Seagate ST212 Manuel utilisateur

ST212

PRODUCT

MANUAL

March 24,

1986©

36010-001, Revision B

Seagate reserves theright to change, without notice,

the specifications contained in this manual.

Seagate •920 Dise Drive, Seotts Valley,

95066-4544,

USA

Tel. (408) 438-6550 •Telex 176455 SEAGATE

SCVL

TABLE

CONTENTS 1.0 SPECIFICATION

SUMMARY..................................

1.1

Performance

Specifications..........

..........................

1.1.1

Access Time Definition and Timing 1

1.2

Functional Specifications. .....................................

1.3

Physical Specifications 1

1.4

Reliability

Specifications.....................

.. . . . . . . . . . . . . . . .

1.4.1

Read Error Rates 1

1.4.1.1

Bit

Jitter............................

.................

1.4.2

Media Defects 2

1.5

Environmental Specifications 2

1.5.1

Ambient Temperature 2

1.5.2 Temperature Gradient 2

1.5.3

Relative Humidity 2

1.5.4 Altitude Limits 2

1.5.5

Operating

Shock............................................

1.5.6 Nonoperating

Shock........................................

1.6

DC Power Requirements 3

1.6.1

Input Noise Ripple 3

1.6.2 Input Noise Frequency. ...................................

1.7

Mounting Requirements 4

1.7.1

Handling and Static-Discharge Precautions. ..................

2.0

ST212 HOST/DRIVE INTERFACE 6

2.1

Control/Status SignaIs: PCB Edge-Connector JI .................

2.2

Data

Signals:PCB

Edge-Connector

J2..

. . . . . . . . . . . . . . . . . . . . . . .

2.3

DC Power: Connector J3

2.4 Frame Grounding: Lug

JI0

3.0 DRIVE CONFIGURATION

3.1

Drive Configuration: Shunt J9 (MLC-Ol)

3.2 Drive Select

3.2.1

Daisy-chain

3.3

Radial

3.4 Write Fault

3.5

Life

Test

4.0 CONTROL

INPUT

SIGNAIS

4.1

Head Select

2°,

,22,23

••••••••••••••••••••••••••••••••••••••••

4.2 Write Gate

4.3

Step

4.3.1

Buffered Seek

4.3.2 Slow-step (Single-track)

4.3.3 Auto-truncation

4.4 Direction In

4.5

Drive Select

S.O

CONTROL OUTPUT SIGNALS 18

5.1

Drive Selected

5.2 Index

5.3

Track 0

5.4 Ready

5.5

Seek Complete

5.6 Write Fault

5.6.1

Write Fault Signal Generation

5.6.1.1

Write Current Interruption ,20

5.7

Fault Detection:

Board 20292-XXX 20

5.7.1

Voltage and Head Select Comparator 20

5.7.2 Write Fault Reset 20

5.8

Fault Detection:

Board 20243-XXX

5.8.1

Voltage Comparator

5.8.2 Head Select Comparators

6.0 READ/WRITE OPERATIONS

6.1

Write Operation: PC Board 20292-XXX 22

6.1.1

MFM Write

Data

'22

Table

Contents iii

6.1.2

Write Gate

6.1.3

Write DataProcessing

6.1.4

Precompensation

6.2 Write Operation:

Board 20243-XXX

6.2.1

Write Gate '

6.2.2 Line Receiver

6.3

Formatting

6.4 Read Operation: PC Board 20292-XXX

6.4.1

MFM Read Data '

6.4.2 Head Select

6.4.3 LSI Preamp

6.4.4 Low Pass Filter

6.4.5 Read Data Conversion

6.5

Read Operation:

Board 20243-XXX

6.5.1

Head Select

6.5.2 LSI Preamp

6.5.3 Low Pass Filter

6.5.4 Phase Shifter

6.5.5 Zero Cross Detector

6.5.6 Time Domain Filter

6.5.7 Line Driver

7.0 MICROPROCESSOR

7.1

MPU:

Board 20292-XXX

...........................•........

