SD Systems ExpandoRAM II Manuel utilisateur

#7140042

ExpandoRAM

OPERATIO 5MANUAL

P.O. Box 28810,

Dallas,

Texas 75228

•

OPERATIONS

MANUAL

EXPANDORAM II

EXPANDABLE RANDOM ACCESS

MEMORY

SYSTEMS

REVISION C

MARCH

1981

•

LllUTED

WARRANTY

All

Systems

products

assembled

personnel

and

functionally

tested

our

facility

are

warranted

for

period

ninety

(90)

days

fram

date

purchase

free

fram

defects

material

and

workman-

ship.

Kits

other

products

functionally

unfinished

semi-finished

the

time

shipment

fram

our

facility

are

warranted

for

the

same

period

regard

material

defects

only

with

warranty

expressed

implied,

covering

v..DrJ<manship

others.

Should

Systems

pro-

duct

fail

perfonn

specifications,

obtain

Returned

Material

Authorization

number

from

your

dealer

fran

Systems.

Include

this

mlllmr

all

correspondence

and

with

the

returned

product.

Ship

the

it~

prepaid

Systems

and

will,

our

option,

repaired

replaced

free

charge,

provided

the

unit

received

during

the

warranty

period.

Testing

repair

v..Drk

perfo:rr.leC1

upon

returned

kits

other

products

assembled.

wholly

partially

others

will

sub-

ject

$35.00

minimum

service

charge

unless

such

products

are

found

non-functional

due

defects

material

purchased

from

Systems.

order

validate

this

warranty,

the

enclosed

warranty

card

Itn.lst

returned

Systems.

warranty

card

file

the

time

product

return,

dated

proof

purchase

will

required.

This

warranty

invalid

product

has

been

misused

modified.

~7ar

ranty

limited

replacement

defective

parts

and

resronsibiIi

assumed

for

damage

other

equipment.

THERE ARE NO UNDERSTANDINGS, AGREEMENTS, REPRESENTA-

TIONS, OR WARRANTIES, EXPRESSED

IMPLIED, INCLUDING ANY

R,EGARDING FITNESS FOR A

PARTICUL~R

PURPOSE, NOT SPECIFIED

IN THE WARRANTY.

.."

·-.:~;t:

,{.~:

.·1

......

,.lo,'

.~.

-'.:;'.:

;

~·~r.~

•

TABLE

CONTENTS

SECTION

DESCRIPTION

PAGE

INTRODUCTION

1-1

GENERAL

DESCRIPTION

1-2

PHYSICAL

FUNCTIONAL

DESCRIPTION

CONSTRUCTION

3-1

ASSEMBLY

PROCEDURE

3-2

CHECK

OUT

PROCEDURE

UTI

4-1

16K

64K

DEVICE

SELECTION

JUMPERS

4-2

ROt~

INFO

Rr~A

4-3

SWITCH

SETTINGS

11,

4-4

USING

THE

EXPANDORAM

NON-

SYSTEt~S

ENVIRONf'lENTS

12,

APPENDICES

MEMORY

DIAGNOSTIC

SOFTWARE

LISTING

EXPANDORAM

TIMING

DIAGRAM

EXPANDORM1

ASSEf'lBLY

DRAWING

EXPANDORAM

SCHEMATIC

EXPANDORAM

PARTS

LIST

•

SECTION

1-0

INTRODUCTION

The

EXPANDORAM

board

provides

low

cost

means

for

expanding

Random

Access

Memory

capability

for

computers

utilizing

the

S-lOO

bus

structure.

The

EXPANDORAM

IllS

optimized

for

operation

with

Systems'

SHC-lOO

/200.

The

EXPANDOR..AM

uses

the

Z-

refresh

signal

and

Kill

operate

MHZ

sufficiently

fast

rams

are

used.

1-1

GENERAL

DESCRIPTION

The

EXPANDORAM

board

high

performance

dynamic

RAM

board

llsing

state-of-the-art

MOS

dynamic

memory

devices.

The

EXPANDORAM

may

configured

have

amemory

capacity

16K,

32K, 48K,

64K

bytes

memory

using

the

4116

(16,384Xl

MOS

dynamic

RAM)

64K,

l28K,

192K,

256K

bytes

memory

using

the

~lK4l64

l65,536Xl

MOS

dynamic

RAM)

memories.

Other

notable

features

the

EXPANDORAM

board

include:

(1)

Phantom

output

disable

manual

switch

selectable

output

disable.

(2)

Typical

power

dissipation

watts

(3)

MHZ

operat

ion

(4)

Port

Addressable

board

select

for

multi-user

system

(5)

With

4164'50, 4-64K

banks

are

available

PAGE

1-2

PHYSICAL

The

EXPANDORAM

board

implemented

single

5.25"

10.0"

0.65"

Printed

Circuit

board.

The

board

requires

three

voltages

levels

+7V

+lOV,

+14V

+18V,

and

-14V

-18V. The

EXPANDORAM

board

interfaced

the

system

connector

J-l.

Table

1-1

lists

the

overall

specifications

for

the

EXPANDO~~M

board.

TABLE

1-1

SPECIFICATIONS

•

Memory

Capacity

Memory

Access

Memory

Cycle

Interface

Levels

Power (2

memory

cycle)

Physical

Dimensions

Operating

Temperature

65,536

bytes

(16K

RAM)

262,144

bytes

(64K

RAM)

200

max.

375

min.

