Samsung GT-S7070 Manuel utilisateur

GSM TELEPHONE

GT-S7070

1. Safety Precautions

2. Specification

3. Product Function

4. Array course control

5. Exploded View and Parts list

6. MAIN Electrical Parts List

7. Block Diagrams

8. PCB Diagrams

9. Chart of Troubleshooting

10. Reference data

11. Disassembly and Assembly

Instructions

GSM TELEPHONE CONTENTS

This Service Manual is aproperty of Samsung Electronics Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable

International and/or domestic law.

Samsung Electronics Co.,Ltd.

2009. 12. Rev.1.0

ⓒ

Country Web Site

North America service.samsungportal.com

Latin America latin.samsungportal.com

CIS cis.samsungportal.com

Europe europe.samsungportal.com

China china.samsungportal.com

Asia asia.samsungportal.com

Mideast &Africa mea.samsungportal.com

GSPN (Global Service Partner Network)

SAMSUNG Proprietary-Contents may change without notice

11. Disassembly and Assembly Instructions

11-1

This Document can not be used without Samsung's authorization

※Caution

1) Be care of scratch and molding damage.

※Caution

1) Be care of scratch and molding damage.

※Caution

1) Be care of damage to TSP FPCB.

※Caution

1) Be care of damage to KEY FPCB..

1)Disassemble REAR screw 6points.

1) Disassemble the key FPCB from Front Rib.

2) Disassemble the TSP FPCB from connector.

3) Disassemble the Key and LCD connector.

1) Separate the REAR from the FRONT ass'y

(TOP →Right →Left →Bottom)

1) Separate the PBA from the FRONT ass'y

※Lift to 45 degrees direction.

11-1. Disassembly

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Disassembly and Assembly Instructions

11-2

This Document can not be used without Samsung's authorization

※Caution

1) Be care of damage to TSP FPCB.

※Caution

1) Be care of damage to LCD FPCB.

5 6

1)Separate the LCD Braket from the FRONT

ass'y (Right →Left )

1) Separate the LCD from the LCD Braket

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Disassembly and Assembly Instructions

11-3

This Document can not be used without Samsung's authorization

※Caution

1) Be care of scratch to TSP

2) Be care of damage to TSP FPCB.

※Caution

1) Be care of scratch to KEYPAD

※Caution

1) Be care of damage to the LCD FPCB.

※Caution

1) Be care of scratch and molding damage.

2) Be care of damage to the F-CPB.

1 2

3 4

1)Assemble the TSP on the FRONT 1)Assemble the KEYPAD on the FRONT

※Confirm whether hook was combine properly

1)Assemble the LCD module on the Bracket 1)Assemble the LCD Braket on the FRONT

11-2. Assembly

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Disassembly and Assembly Instructions

11-4

This Document can not be used without Samsung's authorization

※Caution

1) Be care of damage to KEY Connector FPCB.

※Caution

1) Be care of damage to FPCB.

2) Set and insert to insertion silky base line.

※Caution

1) Be care of damage to FPCB.

2) Set and attach to base line for attachment.

※Caution

1) Be care of scratch and molding damage.

5 6

7 8

1)Be inserted to diagonal line direction

so that key connector is located through

PCB groove.

1) assemble the key connector.

2) assemble the LCD connector.

3) assemble the TSP FPCB from connector.

1)Attach FPCB on FRONT RIB surface. 1)Assemble the REAR to the FRONT ass'y

(REAR TOP →Middle →Bottom)

2) Confirm hook conclusion status..

SAMSUNG Proprietary-Contents may change without notice

Disassembly and Assembly Instructions

11-5

This Document can not be used without Samsung's authorization

※Caution

1) Be care of scratch and molding damage.

2) Check the torque Spec. (1.2 Kgf.Cm)

91)Assemble REAR screw 6points.

SAMSUNG Proprietary-Contents may change without notice

10.Reference data

10-1

This Document can not be used without Samsung's authorization

Reference Abbreviate

―AAC:Advanced Audio Coding.

―AVC :Advanced Video Coding.

―BER :Bit Error Rate

―BPSK:Binary Phase Shift Keying

―CA :Conditional Access

―CDM :Code Division Multiplexing

―C/I :Carrier to Interference

―DMB :Digital Multimedia Broadcasting

―EN :European Standard

―ES :Elementary Stream

―ETSI:European Telecommunications Standards Institute

―MPEG:Moving Picture Experts Group

―PN :Pseudo-random Noise

―PS :Pilot Symbol

―QPSK:Quadrature Phase Shift Keying

―RS :Reed-Solomon

―SI :Service Information

―TDM :Time Division Multiplexing

―TS :Transport Stream

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3. Product Function

3-1

This Document can not be used without Samsung's authorization

Main Function

-101ｘ54.8 ｘ13.4 mm

-3Mega Pixel Camera

-2.8"16MQVGA TFT(C Type FULL TOUCH)

-USB v2.0 High-speed, Bluetooth v2.1

-microUSB

-Tri Band(900/1800/1900)

-FM Radio w/RDS +Recording

-SMS/MMS/EMS (OMA v1.2)

-WAP 2.0 Browser

-MP3/AAC/AAC+/EAAC+/WMA

-MicroSD Card Support

SAMSUNG Proprietary-Contents may change without notice

6. MAIN Electrical Parts List

6-1

This Document can not be used without Samsung's authorization

SEC CODE Design LOC Description

0403-001547 ZD304 DIODE-ZENER

0406-001254 ZD305 DIODE-TVS

0406-001254 ZD306 DIODE-TVS

0406-001254 ZD307 DIODE-TVS

0406-001254 ZD308 DIODE-TVS

0406-001254 ZD400 DIODE-TVS

0406-001254 ZD401 DIODE-TVS

0406-001254 ZD407 DIODE-TVS

0406-001254 ZD408 DIODE-TVS

0406-001254 ZD409 DIODE-TVS

0406-001254 ZD410 DIODE-TVS

0406-001254 ZD411 DIODE-TVS

0406-001254 ZD412 DIODE-TVS

0406-001254 ZD413 DIODE-TVS

0406-001254 ZD414 DIODE-TVS

0406-001256 U402 DIODE-TVS

0406-001256 U403 DIODE-TVS

0406-001256 U404 DIODE-TVS

0406-001261 ZD402 DIODE-TVS

0406-001267 ZD403 DIODE-TVS

0406-001286 ZD300 DIODE-TVS

0406-001293 ZD415 DIODE-TVS

0406-001369 U405 DIODE-TVS

0502-001322 Q300 TR-POWER

0505-001518 Q200 FET-SILICON

0801-003026 U302 IC-CMOS LOGIC

0801-003130 U200 IC-CMOS LOGIC

1001-001585 U400 IC-ANALOG MULTIPLEX

1108-000296 U201 IC-MCP

1201-002494 U303 IC-AUDIO AMP

1201-002932 U406 IC-AUDIO AMP

1201-002943 U101 IC-POWER AMP

1203-004604 U401 IC-DC/DC CONVERTER

1203-005562 U300 IC-POWER SUPERVISOR

1203-005852 U301 IC-MULTI REG.

1204-002924 U102 IC-TUNER

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