Panasonic TX-PR46G10 Manuel utilisateur

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ORDER NO.PCZ0903031CE

Plasma Television

Model No. TX-PR46G10

GPF12DE C assis

A WARNING

This service information is desi ned for experienced repair technicians only and is not desi ned for use by the eneral public.

It does not contain warnin s or cautions to advise non-technical individuals of potential dan ers in attemptin to service a product.

Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service

or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.

IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by A in the Schematic

Dia rams, Circuit Board Dia rams, Exploded Views and Replacement Parts List. It is essential that these critical parts should be replaced

with manufacturer's specified parts to prevent shock, fire or other hazards. Do not modify the ori inal desi n without permission of

manufacturer.

Panasonic' © Panasonic Corporation 2009.

Unauthorized copyin and distribution is a violation

of law.

1 Safety Precautions

1.1. General Guidelines

1. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or

dama ed by the short circuit.

2. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.

4. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or

dama ed by the short circuit.

5. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.6

1.2. Touc -Current C eck

1. Plu the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measurin network for touch currents between each exposed metallic part on the set and a ood earth round

such as a water pipe, as shown in Fi ure 1.

3. Use Leaka e Current Tester (Simpson 228 or equivalent) to measure the potential across the measurin network.

4. Check each exposed metallic part, and measure the volta e at each point.

5. Reserve the AC plu in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as volta e U1 and U2, does not exceed the followin values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies reater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Measuring network for TOUCH CURRENTS

COLD

WATER PIPE

(EARTH GROUND)

Rs=

1500Q_ L Cs=

0.22|jF10kQ

-1 k 1

------

1

Ro=

----------------

J

500Q'U1 =

r= 0.022|jF (V)

JQ LjJ JUUii U1 —|— и.и^гфГ ^ V J | U2 (V)

APPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms (Q)

V: Voltmeter or oscilloscope

(r.m.s. or peak readin )

Input resistance: > 1 MQ

Input capacitance: < 200 pF

Frequency ran e: 15 Hz to 1 MHz and d.c. respectively

NOTE - Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms.

Fi ure 1

2

2 Warning

2.1. Prevention of Electrostatic Disc arge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be dama ed easily by static electricity. Such components commonly are called Elec

trostatically Sensitive (ES) Devices. Examples of typical ES devices are inte rated circuits and some field-effect transistors and

semiconductor [chip] components. The followin techniques should be used to help reduce the incidence of component dama e

caused by electrostatic dischar e (ESD).

1. Immediately before handlin any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touchin a known earth round. Alternatively, obtain and wear a commercially available dischar in ESD wrist strap,

which should be removed for potential shock reasons prior to applyin power to the unit under test.

2. After removin an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi

num foil, to prevent electrostatic char e buildup or exposure of the assembly.

3. Use only a rounded-tip solderin iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

enerate electrical char e sufficient to dama e ES devices.

5. Do not use freon-propelled chemicals. These can enerate electrical char es sufficient to dama e ES devices.

6. Do not remove a replacement ES device from its protective packa e until immediately before you are ready to install it. (Most

replacement ES devices are packa ed with leads electrically shorted to ether by conductive foam, aluminum foil or compara

ble conductive material).

7. Immediately before removin the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handlin unpacka ed replacement ES devices. (Otherwise ham less motion such as the brush

in to ether of your clothes fabric or the liftin of your foot from a carpeted floor can enerate static electricity (ESD) sufficient

to dama e an ES device).

3

Note: Lead is listed as (Pb) in t e periodic table of elements.

In t e information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

T e Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

T at is Tin (Sn), Silver (Ag) and Copper (Cu) alt oug ot er types are available.

This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd

su est the use of Pb free solder as well, althou h Pb solder may be used.

PCBs manufactured usin lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a hi her meltin point than standard solder. Typically the meltin point is 50 ~ 70 °F (30~40 °C) hi her. Please

use a hi h temperature solderin iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too hi h (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applyin Pb sol

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applyin Pb solder.

• After applyin PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see fi ure below)

component component

remove all of the ^1П\

excess solder

2.2. About lead free solder (PbF)

slice

\

solder

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+A +Cu (tin, silver, copper) solder. How

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

4

3 Service Navigation

3.1. Service Hint

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Ri ht)

C2 Data Driver (Lower Center)

A DC-DC Converter, Tuner

Speaker out, AV Terminal, AV Switch, PC

Di ital Si nal Processor, SYSTEM MPU, HDMI Switch

Peaks-AVC, Ethernet

Format Converter, Plasma AI, Sub-Field Processor

C3 Data Driver (Lower Left)

SC Scan Drive

SS Sustain Drive

SS2 Sustain out (Lower)

GL SD LED SU Scan out (Upper)

None serviceable.

