SanDisk SSD UATA 5000 1.8" Manuel utilisateur

Computerized

Analysis & Simulation Ltd.

Thermal Analysis

SSD UATA 5000 1.8”

with ZIF connector

"Flash Disk Module"

For:

SanDisk

October 2006

(Ref: w06e048b.doc)

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Analysis & Simulation Ltd.

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Table of contents

ABSTRACT

1 SCOPE................................................................................................................................4

2 APPLICABLE DOCUMENTS ..........................................................................................4

3 THE FLASH DISK DESCRIPTION .................................................................................4

3.1 THE FLASH DISK DESCRIPTION.............................................................................................................. 4

4 BOUNDARY CONDITION AND ASSUMPTIONS......................................................10

4.1 BOUNDARY CONDITION....................................................................................................................... 10

4.2 MATERIALS ......................................................................................................................................... 10

5 THE THERMAL MODEL............................................................................................... 11

5.1 CFD AND FINITE VOLUME MODEL ..................................................................................................... 11

5.2 THE THERMAL MODEL STRUCTURE .................................................................................................... 12

6 ANALYSIS RESULTS ....................................................................................................17

7 CONCLUSIONS ..............................................................................................................23

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Abstract

The document summarizes thermal analysis for the mSSD UATA 5000 1.8” CG with

ZIF connector - "Flash Disk Module"

The main aim is to check whether the current design meets thermal design requirements.

The analysis results are temperatures distribution figures and components case and

junction temperatures.

The analysis results shows that all the components checked, are below the maximum

allowable temperatures based on the thermal demand Twell=70 oC

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1Scope

The document summarized thermal analysis for the "Flash Disc module", based on the

customer design data.

It includes the base design data, description of the thermal model, the solution process

and graphical and numerical representation of the results (temperature distribution and

components case and junction temperatures).

2Applicable Documents

1. J. P. Holman ,Heat Transfer, McGraw Hill, 1989.

2. D. S. Steinberg, Cooling Techniques for Electronic Equipment, Wily Inter

Science, 1980.

3. Kraus A. D. and Bar-Cohen A., Thermal Analysis and Control of

Electronic Equipment, McGraw Hill, 1983.

4. Coolit user manual, DAAT Crop., 2005.

3The Flash Disk Description

3.1 The Flash Disk description

The Flash disk module is built from a plastic structure. At the 2 side mounted 2

PCBs : the Memory PCB and the CPU PCB.

The structure is covered by two stainless steel covers connected by 4 screws.

The "sandwich" structure contains thermal pad between the 2 PCBs and between

the Memory PCB and the cover.

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Table 3.1-1: Power dissipations

Component

Name

Designation

Number Quantity

Power

Total

Power

[W] [W]

1 Flash U5-U12, U105-U112

16 0.04 0.64

2 E3 U3 1 0.162 0.162

3 TI-transceiver U1-U4, U101-U104 8 0.0025 0.02

4 DC-DC U2 1 0.006 0.010

5 Oscillator Y1 1 0.018 0.018

TOTAL 0.850

Notes:

a. Flash, transceiver and E3 are working in 100% duty-cycle in high performance .

Figure 3.1-1: The general mechanical description – top side

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Figure 3.1-2: The general mechanical description – Bottom side

Figure 3.1-3: The Memory card (PS) from bottom side

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Figure 3.1-4: The CPU card ( CS) from bottom side

Figure 3.1-5: The CPU card pad from top side

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Figure 3.1-6: The CPU card (PS) from top side

Figure 3.1-7: The memory card CS and PS placement

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Figure 3.1-8: The CPU card CS and PS placement

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4Boundary Condition and Assumptions

4.1 Boundary condition

Boundary conditions:

•Temperature : Tw=70 oC (measured on the top-cover, at the

center.)

•Altitude : 3048m

4.2 Materials

•body - Plastic: K=0.29 W/m C

•Covers - stainless-steel K=37 W/m C

•Thermal Pad ( T-global H48-2) K=2 W/m C

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