Samsung GT-E1172 Manuel utilisateur
GSM TELEPHONE
GT-E1172
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice
All functionality, features, specifications and o
ther product information provided in this docu
ment including, but not limited to, the benefit
s, design, pricing, components, performance,
availability, and capabiliti-es of the product
are subject to change without notice or oblig
ation. Samsung reserves the right to make
changes to this document and the product
described herein, at anytime, without
obligation on Samsung to provide notification
of such change.
SAMSUNG Proprietary-Contents may change without notice
1. Safety Precautions
1-1
This Document can not be used without Samsung's authorization
1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because the specification of cellular phone is sensitive for
surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. Otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.
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2. Specification
This Document can not be used without Samsung's authorization
2-1
2-1. GSM General Specification
GSM900
Phase 2 DCS1800
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
880~915
925~960 1710~1785
1805~1880
ARFCN range 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period 270.833kbps
3.692us 270.833kbps
3.692us
Time Slot Period/Frame
Period 576.9us
4.615ms 576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 0pcl ~15
pcl
Sensitivity -102dBm -100dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km
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Specification
2-2
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TX Power
control level GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class
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3. Operation Instruction and Installation
3-1
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Main Function
•GSM 900/1800
•1.52" CSTN
•Dual SIM socket
•SMS
•64Poly Melody
•Noise Cancellation
•FM radio support
•LED torchlight
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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
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Exploded View and Parts List
4-2
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Design LOC Discription SEC CODE
QSP01 SPEAKER 3001-002509
QCR89 SCREW-TAPPING 6002-001428
QLC01 LCD-MODULE SGHB110L GH07-01241A
QMI01 MICROPHONE-ASSY-GT-E1170 GH30-00649A
QMO01 MOTOR DC-SCH-S369 GH31-00392A
QBA01 INNER BATTERY PACK-1000MAH,BLK,ENG,EU GH43-03184A
QME01 DOME SHEET-GT-E1170 GH59-09033A
QMW02 PCT WINDOW-MAIN GH72-61708A
QMP01 A/S ASSY-PBA MAIN(INU),GT-E1172,INDA,SV GH82-05256A
QFR01 ASSY CASE-FRONT GH98-18403A
QBC00 ASSY COVER-BATT GH98-18405A
QKP01 ASSY KEYPAD-DUAL(OPEN/BLACK) GH98-18406A
QRE01 ASSY CASE-REAR GH98-18404A
QIF01 PMO COVER-IF GH72-61702A
4-2. Cellular phone Parts list
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5. MAIN Electrical Parts List
5-1
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Design LOC SEC CODE Description
D200,D201 0401-001110 DIODE
ZD200 0403-001688 DIODE-ZENER
ZD300 0406-001267 DIODE-ZENER
ZD301,ZD302 0406-001286 DIODE-ZENER
TR200 0505-002664 FET-SILICON
LED301,LED302,LED303 0601-002846 LED
LED304 0601-002846 LED
LED300 0601-002890 LED
U200 1001-001664 IC
TR100 1003-001440 TRANSISTOR
PAM100 1201-002933 PAM
U300 1203-005512 IC
U101 1203-005686 IC
U100 1204-003155 FM-IC
UCP200 1205-003923 MODEM
TH200 1404-001221 THERMISTOR
D300,D301,D302 1405-001298 DIODE
R213 2007-000138 R-CHIP
R301 2007-000139 R-CHIP
R100 2007-000140 R-CHIP
R300,R306,R312 2007-000141 R-CHIP
R104,R105 2007-000143 R-CHIP
R208 2007-000144 R-CHIP
R101,R102,R200,R202 2007-000148 R-CHIP
R108,R210,R212 2007-000151 R-CHIP
R107 2007-000162 R-CHIP
R302,R303,R304,R305 2007-000172 R-CHIP
R307,R308 2007-000172 R-CHIP
R309,R310 2007-000173 R-CHIP
R311 2007-000174 R-CHIP
R209 2007-001301 R-CHIP
R106 2007-003025 R-CHIP
R204 2007-010071 R-CHIP
C103 2203-000233 C-CERAMIC,CHIP
C317 2203-000359 C-CERAMIC,CHIP
C326 2203-000386 C-CERAMIC,CHIP
C225,C227 2203-000425 C-CERAMIC,CHIP
C309,C310,C311 2203-000585 C-CERAMIC,CHIP
C302 2203-000679 C-CERAMIC,CHIP
C106 2203-000696 C-CERAMIC,CHIP
C111,C112,C114,C228 2203-000812 C-CERAMIC,CHIP
C312,C313 2203-000812 C-CERAMIC,CHIP
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Main Electrical Parts List
5-2
This Document can not be used without Samsung's authorization
Design LOC SEC CODE Description
C219,C321,C325 2203-001153 C-CERAMIC,CHIP
C118 2203-001383 C-CERAMIC,CHIP
C116,C117 2203-001385 C-CERAMIC,CHIP
C213,C214,C229 2203-002709 C-CERAMIC,CHIP
C110 2203-005057 C-CERAMIC,CHIP
C113,C115 2203-005281 C-CERAMIC,CHIP
C224 2203-005344 C-CERAMIC,CHIP
C100,C104,C211,C212 2203-006048 C-CERAMIC,CHIP
C215,C230,C231,C301 2203-006048 C-CERAMIC,CHIP
C303,C319,C323 2203-006048 C-CERAMIC,CHIP
C203,C204,C320 2203-006208 C-CERAMIC,CHIP
C101,C102 2203-006260 C-CERAMIC,CHIP
C202,C205,C206,C207 2203-006399 C-CERAMIC,CHIP
C208,C210,C232,C315 2203-006399 C-CERAMIC,CHIP
C316 2203-006399 C-CERAMIC,CHIP
C109,C314 2203-006562 C-CERAMIC,CHIP
C200,C201,C226 2203-006824 C-CERAMIC,CHIP
C305,C306 2203-006841 C-CERAMIC,CHIP
C308 2203-007270 C-CERAMIC,CHIP
C108 2203-007279 C-CERAMIC,CHIP
C223 2203-007425 C-CERAMIC,CHIP
L106 2703-002170 INDUCTOR
L107 2703-002176 INDUCTOR
L307,L308,L309 2703-002201 INDUCTOR
L105 2703-002203 INDUCTOR
L108 2703-002204 INDUCTOR
L110,L111 2703-002208 INDUCTOR
L103 2703-002268 INDUCTOR
L201 2703-003184 INDUCTOR
L301 2703-003476 INDUCTOR
OSC201 2801-003856 OSC
OSC200 2801-004805 OSC
F100 2904-001879 FILTER
L200 3301-001158 BEAD
L302,L303,L304,L305 3301-001885 BEAD
L306 3301-001885 BEAD
L300 3301-001912 BEAD
RFS100 3705-001731 RF-SWITCH
SIM200,SIM201 3709-001627 SIM-SOCKET
IFC300 3710-002683 IF CONNECTOR
BTC200 3711-007511 BATT-CONNECTOR
SC102,SC103,SC104 GH70-06394A ONBOARD-CLIP-4
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