SU-Board should be exchan ed for service.

K Remote receiver, Power LED, C.A.T.S sensor

S Power Switch

GK Key Switch SD Scan out (Lower)

None serviceable.

SD-Board should be exchan ed for service.

5

3.2. Applicable signals

COMPONENT (Y, PB, PR), HDMI

* Mark: Applicable input si nal for Component (Y, PB, PR) and HDMI

Si nal name COMPONENT HDMI

525 (480) / 60i * *

525 (480) / 60p * *

625 (576) / 50i * *

625 (576) / 50p * *

750 (720) / 60p * *

750 (720) / 50p * *

1,125 (1,080) / 60i * *

1,125 (1,080) / 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

1,125 (1,080) / 24p *

PC (from D-sub 15P)

Applicable input si nal for PC is basically compatible to VESA standard timin .

Si nal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 x 400 @70 Hz 31.47 70.07

640 x 480 @60 Hz 31.47 59.94

640 x 480 @75 Hz 37.50 75.00

800 x 600 @60 Hz 37.88 60.32

800 x 600 @75 Hz 46.88 75.00

800 x 600 @85 Hz 53.67 85.06

852 x 480 @60 Hz 31.44 59.89

1,024 x 768 @60 Hz 48.36 60.00

1,024 x 768 @70 Hz 56.48 70.07

1,024 x 768 @75 Hz 60.02 75.03

1,024 x 768 @85 Hz 68.68 85.00

1,280 x 768 @60 Hz 47.70 60.00

1,280 x 1,024 @60 Hz 63.98 60.02

1,366 x 768 @60 Hz 48.39 60.04

Macintosh13 inch (640 x 480) 35.00 66.67

Macintosh16 inch (832 x 624) 49.73 74.55

Macintosh21 inch (1,152 x 870) 68.68 75.06

PC (from HDMI terminal)

Applicable input si nal for PC is basically compatible to HDMI standard timin .

Si nal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 x 480 @60 Hz 31.47 60.00

750 (720) / 60p 45.00 60.00

1,125 (1,080) / 60p 67.50 60.00

Note

• Si nals other than above may not be displayed properly.

• The above si nals are reformatted for optimal viewin on your display.

• PC si nal is ma nified or compressed for display, so that it may not be possible to show fine detail with sufficient clarity.

6

4 Specifications

Power Source

Power Consumption

Power Consumption in Standby condition

Display panel

Aspect Ratio

Visible screen size

Number of pixels

Sound Speaker

Audio Output

Headp ones

PC signals

Receiving Systems / Band name

Aerial - Rear

Operating Conditions

Connection Terminals

AV1 (Scart terminal)

AV2 (Scart terminal)

AV3 VIDEO

S-VIDEO

AUDIO L - R

COMPONENT

VIDEO

AUDIO L - R

Ot ers

HDMI1 / 2 / 3

PC

Card slot

Output

AUDIO L - R

DIGITAL AUDIO OUT

Dimensions (W x H x D)

Mass

Note

AC 220-240 V, 50 / 60 Hz

485 W

0.4 W

16:9

117 cm (dia onal) 1,019 mm (W) x 573 mm (H)

2,073,600 (1,920 (W) x 1,080 (H)) [5,760 x 1,080 dots]

160 mm x 40 mm x 2 pcs, 6 Q

20 W ( 10 W + 10 W ), 10 % THD

M3 (3.5 mm) stereo mini Jack x 1

VGA, SVGA, WVGA, XGA

SXGA, W XG A

......

(compressed)

Horizontal scannin frequency 31 - 69 kHz

Vertical scannin frequency 59 - 86 Hz

PAL B, G, H, I, SECAM B, G, SECAM L, L’

VHF E2 - E12

VHF A - H (ITALY)

CATV (S01 - S05)

CATV S11 - S20 (U1

PAL D, K, SECAM D, K

VHF R1 - R2

VHF R6 - R12

PAL 525/60

M.NTSC

NTSC (AV input only)

VHF H1 - H2 (ITALY)

UHF E21 - E69

CATV S1 - S10 (M1 - M10)

U10) CATV S21 - S41 (Hyperband)

VHF R3 - R5

UHF E21 - E69

Playback of NTSC tape from some PAL Video recorders (VCR)

Playback from M. NTSC Video recorders (VCR)

Playback from NTSC Video recorders (VCR)

•T V si nals may not be received in some areas.