TTL

Compatible

+7V

+lOV @

400mA

(max)

+14V

+2-V @

200mA

(max)

-14V

-20V @

30mA

(max)

5.25"

10.0"

.65"

degree

PAGE

2•

•

PIN #

79,80,81,

,30,20,

84,34,37,

.'-;7,3'-),8:),

i\CJ,:52

()

,:; 5 , 0R,

89,:58,39,

40,90

~)5,94,41,

,91,92,

5,43

100,50

•

SIGNAL

NAME

+8V

10V

+14V

20V

-14V

-20V

WAIT

AO-A7

A8-A15

DO-O

DO-7

DI-O

DI-7

SMI

MH1R

RFSH

MEMW

PRDY

PDBIN

GROUND

SOUT

POC

PHANTOM

TABU:

1-2

CONNECTOR

.11

OUT

FOR

32K/64K

EXPANDORAM

DIRECTION

Input

Output

Input

Output

Input

PACE

DESCRIPTION

Power

Phase

clock

Wait

Address

bus

bits

Address

bus

bits

8-15

Data

bus

Data

bus

out

Machine

cycle

one

Memory

read

Refresh

(Z80

CPU

card)

Memory

write

Ready

Data

bus

Port

Output

Power

Clear

Phantom

Disable

(See

Section

for

details

Prons).

SECTION

2-0

FUNCTIONAL

DESCRIPTION

The

major

functions

the

EXPfu~DORAM

board

are

shown

figure

2-1.

The

following

functions

make up

the

memory

interface:

memory

array,

memory

decode

and

control,

address

multiplexer,

and

data

buffer.

Memory

Array

-The memory

array

consists

(16K

64K)

dynamic

random

access

memory

elements.

Each

16K

has

16,384

x 1

bit

capacity,

while

the

64K

has

65,536

x 1

bit

capacity.

The

o..6K

64K)

RAMS

are

organized

into

four

banks

eight

RAMS

each.

The

eight

RAMS

each

contribute

one

bit

addressable

location.

The

total

storage

capacity

the

EXPANDORAM

64,536

262,144

bytes,

depending

the

type

memory

device

used

(16K

64K).

Memory

Decode

and

Control

-The memory

decode

and

control

section

responsible

for

generating

the

timing

signals

for

the

memory

array,

address

multiplexer,

and

data

buffer.

Timing

within

the

memory

decode

and

control

section

generated

by a

TTL

compatible

delay

line.

82Sl30

PROM

used

select

the

proper

banks

according

the

address

lines,

board

select

switches,

and

the

board

select

latch.

PAGE

•

Address

Multiplexer

-The

address

multiplexer

responsibile

for

taking

the

address

bits

from

the

address

bus

buffers

and

multi-

plexing

the

proper

row

and

column

address

into

the

memory

array

under

control

the

memory

decode

and

control

section.

Data

Buffers

-The

data

buffers,

controlled

the

memory

decode

and

control

section,

isolate

the

memory

array

from

the

data

bus.

Port

Board

Select

-The

port

board

select

decodes

port

and

latches

the

output

data

the

board.

MEMORY

ARRAY

001-007

RA"5CASWtm

AO-A7

0-01

8888

PAGE PORT

I--

COMPARE

SELECT

ADDRESS

(PAGE)

SWITCH

DECODE

I--

UPPER

CONTROL

COUNTER

PAGE

ADDRESS

I--

BUFFER ADDRESS

BUFFER

SELECT

MUlTIPLEX

t--

PORT

Lrl 1IiI

L-..

1 I

DATA

CONTROL

REFRESH

LOWER

DATA

OUT

BUFFER

COUNTER

ADDRESS BUFFER

BUFFER BUFFER

88888

EXPANDORA~

BLOCK

DIAGRAM

•

Figure

2-1

PAGE

:-;ECTION

~-n

CONSTRUCTION

The

EXPANDORA~1

hoard

kit

intended

for

those

persons

who

have

had

some

prior

experience

with

kit

huilding

and

digital

electronics.

you

not

fall

into

this

category,

highly

recommended

that

you

find

experienced

person

help

you

assemble

and

check

out

the

board.

Appendix

Eshows

the

parts

list

for

the

EXPANDORAM

board.

Double

check

all

parts

against

the

parts

list.

3-1

ASSEMBLY

PROCEDURE

(1)

Install

and

solder

the

sockets

their

proper

locations

follows:

( )

l4-Pin

Ul,U3-U7,U9,UlO,U12,U17-UI9,U2l,U22,US8

( )

l6-Pin

U8,Ull,U13,UlS,U16,U26-US7

( )

20-Pin

-U14,U20,U23-U25

NOTE:

sockets

for

DIP

switch

S3.

(2)

Install

and

solder

the

resistors

follows:

()

Rl,

Ohm

(Orange,

Orange,

Black)

()R2, R6,

Ohm

(Brown,

Black,

Red)

()

3.3K

Ohm

(Orange,

Orange,

Red)

()

ISO

Ohm

(Brown,

Green,

Brown)

()

10K

Ohm

(Brown,

Black,

Orange)

()

470

Ohm

(Yellow,

Violet,

Brown)

()

RIO

200

Ohm

(Red,

Black,

Brown)

()

Resistor

packs:

RPI

4, 510

SIP

3.3K

RP2

SIP

3.3K

NOTE:

each

SIP

designated

hy a

notch

dot

one

end

the

package.

PAGE

•

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