7.2 MPU:

Board 20243-XXX

8.0

MOfOR

SPEED CONTROL

8.1

Motor Speed Control:

Board 20292-XXX

8.1.1

Hall Effect Transducer

8.1.2

Spindle Motor Control LSI

8.2 Motor Speed Control

Board: 20249-XXX

8.2.1

Hall Effect Transducer

8.2.2 Speed Reference Circuit

8.2.3 Pulse Shaper

8.2.4 Integrator

8.2.5 Current Limit

8.2.6 Microprocessor: Motor On

8.2.7 Motor Drivers

8.2.8 Dynamic Brake

9.0 FIELD SERVICE '

9.1

Test

Point Data: PC Board 20292-XXX

9.1.1

DifferentiaI Read Filter:

Test

Points 1and 2

9.1.2

Track 0Sensor: IC

3B,

Pin 134

9.1.3

Index Sensor:

Test

Point 9

9.2

Test

Point Data: PC Board 20243-XXX

9.2.1

DifferentiaI Read Filter:

Test

Points 1and 2

9.2.2 Read Data:

Test

Points 3and 4

9.2.3 Track 0:

Test

Point

5.-

9.2.4 Index Sensor:

Test

Point 6

9.3 Field Accessible Components

9.3.1

Main Control

Board

9.3.2 Motor Control

Board Removal

(MLC-OO

only)

9.3.3 Index Sensor Removal

9.3.4 Installing the Optional Full-height Front Panel

9.3.5 Track 0Sensor Removal

Schematics

PCB 20243-XXX

.......................•.....

PCB 20249-XXX

PCB 20292-XXX '

Table

Contents

FIGURES

FIGURE

Typical +12

Volt

DC Start-up Current Profile 3

FIGURE

Mounting Dimensions : 4

FIGURE

JI Connector Dimensions. ...........................

FIGURE

Control/Status SignaIs. ..............................

FIGURE

J2 Connector Dimensions. ...........................

FIGURE

Data SignaIs 9

FIGURE

Host/Drive Interface and Drive Configuration

FIGURE

Daisy-chain Configuration

FIGURE

Radial Configuration

FIGURE

10:

Control SignaIs Driver/Receiver Combination

FIGURE

Read/Write Timing

FIGURE

General Step Timing

FIGURE

13:

Slow-step Timing

FIGURE

14:

Auto-truncation Timing

FIGURE

15:

Drive Select

FIGURE

16:

Typical Power-up Sequence

FIGURE

1'7:

Fault Detection PC Board 20292-XXX 20

FIGURE

18:

Fault Detection PC Board 20243-XXX

FIGURE

19:

Data Signal Driver/Receiver Combination

FIGURE

20:

Write Operation

Board 20292-XXX

FIGURE

21:

Write Operation

Board 20243-XXX 24

FIGURE

22:

17-Sector, 512-Byte/Sector Format Example

FIGURE

23:

Read Operation

Board 20292-XXX 26

FIGURE

24:

Read Operation

Board 20243-XXX

FIGURE

25:

MPU: PC Board 20292-XXX 29

FIGURE

26:

MPU:

Board 20243-XXX 30

FIGURE

27:

Motor Speed Control:

Board 20292-XXX

FIGURE

28:

Motor Speed Control:

Board 20249-XXX

FIGURE

29:

Test

Point Locations

Board 20292-XXX

FIGURE

30:

DifferentiaI Read Filter

FIGURE

31:

Index Sensor 34

FIGURE

32:

Test

Point Locations

Board 20243-XXX

FIGURE

33:

Read Data

FIGURE

34:

ST212

PC Board Removal

FIGURE

35:

Index Sensor Adjustment/Removal

FIGURE

36:

Track "Sens

Removal

TABLES

TABLE

JI Host/Drive Pin Assignments. ........................

TABLE

J2 Host/Drive Pin Assignments. ........................

TABLE

Precompensation Pattern

ST212

PRODUCT

MANUAL/Rev. B.v

PERFORMANCE SPECIFICATIONS

1.0

SPECIFICATION

SUMMARY

CAPACITY

Per

Drive:

Per

Surface:

Per

Track:

Per

Sector:

Sectors

Per

Track:

UNFORMATTED

12.76

6.38

10,416 Bytes

FORMATTED

10.0

5.0

8,192 Bytes

256 Bytes

32 Sectors

1.1

ACCESS TIME DEFINITION AND TIMING 1.1.1

23.0 msec. max.

65.0 msec. max!

170.0 msec.

Access

time

is defined as

the

time

from

the

leading edge

the

last

Step pulse

received

SEEK

COMPLETE

(including settling).

The

Step pulse

period

must

between 5

p,sec.

500 p,sec.

Track-to-Track:

Average:

Maximum:

FUNCTIONAL SPECIFICATIONS

1.2

Rotational

Speed:

Average Latency:

Recording Density:

Track Density:

Cylinders:

Tracks:

Discs:

Recording

Method:

Data

Transfer Rate:

3,600

RPM

1070

8.33 msec.