VHF / UHF

Temperature:

Humidity: 0 °C - 3 5 °C

20 % - 80 % RH (non-condensin )

21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, Q-Link)

21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, S-Video in, Q-Link)

RCA PIN Type x 1

Mini DIN 4-pin

RCA PIN Type x 2

Y

Pb,Pr

RCA PIN Type x 2

TYPE A Connectors

1.0 V [p-p] (75 Q)

Y:1.0 V [p-p] (75 Q) C:0.286 V [p-p] (75 Q)

0.5 V [rms]

1.0 V [p-p] (includin synchronization)

± 0.35 V [p-p]

0.5 V [rms]

HDMI™ (Version 1.3a with x.v.Colour™)

• This TV supports [HDAVI Control 4] function.

HIGH-DENSITY D-SUB 15PIN R, G, B/ 0.7 V [p-p] (75 Q)

HD, VD/TTL Level 2.0 - 5.0 V [p-p] (hi h impedance)

SD Card slot x 1

RCA PIN Type x 2 0.5 V [rms] (hi h impedance)

PCM / Dolby Di ital, Fiber optic

1.132 mm x 767 mm x 401 mm (With Pedestal)

1.132 mm x 722 mm x 106 mm (TV only)

32.0 k Net (With Pedestal)

29.0 k Net (TV only)

Desi n and Specifications are subject to chan e without notice. Mass and Dimensions shown are approximate.

Pedestal: ST-42CS3WG / ST-50CS3WG (For safety approval)

7

5 Service Mode

5.1. How to enter into Service Mode

While pressin [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.

Software version ■

Picture adjustment

----------

White balance adjustment

Option settin

-----------------

A i

-------------------------------

Service tool

SERVICE

ADJUST

WB-ADJ

OPTION

AGING

SRV-TOOL

1

Peaks SOFT *.*** OPTION 1 1c

Peaks EEP OPTION 2 ef

LSI DATA OPTION 3 01

STBY SOFT Model ID 05

STBY EEP 02203100

STBY ROMCOR 00000040

PDP SOFT RB Cn+ 000

PDP EEP

PDP FPGA

PDP PDROM

Press

[1]

Button

I Sub Item

1 1

Ia d ju s t " i '

'CONTRAST i '0000i

YMAX

5.1.1. Key command

[1] button...Main items Selection in forward direction

[2] button...Main items Selection in reverse direction

[3] button...Sub items Selection in forward direction

[4] button...Sub items Selection in reverse direction

[RED] button...All Sub items Selection in forward direction

[GREEN] button...All Sub items Selection in reverse direction

[VOL] button...Value of sub items chan e in forward direction ( + in reverse direction ( - )

8

5.1.2. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs dependin on models.

• After enterin the adjustment mode, take note of the value in each item before startin adjustment.

Main item Sub item Sample data Remark

ADJUST CONTRAST 000

COLOR 2B

TINT 00

SUB-BRT 80С

H-POS 0

H-AMP 0

V-POS 0

V-AMP 0

WB-ADJ R-CUT 80

G-CUT 80

B-CUT 80

R-DRV DD

G-DRV FC

B-DRV D5

ALL-CUT 80

ALL-DRV FC

OPTION Panel-Type 46FHD Factory

Boot ROM Preset

STBY-SET 00

EMERGENCY ON

Y/С Delay

OPT 1 00011100

OPT 2 11101111

OPT3 00000001

AGING RGBW

Vertical line

All white (COUNTER)

All white

All red

All reen

All blue

ON/OFF

Dia onal lamp W

Dia onal lamp R

Dia onal lamp G

Dia onal lamp В

1% WINDOW

COLOR BAR

A В zone/checkerd 4 trio

SCROLL BAR

2dot width border

Low setup red

Low setup reen

Low setup blue

SRV-TOOL see next

Destinations TX-PR**G10

Russia

Checksum 6644

EDID e2 2b1b0b—

5.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

9

5.2. Service tool mode

5.2.1. How to access

1. Select [SRV-TOOL] in Service Mode.

2. Press [OK] button on the remote control.

Display of TD2Microcode version —

Display of Flash ROM maker code -

Display of SOS History

---------------

SRV-TOOL

TD2Microcode:00500985

Flash ROM : 1 - 227E

PTCT : 00 . 00 . 00 . 00 . 00 Time 00000:40 On/Off 0000022 . POWER ON Time, On/Off

Press [MUTE] button (3sec)

5.2.2. Display of SOS History

SOS History (Number of LED blinkin ) indication.

From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.

This indication will be cleared by [Self-check indication and forced to factory shipment settin ].

5.2.3. POWER ON Time, On/Off

Note : To display Time, On/Off menu, hi hli ht position, then press MUTE for 3sec.

Time : Cumulative power on time, indicated hour : minute by decimal

On/Off : Number of On/Off switchin by decimal

Note : This indication will not be cleared by either of the self-checks or any other command.

5.2.4. Exit

1. Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.

10