Each of the four headers also has

8 pins left unconnected to allow prototyping for evaluation purposes.

The three SMA connectors on the board can be connected via the

supplied jumper cable to any of the array header pins and used for

accessing signals or suppling bias voltage. Four 7 mm holes are

aligned on a 25 mm grid to allow mounting of the board on an opti-

cal breadboard.

See Appendices A and B for examples of Breakout Board usage.

Figure 3, Layout of the ArrayX-BOB6-64P. The dimensions of the board are 112mm x 112mm.

ArrayJ

USER MANUAL

Pin J3 J4 J5 J6

12NC NC NC NC NC NC NC NC

3 4 NC NC NC NC NC NC NC NC

5 6 CM CM CM CM CM CM CM CM

78CM CM CM CM CM CM CM CM

9 10 F1 S1 F49 S49 F17 S17 F21 S21

11 12 F9 S9 F57 S57 F25 S25 F29 S29

13 14 F2 S2 F50 S50 F18 S18 F22 S22

15 16 F10 S10 F58 S58 F26 S26 F30 S30

17 18 F3 S3 F51 S51 F19 S19 F23 S23

19 20 F11 S11 F59 S59 F27 S27 F31 S31

21 22 F4 S4 F52 S52 F20 S20 F24 S24

23 24 F12 S12 F60 S60 F28 S28 F32 S32

25 26 CM CM CM CM CM CM CM CM

27 28 F5 S5 F53 S53 F33 S33 F37 S37

29 30 F13 S13 F61 S61 F41 S41 F45 S45

31 32 F6 S6 F54 S54 F34 S34 F38 S38

33 34 F14 S14 F62 S62 F42 S42 F46 S46

35 36 F7 S7 F55 S55 F35 S35 F39 S39

37 38 F15 S15 F63 S63 F43 S43 F47 S47

39 40 F8 S8 F56 S56 F36 S36 F40 S40

41 42 F16 S16 F64 S64 F44 S44 F48 S48

43 44 CM CM CM CM CM CM CM CM

45 46 CM CM CM CM CM CM CM CM

47 48 NC NC NC NC NC NC NC NC

49 50 NC NC NC NC NC NC NC NC

HEADER SIGNALS ON THE ARRAYX-BOB6-64P

NC Not Connected

CM Common I/O

Sn Standard I/O of pixel n

Fn Fast output of pixel n

ArrayJ

USER MANUAL

ARRAYX-BOB6-64S (SUMMED BREAKOUT BOARD FOR THE ARRAYJ-60035-64P)

The ArrayX-BOB6-64S is an evaluation board allowing easy access to the sum of all of standard pixel signals of a SensL ArrayJ-

60035-64P, 6 mm 8 x 8 TSV array, in addition to all of the individual fast output signals. The Breakout Board features two

Samtec 80-way connectors, type QSE-040-01-F-D-A. These connectors mate with the Samtec QTE-040-03-F-D-A board-to-

board connector on the array. Since the connectors are keyed, orientating the array on the BOB is straightforward. A schematic

of the board is shown in Figure 4 below.

Fast signals: All of the fast output signals (Fn) from the array are routed via the mating connectors to header pins. These pins are

formed of four 50-way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and J6. Each of the four headers also has 10 pins that

connect to the common cathode (CM) and 8 pins left unconnected (NC) to allow prototyping for evaluation purposes.

Two SMA connectors and Balun transformers are provided with 4-pin headers to allow any fast signal to be connected directly

to the SMA or via the transformer using jumper wires.

Summed output: A summed output (the anodes of pixels 1 to 64 connected together) is routed to jumper pins (SM) in close

proximity to a third SMA connector. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical

breadboard.

See Appendix C for an example of the use of the summed BOB.

Figure 4, Layout of the ArrayX-BOB6-64S. The dimensions of the board are 112 mm x 112 mm.

ArrayJ

USER MANUAL

Pin J3 J4 J5 J6

12CM CM CM CM CM CM CM CM

3 4 CM CM CM CM CM CM CM CM

5 6 NC NC NC NC NC NC NC NC

78NC NC NC NC NC NC NC NC

9 10 F1 F1 F49 F49 F17 F17 F21 F21

11 12 F9 F9 F57 F57 F25 F25 F29 F29

13 14 F2 F2 F50 F50 F18 F18 F22 F22

15 16 F10 F10 F58 F58 F26 F26 F30 F30

17 18 F3 F3 F51 F51 F19 F19 F23 F23

19 20 F11 F11 F59 F59 F27 F27 F31 F31

21 22 F4 F4 F52 F52 F20 F20 F24 F24

23 24 F12 F12 F60 F60 F28 F28 F32 F32

25 26 CM CM CM CM CM CM CM CM

27 28 F5 F5 F53 F53 F33 F33 F37 F37

29 30 F13 F13 F61 F61 F41 F41 F45 F45

31 32 F6 F6 F54 F54 F34 F34 F38 F38

33 34 F14 F14 F62 F62 F42 F42 F46 F46

35 36 F7 F7 F55 F55 F35 F35 F39 F39

37 38 F15 F15 F63 F63 F43 F43 F47 F47

39 40 F8 F8 F56 F56 F36 F36 F40 F40

41 42 F16 F16 F64 F64 F44 F44 F48 F48

43 44 NC NC NC NC NC NC NC NC

45 46 NC NC NC NC NC NC NC NC

47 48 CM CM CM CM CM CM CM CM

49 50 CM CM CM CM CM CM CM CM

HEADER SIGNALS ON THE ARRAYX-BOB6-64S

NC Not Connected

CM Common cathode I/O

Fn Fast output of pixel n

ArrayJ

USER MANUAL

ARRAYJ-60035-4P-BGA (2 X 2ARRAY OF 6 MM PIXELS)

Array Size Sensor

type Readout Board Size Pixel Pitch No. Connections No. Connectors

2 x 2 60035 Pixel 12.46 x 12.46 mm26.33 mm 9 3 x 3 BGA

The ArrayJ-60035-4P is comprised of 4 individual 6 mm J-Series sensors arranged

in a 2 x 2 array.

The performance of the individual pixels and details of the bias to apply can be found

in the J-Series datasheet.

Connections to each sensor are provided by a BGA (ball grid array). The BGA can be

reow soldered onto the user’s own readout board.

The 4 SiPM sensors have all substrate connections (cathodes) connected together

to form a common I/O. The 3 x 3 BGA provides connections as follows:

• 4 x standard I/O

• 5 x common I/O

• There is NO fast output

ARRAYJ-60035-4P-BGA BOARD DIMENSIONS AND PIN LOCATION

The complete ArrayJ-60035-4P-BGA CAD and solder footrprint is available to download.

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