10,560

BPI/FCI

550

TPI

306

1,224

MFM

5.0

Megabits/second

PHYSICAL SPECIFICATIONS 1.3

Height:

Width:

Depth:

Weight:

1.63 inches max. (41.4

mm)

5.75 inches max. (146.05

mm)

8.00 inches max. (203.2

mm)

3.00 lbs (1.4 Kg)

RELIABILITY SPECIFICATIONS 1.4

MTBF:

PM:

MTTR:

Service Life:

11,000 Power-on

Hours

Not

Required

30 Minutes

5Years

READ ERROR RATES

Recoverable Read Errors:

Nonrecoverable Read Errors:

Seek Errors:

per

1010

bits

read

per

bits

read

per

6seeks

1.4.1

Buffered-Seek

Typical usage

sea level. Calculated per Mil. Spec.

217.

Recoverable within

retries

Not recoverable within

retries

ST212

PRODUCT

MANUAL/Rev.

1.4.1.1 BIT-JITTER

Bit jitter reduction determines the relationship between theleading edge

Read

data

and the center

the data window.

The specified Read error rates are based

the following bit jitter specifica-

tion: The

data

separator must provide

least -40 dB

bit jitter reduction-

2F with

offset error

less than

1.5

nsec. shift from the center

the data

window.

1.4.2 MEDIA DEFECTS

Amedia defect

aRead error when data, which has been correctly written,

cannot be recovered within

retries.

Aprintout will be provided with each drive shipped-listing the location

any

defect by head, cylinder, sector and byte.5It will also specify the number

bytes

from Index.

There will be no more

than

four

(4)

defects per Read/Write head for amaxi-

mum

total

sixteen

(16)

per drive. Cylinder Zero will be free

defects.

1.5

1.5.1

Operating:

Nonoperating:

1.5.2

Operating:

Nonoperating:

1.5.3

Operating:

Maximum

Wet

Bulb:

Nonoperating:

1.5.4

Operating:

Nonoperating:

1.5.5

ENVIRONMENTAL SPECIFICATIONS

AMBlENT TEMPERATURE

(50

113

OF)

-40°C to 60°C (-40°F to 140°F)

TEMPERATURE GRADIENT

10°C/hr (18°F/hr) max.

Below condensation

RELATIVE HUMIDITY

8to

80070

noncondensing

(78.8

OF)

5to

95070

noncondensing

ALTITUDE LIMITS

-1,000

ft to 10,000 ft

-1,000

30,000

OPERATING SHOCK

Maximum permitted shock without incurring nonrecoverable errors:

O's

6.7

1.5.6 NONOPERATING SHOCK

Maximum permitted shock without incurring physical damage

degradation

in performance: 40

0'S8

Based

a32-sector,

256

byte/sector format

msec.

-half-sine

wave

shock pulse.

Input

levels

the drive mounting

screws,

drive mounted in an approved orientation.

msec., half sine-wave

2ST212

PRODUCT

MANUAL/Rev.

OC POWER REQUIREMENTS 1.6

The

ST212

listed in accordance with UL

478

and CSA C22.2 (0-MI982), and

meets

aIl

applicable sections

IEC 380

and

VDE 0806/08.81, as tested by TUV-

Rheinland, North America.

Power may be applied or removed in any sequence without loss

data

damage

to the drive.

+12

VDC

Voltage Tolerance (inc. ripple):

Maximum Current

Power-on:

5070

Both seek and non-

seek conditions

3.2 Amp

1.0

Amp typical

VDC:

Voltage Tolerance (inc. ripple):

Maximum Current

Power-on:

POWER:

5070

Both seek and non-

seek conditions

1.2

Amp

1.0

Amp typical

Watts typical

INPUT NOISE RIPPLE

1.&.1

The maximum permitted ripple

(peak-to-peak)

either +

Volts

Volts.

INPUT NOISE FREQUENCY

MHz

max.

both

the +

VDC

and

+ 5 VDC

Hnes.

1.&.2

AMPS

r------~-----...,...-----~

4.0

t---------+------4-------I

3.5

3.2~---llIo....

3.0

2.5

2.0

t---------+------4-~-----I

0.0 ..... ---"'

.......

1.5

1.0

FIGURE

Typical

+12Volt OC

Start-up Current

Profile

SECONDS

ST212

PRODUCT

MANUAL/Rev. B3

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