Samsung GT-E1170/I Manuel utilisateur
GSM TELEPHONE
GT-E1170i
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
GSM TELEPHONE CONTENTS
SAMSUNG Proprietary-Contents may change without notice
1. Safety Precautions
1-1
This Document can not be used without Samsung's authorization
1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
SAMSUNG Proprietary-Contents may change without notice
Safety Precautions
1-2
This Document can not be used without Samsung's authorization
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.
2. Specification
2-1
2-1. GSM General Specification
GSM900
Phase 1
DCS1800
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
890~889.8
935~934.8
1710~1785
1805~1880
ARFCN range 0~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 0pcl ~15
pcl
Sensitivity -102dBm -100dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km
Speclflcation
2-2
TX Power
control level
GSM900
533±3
dBm
631±3
dBm
729±3
dBm
827±3
dBm
925±3
dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class
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3. Operation Instruction and Installation
3-1
This Document can not be used without Samsung's authorization
Main Function
•GSM 900/1800
•1.52" CSTN
•SMS, MMS
•64
Poly Melody
•Noise Cancellation
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4. Exploded View and Parts List
4-1
This Document can not be used without Samsung's authorization
4-1. Cellular phone Exploded View
QFR01
QRE01
QSP01
QCR89
QLC01
QKP01
QMI01
QMP01
QMO01
QBA01
QBC00
QMW02
QIF01
QME01
SAMSUNG Proprietary-Contents may change without notice
Exploded View and Parts List
4-2
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
QSP01 SPEAKER 3001-002509
QCR89 SCREW-TAPPING 6002-001428
QMI01 MICROPHONE-ASSY-GT-E1170 GH30-00649A
QMO01 MOTOR DC-SCH-S369 GH31-00392A
QBA01 INNER BATTERY PACK-1000MAH,BLK,ENG,EU GH43-03184A
QME01 DOME SHEET-GT-E1170 GH59-09033A
QMP01 A/S ASSY-PBA MAIN(COMM)GT-E1170I,DBT,SV GH82-05497A
QLC01 ASSY LCD-MODULE ASSY(GT-E1100) GH96-03565A
QBC00 ASSY COVER-BATT GH98-16533A
QKP01 ASSY KEYPAD-(EU/BLACK) GH98-16834A
QFR01 ASSY CASE-FRONT GH98-16038A
QMW02 PCT WINDOW-MAIN GH72-57916A
QRE01 ASSY CASE-REAR GH98-16039A
QIF01 PMO COVER-IF(VE);GT-E1170,POLY URETHAN,B GH72-59961A
4-2. Cellular phone Parts list
SAMSUNG Proprietary-Contents may change without notice
5. MAIN Electrical Parts List(2010.12.28)
5-1
This Document can not be used without Samsung's authorization
Design LOC SEC CODE Description
D200,D201 0401-001110 DIODE
ZD200 0403-001688 DIODE
ZD301 0406-001286 DIODE
TR200 0505-002223 TR-SMALL SIGNAL
LED301,LED302,LED303 0601-002846 LED
LED304 0601-002846 LED
TR100 1003-001440 IC
UME200 1108-000389 IC
PAM100 1201-003190 POWER AMP
U101 1203-006203 IC
UCP200 1205-003923 IC
TH200 1404-001221 THERMISTOR
R301 2007-000139 R-CHIP
R300,R306,R312 2007-000141 R-CHIP
R208 2007-000144 R-CHIP
R200,R202 2007-000148 R-CHIP
R109 2007-000151 R-CHIP
R303,R304,R305,R307 2007-000172 R-CHIP
R308 2007-000172 R-CHIP
R309,R310 2007-000173 R-CHIP
R311 2007-000174 R-CHIP
R209 2007-001301 R-CHIP
R210 2007-001333 R-CHIP
R106 2007-003025 R-CHIP
R204 2007-008500 R-CHIP
U302 2203-000386 C-CERAMIC,CHIP
C225,C227 2203-000425 C-CERAMIC,CHIP
C107 2203-000627 C-CERAMIC,CHIP
C302 2203-000679 C-CERAMIC,CHIP
C106 2203-000696 C-CERAMIC,CHIP
C111,C112,C114,C312 2203-000812 C-CERAMIC,CHIP
C313 2203-000812 C-CERAMIC,CHIP
C220,C321,U301 2203-001153 C-CERAMIC,CHIP
C105,C110 2203-005057 C-CERAMIC,CHIP
C113,C115,C116,C117 2203-005281 C-CERAMIC,CHIP
C224 2203-005344 C-CERAMIC,CHIP
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Main Electrical Parts List
5-2
This Document can not be used without Samsung's authorization
Design LOC SEC CODE Description
C209,C210,C211,C212 2203-006048 C-CERAMIC,CHIP
C215,C229,C231,C301 2203-006048 C-CERAMIC,CHIP
C303,C319,C323 2203-006048 C-CERAMIC,CHIP
C203,C204,C226,C320 2203-006208 C-CERAMIC,CHIP
C202,C205,C206,C207 2203-006399 C-CERAMIC,CHIP
C208,C214,C315,C316 2203-006399 C-CERAMIC,CHIP
C109,C314 2203-006562 C-CERAMIC,CHIP
C200,C201 2203-006824 C-CERAMIC,CHIP
C108,C308 2203-007279 C-CERAMIC,CHIP
C223 2203-007425 C-CERAMIC,CHIP
L103 2703-001733 INDUCTOR-SMD
L100,L106 2703-002170 INDUCTOR-SMD
L107 2703-002176 INDUCTOR-SMD
L104 2703-002199 INDUCTOR-SMD
L302,L303,L304,L305 2703-002201 INDUCTOR-SMD
L306,L307,L308,L309 2703-002201 INDUCTOR-SMD
L105 2703-002203 INDUCTOR-SMD
L108 2703-002204 INDUCTOR-SMD
L201 2703-003184 INDUCTOR-SMD
OSC201 2801-004882 OSCILLATOR
OSC200 2801-005011 OSCILLATOR
F100 2904-001879 FILTER
L200 3301-001158 FILTER
RFS100 3705-001503 SWITCH-TACT
SIM200 3709-001488 CONNECTOR
IFC300 3710-002683 CONNECTOR
BTC200 3711-006808 CONNECTOR
SC102,SC103,SC104 GH70-03276A COMP-SMD
SC105,SC106,SC107 GH70-03276A COMP-SMD
SC108,SC109 GH70-03276A COMP-SMD
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.
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