Panasonic TY-FB9TU Manuel utilisateur
ORDERNO.ITD0604018CE
D10 Canada: B07
U/VTuner Board with MATE I/FBoard
TY-FB9TU
SPECIFICATIONS
Specification
Channel Capability-181 VHF-12: UHF-56: Cable-125
Connection Terminals
AV INPUT VIDEO (RCAPIN JACK TYPE) 1.0Vp-p(75 )
S VIDEO (Mini DIN 4-pin) Y: 1.0Vp-p(75 ), C: 0.286 Vp-p(75 )
AUDIO L-R (RCAPIN JACK TYPE) 0.5Vrms
AV OUTPUT Video(RCAPIN JACK TYPE) 1.0Vp-p(75 )
*Cannot output UHF/VHFsignals.
AUDIO L-R (M3JACK TYPE) 0.5Vrms
Digital interface port /
(MATE) RJ-11C
RemoteControl Model No.N2QAFB000003
Mass (weight) approx. 160 g(5.6oz) (including batteries)
Operating range approx. 7m(23 feet) directlyinfront of theunit
2006 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1
1. Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current ColdCheck
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to the chassis,
the reading shouldbe between 1M and 5.2M .
When the exposed metal does not have areturn path to the
chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1.)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1.
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current must not exceed 1/2
milliamp. Incase ameasurement isoutside of the limits specified,
there isapossibilityof ashock hazard, and the equipment should
be repaired and rechecked before itisreturned to the customer.
2. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistors and semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
3
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or comparable
conductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient to
damage an ES device).
3. About lead free solder (PbF)
Note: Leadis listedas (Pb) inthe periodic table of elements.
Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).
That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.
Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder
maybe used.
PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol
4
stampedon the back of PCB.
Caution
-Pb free solder has ahigher melting point than standard solder.
Typicallythe melting point is50 ~ 70 °F (30~40°C)higher. Please
use ahigh temperature soldering iron and set itto 700 ± 20 °F (370
± 10 °C).
-Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
Ifyou must use Pb solder, please completelyremove all of the Pb
free solder on the pins or solder area before applying Pb solder. If
thisisnot practical, be sure to heat the Pb free solder until it
melts, before applying Pb solder.
-After applying PbF solder to doublelayered boards, please check
the component side for excess solder which mayflow onto the
opposite side. (see figure below)
SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu
(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
canalsobe used.
5
4. Installation
5. Antenna connection
6
6. Connection of external equipment
7
7. Circuit Board Layout
7.1. HMB-Board
8. Block and Schematic Diagram
8.1. SchematicDiagram Notes
8
8.2. HMB-Board Block Diagram
8.3. HMB-Board (1 of 4) SchematicDiagram
8.4. HMB-Board (2 of 4) SchematicDiagram
8.5. HMB-Board (3 of 4) SchematicDiagram
8.6. HMB-Board (4 of 4) SchematicDiagram
9
9. Replacement Parts List
9.1. Replacement Parts List Notes
9.2. Electrical Replacement Parts List
10
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